Journal of Electronic Packaging: Recent submissions
Now showing items 601-620 of 2123
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An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials
(The American Society of Mechanical Engineers (ASME), 2013)Thermal interface materials (TIMs) are particulate composite materials widely used in the microelectronics industry to reduce the thermal resistance between the device and heat sink. Predictive modeling using fundamental ... -
Advanced Methodologies for Developing Improved Potted Smart Munitions for High G Applications
(The American Society of Mechanical Engineers (ASME), 2013)Potted electronics are becoming more common in precisionguided smart munitions designs due to the requirements for miniaturization and structuralrobustness. In most of these applications, the potted electronics are inactive ... -
Investigation of Dual Electrical Paths for Off Chip Compliant Interconnects
(The American Society of Mechanical Engineers (ASME), 2013)This paper presents a study on a dualpath compliant interconnect design which attempts to improve the balance between mechanical compliance and electrical parasitics by using multiple electrical paths in place of a single ... -
High Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices
(The American Society of Mechanical Engineers (ASME), 2013)The highly nonuniform transient power densities in modern semiconductor devices present difficult performance and reliability challenges for circuit components, multiple levels of interconnections and packaging, and adversely ... -
Inviscid and Viscous Numerical Models Compared to Experimental Data in a Small Data Center Test Cell
(The American Society of Mechanical Engineers (ASME), 2013)Both localized power densities and overall power consumption within the data center continue to rise, following the same upward trend as the information technology (IT) equipment stored within the data center. Air cooling ... -
Thermally Aware, Energy Based Load Placement in Open Aisle, Air Cooled Data Centers
(The American Society of Mechanical Engineers (ASME), 2013)This paper introduces a methodology for developing a reduced order model, using proper orthogonal decomposition (POD), to predict the IT rack's inlet temperature distribution within a raised floor aircooled data center. ... -
A Comparison of Parametric and Multivariable Optimization Techniques in a Raised Floor Data Center
(The American Society of Mechanical Engineers (ASME), 2013)It is well known that the flow distribution in data centers can be effected by a variety of parameters such as rack and computer room air conditioning (CRAC) positions, raisedfloor height, ceiling height, and percentage ... -
Two Phase Flow Control of Electronics Cooling With Pseudo CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental Evaluation
(The American Society of Mechanical Engineers (ASME), 2013)Onchip twophase cooling of parallel pseudoCPUs integrated into a liquid pumped cooling cycle is modeled and experimentally verified versus a prototype test loop. The system's dynamic operation is studied since the heat ... -
Computational and Experimental Validation of a Vortex Superposition Based Buoyancy Approximation for the COMPACT Code in Data Centers
(The American Society of Mechanical Engineers (ASME), 2013)A simplified model and GUI package, named COMPACT (Compact Model of Potential Flow and Convective Transport), has been developed in previous years to provide a fast alternative to full computational fluid dynamic (CFD) ... -
Expanded Assessment of a Practical Thermally Aware Energy Optimized Load Placement Strategy for Open Aisle, Air Cooled Data Centers
(The American Society of Mechanical Engineers (ASME), 2013)This paper expands on the work presented by Demetriou and Khalifa (Demetriou and Khalifa, 2013, “Thermally Aware, EnergyBased Load Placement in OpenAisle, AirCooled Data Centers,†ASME J. Electron. Packag., 135(3), p. ... -
Introduction for Journal of Electronic Packaging Special Section on Data Centers
(The American Society of Mechanical Engineers (ASME), 2013)As the digital factories of the information technology (IT) age, data centers are showing an unprecedented growth. From 2012 to 2016 alone, the global data center traffic is expected to increase four fold [1,21,2], requiring ... -
Rack Level Modeling of Air Flow Through Perforated Tile in a Data Center
(The American Society of Mechanical Engineers (ASME), 2013)Effective air flow distribution through perforated tiles is required to efficiently cool servers in a raised floor data center. We present detailed computational fluid dynamics (CFD) modeling of air flow through a perforated ... -
A Novel Low Cost Package for Radio Frequency Applications
(The American Society of Mechanical Engineers (ASME), 2013)Design, fabrication, and test results of a novel 3layer RF package using a commonly available high frequency laminate are presented in this paper. The developed package can be manufactured using standard multilayer printed ... -
Improved Computational Fluid Dynamics Model for Open Aisle Air Cooled Data Center Simulations
(The American Society of Mechanical Engineers (ASME), 2013)There is a need in the IT industry for CFD models that are capable of accurately predicting the thermal distributions in high power density openaisle aircooled data centers for use in the design of these facilities with ... -
Development of Accelerated Method for Thermal Cycling in Electronic Packaging Application
(The American Society of Mechanical Engineers (ASME), 2013)The method is based on a microheater integrated next to a wire bonding pad (test pad) on a test chip. It is fabricated in CMOS technology without additional micromachining. The microheater consists of two polysilicon ... -
Application of Kriging and Radial Basis Function for Reliability Optimization in Power Modules
(The American Society of Mechanical Engineers (ASME), 2013)This paper discusses the design for reliability of a wire bond structure in a power electronic module based on computational approach that integrates methods for high fidelity analysis, reduced order modeling, numerical ... -
Comparative Study of Thermal Performance of Longitudinal and Transversal Wavy Microchannel Heat Sinks for Electronic Cooling
(The American Society of Mechanical Engineers (ASME), 2013)Liquid cooling incorporating microchannels are used to cool electronic chips in order to remove more heat load. However, such microchannels are often designed to be straight with rectangular cross section. In this paper, ... -
Reliability Assessment and Activation Energy Study of Au and Pd Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging
(The American Society of Mechanical Engineers (ASME), 2013)Wearout reliability and high temperature storage life (HTSL) activation energy of Au and Pdcoated Cu (PdCu) ball bonds are useful technical information for Cu wire deployment in nanoscale semiconductor device packaging. ... -
Thermally Actuated Microswitches: Computation of Power Requirements for Alternate Heating Configurations
(The American Society of Mechanical Engineers (ASME), 2013)Steady state behavior of a thermally actuated RF MEMS switch in the open and closed positions is simulated using the governing thermal and structural equations. The switch is a bridge with a length of 250 microns, a width ... -
Study on Heat Conduction in a Simulated Multicore Processor Chip—Part II: Case Studies
(The American Society of Mechanical Engineers (ASME), 2013)The objective of this study is to understand the effects of various parameters involved in the chip design and cooling on the occurrence of hot spots on a multicore processor chip. The thermal environment for the die is ...