• Login
    View Item 
    •   DSpace Home
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   DSpace Home
    • ASME
    • Journal of Electronic Packaging
    • View Item
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Two Phase Flow Control of Electronics Cooling With Pseudo CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental Evaluation

    Thumbnail
    View/Open
    ep_135_03_030908.pdf (5.312Mb)
    Date
    2013
    Author
    Lamaison, Nicolas
    Braz Marcinichen, Jackson
    Richard Thome, John
    Metadata
    Show full item record
    Abstract
    Onchip twophase cooling of parallel pseudoCPUs integrated into a liquid pumped cooling cycle is modeled and experimentally verified versus a prototype test loop. The system's dynamic operation is studied since the heat dissipated by microprocessors is continuously changing during their operation and critical heat flux (CHF) conditions in the microevaporator must be avoided by flow control of the pump speed during heat load disturbances. The purpose here is to cool down multiple microprocessors in parallel and their auxiliary electronics (memories, dc/dc converters, etc.) to emulate datacenter servers with multiple CPUs. The dynamic simulation code was benchmarked using the test results obtained in an experimental facility consisting of a liquid pumped cooling cycle assembled in a test loop with two parallel microevaporators, which were evaluated under steadystate and transient conditions of balanced and unbalanced heat fluxes on the two pseudochips. The errors in the model's predictions of mean chip temperature and mixed exit vapor quality at steady state remained within آ±10%. Transient comparisons showed that the trends and the time constants were satisfactorily respected. A case study considering four microprocessors cooled in parallel flow was then simulated for different levels of heat flux in the microprocessors (40, 30, 20, and 10 W cm−2), which showed the robustness of the predictivecorrective solver used. For a desired mixed vapor exit quality of 30%, at an inlet pressure and subcooling of 1600 kPa and 3 K, the resulting distribution of mass flow rate in the microevaporators was, respectively, 2.6, 2.9, 4.2, and 6.4 kg h−1 (mass fluxes of 47, 53, 76 and 116 kg m−2 s−1) and yielded approximately uniform chip temperatures (maximum variation of 2.6, 2, 1.7, and 0.7 K). The vapor quality and maximum chip temperature remained below the critical limits during both transient and steadystate regimes.
    URI
    http://yetl.yabesh.ir/yetl/handle/yetl/151430
    Collections
    • Journal of Electronic Packaging

    DSpace software copyright © 2002-2015  DuraSpace
    Contact Us | Send Feedback
    Theme by 
    @mire NV
     

     

    Browse

    All of DSpaceCommunities & CollectionsBy Issue DateAuthorsTitlesSubjectsThis CollectionBy Issue DateAuthorsTitlesSubjects

    My Account

    LoginRegister

    Statistics

    View Usage Statistics

    DSpace software copyright © 2002-2015  DuraSpace
    Contact Us | Send Feedback
    Theme by 
    @mire NV