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dc.contributor.authorSammakia, Bahgat G.
dc.contributor.authorLee, Y. C.
dc.date.accessioned2017-05-09T01:06:49Z
dc.date.available2017-05-09T01:06:49Z
dc.date.issued2014
dc.identifier.issn1528-9044
dc.identifier.otherep_136_03_030201.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/154471
dc.description.abstractDuring the last ten years, it was a great pleasure working with the many outstanding AEs who served the JEP, the ASME staff, and with Mr. Gary Miller. Thanks to all of us working as a team, we were able to get the JEP to significantly reduce the time to publication. We were able to increase the impact factor, and we were able to reduce the acceptance rate to below 50%. We have also established an annual Best Paper of the Year Award, Best AE of the Year Award, and Best Reviewer(s) of the Year Award. We have started a series of special issues which highlight areas of general interest to the technical community, and we endeavored to select topics that are current, interesting, and likely to attract readership, subscriptions, and contributions.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleLetter From the Editors
dc.typeJournal Paper
dc.journal.volume136
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4028063
dc.journal.fristpage30201
dc.journal.lastpage30201
dc.identifier.eissn1043-7398
dc.treeJournal of Electronic Packaging:;2014:;volume( 136 ):;issue: 003
dc.contenttypeFulltext


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