Journal of Electronic Packaging: Recent submissions
Now showing items 561-580 of 2123
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Heat Transfer Enhancement for Blocks in a Channel Using a Rotationally Oscillating Plate
(The American Society of Mechanical Engineers (ASME), 2014)Heat transfer enhancement using a rotationally oscillating plate in a channel containing heated blocks is numerically studied. The blocks simulate electronic chips with a high thermal dissipation rate. The model consists ... -
Porous Media Modeling of Two Phase Microchannel Cooling of Electronic Chips With Nonuniform Power Distribution
(The American Society of Mechanical Engineers (ASME), 2014)Compared to singlephase heat transfer, twophase microchannel heat sinks utilize latent heat to reduce the needed flow rate and to maintain a rather uniform temperature close to the boiling temperature. The challenge in the ... -
An Experimental Study on Heat Transfer Enhancement of Non Newtonian Fluid in a Rectangular Channel With Dimples/Protrusions
(The American Society of Mechanical Engineers (ASME), 2014)Dimple and protrusion play important roles in the heat transfer enhancement and flow characteristic in cooling channels, which widely employed within electronic cooling systems. NonNewtonian fluid has significant differences ... -
Review and Projections of Integrated Cooling Systems for Three Dimensional Integrated Circuits
(The American Society of Mechanical Engineers (ASME), 2014)In an effort to increase processor speeds, 3D IC architecture is being aggressively pursued by researchers and chip manufacturers. This architecture allows extremely high level of integration with enhanced electrical ... -
Variable Fin Density Flow Channels for Effective Cooling and Mitigation of Temperature Nonuniformity in Three Dimensional Integrated Circuits
(The American Society of Mechanical Engineers (ASME), 2014)The surface temperature of integrated circuit (IC) chips cooled with a singlephase liquid flow increases along the flow direction following the increase in the liquid temperature. Increasing the heat transfer coefficient ... -
Modeling of Two Phase Evaporative Heat Transfer in Three Dimensional Multicavity High Performance Microprocessor Chip Stacks
(The American Society of Mechanical Engineers (ASME), 2014)Threedimensional (3D) stacking of integratedcircuit (IC) dies increases system density and package functionality by vertically integrating two or more dies with areaarray throughsiliconvias (TSVs). This reduces the length ... -
Thermal Aware Microchannel Cooling of Multicore Processors: A Three Stage Design Approach
(The American Society of Mechanical Engineers (ASME), 2014)This study goes beyond the common microchannel cooling system composed of uniform parallel straight microchannels and proposed a threestage design approach for spatially thermalaware microchannel cooling of 2D multicore ... -
Thermal Performance of a Water Cooled Microchannel Heat Sink With Grooves and Obstacles
(The American Society of Mechanical Engineers (ASME), 2014)With the rapid development of microelectromechanical systems (MEMS) in IT industry, the heat flux in microchannel has reached a high level which demands preferable cooling technology. Water cooling has become a favor cooling ... -
Development of a Mini Heat Sink Model With Homogeneous Heat Transfer Capability
(The American Society of Mechanical Engineers (ASME), 2014)A model of mini heat sink with microchannels was developed to obtain homogeneous heat transfer capability. The channels are constructed in the form of eight triangular arrays based on a square substrate. Air is sucked from ... -
Thermal Management of Time Varying High Heat Flux Electronic Devices
(The American Society of Mechanical Engineers (ASME), 2014)The thermal characteristics of a laboratory pinfin microchannel heat sink were empirically obtained for heat flux, q″, in the range of 30–170 W/cm2, mass flux, m, in the range of 230–380 kg/m2 s, and an exit vapor ... -
Room Level Modeling of Air Flow in a Contained Data Center Aisle
(The American Society of Mechanical Engineers (ASME), 2014)Cold aisle containment is used in air cooled data centers to minimize direct mixing between cold and hot air. Here, we present room level air flow field investigation for open, partially and fully contained cold aisles. ... -
Intermittent Failures in Hardware and Software
(The American Society of Mechanical Engineers (ASME), 2014)Intermittent failures and no fault found (NFF) phenomena are a concern in electronic systems because of their unpredictable nature and irregular occurrence. They can impose significant costs for companies, damage the ... -
Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures
(The American Society of Mechanical Engineers (ASME), 2014)Hygroscopic and thermal expansion behavior of advanced polymers is investigated when subjected to combined high temperature and moisture conditions. An enhanced experimental–numerical hybrid procedure is proposed to ... -
Optimization of a Hybrid Double Side Jet Impingement Cooling System for High Power Light Emitting Diodes
(The American Society of Mechanical Engineers (ASME), 2014)Optimization of a hybrid doubleside jet impingement cooling system for highpower light emitting diodes (LEDs) was performed using a hybrid multiobjective evolutionary approach and threedimensional numerical analysis for ... -
Thermal Resistance Analysis of Sn Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications
(The American Society of Mechanical Engineers (ASME), 2014)To promote heat dissipation in power electronics, we investigated the thermal conduction performance of SnBi solder paste between two Cu plates. We measured the thermal resistance of SnBi solder paste used as thermal ... -
Three Dimensional and 2.5 Dimensional Interconnection Technology: State of the Art
(The American Society of Mechanical Engineers (ASME), 2014)Threedimensional (3D) packaging with throughsiliconvias (TSVs) is an emerging technology featuring smaller package size, higher interconnection density, and better performance; 2.5D packaging using silicon interposers with ... -
Special Issue on Thermodynamics, Flow, and Heat Transfer in MEMS
(The American Society of Mechanical Engineers (ASME), 2014)Microelectromechanical systems (MEMS) equipment and products have gradually penetrated into modern life due to recent advances in fabrication processes. Accompanied with the fastgrowing power consumption and increasing ... -
Heterogeneous Void Nucleation Study in Flip Chip Assembly Process Using No Flow Underfill
(The American Society of Mechanical Engineers (ASME), 2014)Noflow underfill process has exhibited a narrow feasible process window due to electrical assembly yield loss or underfill voiding. In general, the assembly yield can be improved using reflow process designed at high ... -
Thermally Conductive and Highly Electrically Resistive Grease Through Homogeneously Dispersing Liquid Metal Droplets Inside Methyl Silicone Oil
(The American Society of Mechanical Engineers (ASME), 2014)Thermal grease, as a thermal interface material (TIM), has been extensively applied in electronic packaging areas. Generally, thermal greases consist of highly thermally conductive solid fillers and matrix material that ... -
The Strength of High Temperature Ag–In Joints Produced Between Copper by Fluxless Low Temperature Processes
(The American Society of Mechanical Engineers (ASME), 2014)Two copper (Cu) substrates were bonded using silver (Ag) and indium (In) and annealed at 200–250 آ°C to convert the joints into the solid solution (Ag) for enhanced strength and ductility. Cu–Cu pair was chosen so ...