Journal of Electronic Packaging: Recent submissions
Now showing items 541-560 of 2123
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A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5
(The American Society of Mechanical Engineers (ASME), 2014)Moisture can have significant effects on the performance and reliability of electronic components. Accurately simulating moisture diffusion is important for designers and manufacturers to obtain a realistic reliability ... -
Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film Coated Copper Substrates as Heat Sink
(The American Society of Mechanical Engineers (ASME), 2014)AlN thin film was coated over Cu substrate (575 mm2) with 400 nm thickness using DC sputtering for thermal interface material (TIM) application. Aluminum Nitride (AlN)coated Cu substrate (AlN/Cu) was used as a heat sink ... -
Reviewer Acknowledgment for the Journal of Electronic Packaging
(The American Society of Mechanical Engineers (ASME), 2014)The people listed below have served as reviewers to the ASME Journal of Electronic Packaging (JEP) during the period of September 2013 through June 2014. Serving as a reviewer for the JEP is a critical service necessary ... -
Flow and Heat Transfer Analysis of an Electro Osmotic Flow Micropump for Chip Cooling
(The American Society of Mechanical Engineers (ASME), 2014)This paper reports theoretical and numerical analysis of fluid flow and heat transfer in a cascade electroosmotic flow (EOF) micropump for chip cooling. A simple analytical model is developed to determine the temperature ... -
Constructal Theory Based Geometric Optimization of Wavy Channels in the Low Reynolds Number Regime
(The American Society of Mechanical Engineers (ASME), 2014)To obtain better fluid mixing and higher heat transfer in the low Reynolds number regime, various wavy fins are employed in heat sinks (heat exchangers) for electronic cooling applications. However, it was reported in ... -
Transient Characterization of Hybrid Microfluidic Thermoelectric Cooling Scheme for Dynamic Thermal Management of Microprocessor
(The American Society of Mechanical Engineers (ASME), 2014)Power dissipated by modern microprocessors is a function of time and continuously changes with the workload, giving rise to temporal hotspots of local areas with very high power dissipation. A hybrid cooling scheme has ... -
Theoretical Analysis and Experimental Quantification of the Gas Leakage Due to Electrical Feedthroughs in Anodic Bonding
(The American Society of Mechanical Engineers (ASME), 2014)In this paper, theoretical analysis and experimental quantification of the gas leakage issue due to feedthroughs in anodic bonding are presented. The theoretical analysis was conducted to quantitatively analyze the influence ... -
Thermal Analysis and Experimental Validation of Laminar Heat Transfer and Pressure Drop in Serpentine Channel Heat Sinks for Electronic Cooling
(The American Society of Mechanical Engineers (ASME), 2014)In this paper, a thermal resistance network analytical model is proposed to investigate the thermal resistance and pressure drop in serpentine channel heat sinks with 180 deg bends. The total thermal resistance is obtained ... -
Genetic Algorithm Applied to Geometric Optimization of Isothermal Y Shaped Cavities
(The American Society of Mechanical Engineers (ASME), 2014)Constructal design associated with genetic algorithm (GA) is employed to optimize the geometry of an isothermal Yshaped cavity embedded into a solid conducting wall. The structure has four degrees of freedom (DOF). The ... -
A New Analytical Approach for Dynamic Modeling of Passive Multicomponent Cooling Systems
(The American Society of Mechanical Engineers (ASME), 2014)A new onedimensional thermal network modeling approach is proposed that can accurately predict transient/dynamic temperature distribution of passive cooling systems. The present model has applications in variety of electronic, ... -
Reliability Based Design Guidance of Three Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps
(The American Society of Mechanical Engineers (ASME), 2014)In the latest microelectronics industry, the emerging threedimensional (3D) chip stacking technique using through silicon via (TSV) enables higher integration density that allows greater numbers of interconnections in order ... -
Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components
(The American Society of Mechanical Engineers (ASME), 2014)It is essential for electronics reliability to develop effective methodologies to detect hidden solder joint defects. Active infrared thermography is an alternative to Xray detection methodologies. The limits of active ... -
Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods
(The American Society of Mechanical Engineers (ASME), 2014)Electronic packaged devices are becoming increasingly smaller in size and higher in density while requiring higher performance and superior reliability. Warpage is one of the crucial factors for the thermomechanical ... -
High Frequency and Low Temperature Thermosonic Bonding of Lead Free Microsolder Ball on Silver Pad Without Flux
(The American Society of Mechanical Engineers (ASME), 2014)Leadfree solder balls are environment friendly; however, they require a high bonding temperature, which causes problems in the microelectronics package industry. To reduce the bonding temperature, a 60 kHz highfrequency ... -
HDPE Matrix Composites Filled With Ca4La6(SiO4)4(PO4)2O2 for Microwave Substrate Applications
(The American Society of Mechanical Engineers (ASME), 2014)Polymer–ceramic composites have been prepared by dispersing Ca4La6(SiO4)4(PO4)2O2 (CLSP) ceramic filler in high density polyethylene (HDPE) matrix through melt mixing. Scanning electron micrographs reveal the extent of ... -
Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth
(The American Society of Mechanical Engineers (ASME), 2014)Reliability of conformal coatings used to mitigate tin whisker growth depends on their ability to contain tin whiskers. Two key material properties required to assess the reliability of a polyurethane coating are documented ... -
Thermal Analysis of Air Cooled Electronic Units With Integrated Offset Strip Fin Heat Sink
(The American Society of Mechanical Engineers (ASME), 2014)This short communication addresses a numerical investigation of the thermal behavior of an electronic unit. The unit consists of several parallel planes and on the top and bottom planes heat is generated by a number of ... -
Letter From the Editors
(The American Society of Mechanical Engineers (ASME), 2014)During the last ten years, it was a great pleasure working with the many outstanding AEs who served the JEP, the ASME staff, and with Mr. Gary Miller. Thanks to all of us working as a team, we were able to get the JEP to ... -
Determination of the Lumped Capacitance Parameters of Air Cooled Servers Through Air Temperature Measurements
(The American Society of Mechanical Engineers (ASME), 2014)Computer servers can be represented by lumped thermal capacitances for the purpose of simulating server and data center transient thermal response to changes in operating conditions or equipment failures. Two parameters ... -
Advances in the Fabrication Processes and Applications of Wafer Level Packaging
(The American Society of Mechanical Engineers (ASME), 2014)Fast development of wafer level packaging (WLP) in recent years is mainly owing to the advances in integrated circuit fabrication process and the market demands for devices with high electrical performance, small form ...