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    Letter From the Editors

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    ep_136_03_030201.pdf (71.83Kb)
    Date
    2014
    Author
    Sammakia, Bahgat G.
    Lee, Y. C.
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    Abstract
    During the last ten years, it was a great pleasure working with the many outstanding AEs who served the JEP, the ASME staff, and with Mr. Gary Miller. Thanks to all of us working as a team, we were able to get the JEP to significantly reduce the time to publication. We were able to increase the impact factor, and we were able to reduce the acceptance rate to below 50%. We have also established an annual Best Paper of the Year Award, Best AE of the Year Award, and Best Reviewer(s) of the Year Award. We have started a series of special issues which highlight areas of general interest to the technical community, and we endeavored to select topics that are current, interesting, and likely to attract readership, subscriptions, and contributions.
    URI
    http://yetl.yabesh.ir/yetl/handle/yetl/154471
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    • Journal of Electronic Packaging

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