Journal of Electronic Packaging: Recent submissions
Now showing items 581-600 of 2123
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A New Accurate Closed Form Analytical Solution for Junction Temperature of High Powered Devices
(The American Society of Mechanical Engineers (ASME), 2014)The peak junction temperature has a profound effect on the operational lifetime and performance of high powered microwave devices. Although numerical analysis can help to estimate the peak junction temperature, it can be ... -
Investigation of Multiple Miniature Axial Fan Cooling Solutions and Thermal Modeling Approaches
(The American Society of Mechanical Engineers (ASME), 2014)This paper investigates the thermal and fluid dynamic characteristics due to multiple miniature axial fans with blade chord and span length scales less than 10 mm, impinging air onto finned surfaces. A coupled approach, ... -
A Compact Modeling Approach to Enhance Collaborative Design of Thermal Fluid Systems
(The American Society of Mechanical Engineers (ASME), 2014)This paper presents an approach for reducing detailed numerical models of electronic equipment into compact thermalfluid models. These compact models have been created using network analogies representing mass, momentum ... -
Analytical Solutions and a Numerical Approach for Diffusion Induced Stresses in Intermetallic Compound Layers of Solder Joints
(The American Society of Mechanical Engineers (ASME), 2014)Intermetallic compounds (IMC) play a key role in the mechanical reliability of solder joints. The present work investigates the diffusioninduced stress developed in the Cu pad/IMC/solder sandwich structure during a solidstate ... -
Comparison of Ball Pull Strength Among Various Sn Cu Ni Solder Joints With Different Pad Surface Finishes
(The American Society of Mechanical Engineers (ASME), 2014)SnCuNi is one of the most common ternary intermetallic compounds formed in the Snbased solder joint, and its formation and properties can be greatly influenced by the amount of Ni. Ni can participate in the interfacial ... -
Performance of Hybrid Fin Heat Sinks for Thermal Control of Light Emitting Diode Lighting Modules
(The American Society of Mechanical Engineers (ASME), 2014)In this paper we introduce a hybrid fin heat sink (HFH) proposed for the thermal control of light emitting diode (LED) lighting modules. The HFH consists of the array of hybrid fins which are hollow pin fins having internal ... -
A Shear Strength Degradation Model for Anisotropic Conductive Adhesive Joints Under Hygrothermal Conditions
(The American Society of Mechanical Engineers (ASME), 2013)Hygrothermal environments can degrade anisotropic conductive adhesive (ACA) joints by weakening the shear strength of adhesive interface. In this paper, the shear strength degradation model of ACA joints under hygrothermal ... -
Experimental and Modeling Studies of Looping Process for Wire Bonding
(The American Society of Mechanical Engineers (ASME), 2013)Looping is one of the key technologies for modern thermosonic wire bonders, and it has been affected by many interacting factors. In this study, the wire looping process was observed with a highspeed camera, and the evolution ... -
Investigation on Laser Direct Welding of Quad Flat Pack Components
(The American Society of Mechanical Engineers (ASME), 2013)The feasibility of laser direct welding quad flat pack (QFP) device without solder is analyzed and practiced. The relations between the tensile strength of QFP joints and laser welding parameters are investigated, and the ... -
Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method
(The American Society of Mechanical Engineers (ASME), 2013)A design of experiment (DOE) methodology based on numerical simulation is presented to improve thermal fatigue reliability of multirow quad flat nonlead (QFN) packages. In this method, the influences of material properties, ... -
Hygromechanical Analysis of Liquid Crystal Display Panels
(The American Society of Mechanical Engineers (ASME), 2013)Liquid crystal displays (LCDs) are getting larger, and the homogeneity of an LCD panel is becoming very important for the quality of the display. Inhomogeneity in an LCD panel can be caused by inhomogeneity of its materials ... -
Variable Length Link Spring Model for Kink Formation During Wire Bonding
(The American Society of Mechanical Engineers (ASME), 2013)Kinks have a strong influence on the structural performance of wire bonds. In this study, a variablelength linkspring model has been developed to better understand kink formation. In this model, a gold wire was decomposed ... -
Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode
(The American Society of Mechanical Engineers (ASME), 2013)The thermal and the optoelectronic performance of high power gallium arsenide (GaAs) laser diode dieattached with sintered silver joint were investigated. The thermal and mechanical characteristics of the Laser bar packaging ... -
Solving Thermal Issues in a Three Dimensional Stacked Quad Core Processor by Microprocessor Floor Planning, Microchannel Cooling, and Insertion of Through Silicon Vias
(The American Society of Mechanical Engineers (ASME), 2013)The electronics industry is heading toward the threedimensional (3D) microprocessor to cope with higher computing workloads. The 3D stacking of the processor and the memory components reduces the communication delay in ... -
Finite Element Analysis for Shock Resistance Evaluation of Cushion Packaged Multifunction Printer Considering Internal Modules
(The American Society of Mechanical Engineers (ASME), 2013)Failures in IT electronics are often caused by falling or external shocks during transportation. These failures cause customers to mistrust the reliability of the products. Many manufacturers of IT electronics have not ... -
3D Compact Model of Packaged Thermoelectric Coolers
(The American Society of Mechanical Engineers (ASME), 2013)Hotspots on a microelectronic package can severely hurt the performance and longterm reliability of the chip. Thermoelectric coolers (TECs) can provide sitespecific and ondemand cooling of hot spots in microprocessors. We ... -
Thermal Performance of an Al2O3–Water Nanofluid Pulsating Heat Pipe
(The American Society of Mechanical Engineers (ASME), 2013)A numerical study is performed to investigate the effects of nanofluids on the heat transfer performance of a pulsating heat pipe (PHP). Pure water is employed as the base fluid while Al2O3 with two different particle ... -
A Stepped Bar Apparatus for Thermal Resistance Measurements
(The American Society of Mechanical Engineers (ASME), 2013)A steppedbar apparatus has been designed and constructed to characterize the thermal resistance of materials using steadystate heat transfer techniques. The design of the apparatus is a modification of the ASTM D5470 ... -
Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three Layer Model
(The American Society of Mechanical Engineers (ASME), 2013)Heat conduction analysis is performed on a model system to survey the effects of geometric and thermal parameters on the temperature of an embedded heat source. A box model has the geometric characteristics of handheld ... -
Geometric Optimization of C Shaped Cavities According to Bejan's Theory: General Review and Comparative Study
(The American Society of Mechanical Engineers (ASME), 2013)The aim of this paper is to consider, by means of the numerical investigation, the geometric optimization of a cavity that intrudes into a solid with internal heat generation. The objective is to minimize the maximal ...