Journal of Electronic Packaging: Recent submissions
Now showing items 521-540 of 2123
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On Chip Power Generation Using Ultrathin Thermoelectric Generators
(The American Society of Mechanical Engineers (ASME), 2015)Thermoelectric generators (TEGs) can significantly improve the net power consumption and battery life of the low power mobile devices or high performance devices by generating power from their waste heat. Recent advancements ... -
Optimization of Thermoelectric Coolers for Hotspot Cooling in Three Dimensional Stacked Chips
(The American Society of Mechanical Engineers (ASME), 2015)Threedimensional (3D) chip stacking architecture is expected to reduce form factor, improve performance, and decrease power consumption in future microelectronics. High power density and nonuniform power distribution in ... -
Simplifying Reliability Testing of Wire Bonds Using On Chip Heater and Pad Resistance Method
(The American Society of Mechanical Engineers (ASME), 2015)In situ sensors can measure wire bond reliability nondestructively during thermal aging. Conventional thermal aging of ball bonds requires ovens heating the entire microchip along with the wire bonds, also affecting ... -
Thermo Electric Modeling of Nanotube Based Environmental Sensors
(The American Society of Mechanical Engineers (ASME), 2015)Freestanding electrically conductive nanotube and nanobridge structures offer a simple, smallscale, lowpower option for pressure and temperature sensing. To sense pressure, a constant voltage is applied across the bridge. ... -
Four Wire Bridge Measurements of Silicon van der Pauw Stress Sensors
(The American Society of Mechanical Engineers (ASME), 2014)Under the proper orientations and excitations, the transverse output of rotationally symmetric fourcontact van der Pauw (VDP) stress sensors depends upon only the inplane shear stress or the difference of the inplane normal ... -
Enhanced Electrical and Thermal Interconnects by the Self Assembly of Nanoparticle Necks Utilizing Capillary Bridging
(The American Society of Mechanical Engineers (ASME), 2014)This work presents enhanced composite joints that support both electrical and thermal transport in electronic packages. The joints are sequentially formed by applying a nanoparticle suspension, evaporating a solvent, ... -
Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability Under Vibration
(The American Society of Mechanical Engineers (ASME), 2014)This paper compares three prognostic algorithms applied to the same data recorded during the failure of a solder joint in ball grid array component attached to a printed circuit board. The objective is to expand on the ... -
Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density
(The American Society of Mechanical Engineers (ASME), 2014)The damage mechanisms of carbon nanotubes are considered to be the oxidation by Joule heating and migration of carbon atoms by highdensity electron flows. In this study, a high current density testing system was designed ... -
Fabrication of Anodic Aluminum Oxide Template and Copper Nanowire Surface Fastener
(The American Society of Mechanical Engineers (ASME), 2014)Throughhole anodic aluminum oxide (AAO) was fabricated by two steps anodization method. The pore diameter of the AAO was 40 nm. Cu nanowire array was prepared using the fabricated AAO as a template by electrochemical ... -
Effect of Through Silicon Via Joule Heating on Device Performance for Low Powered Mobile Applications
(The American Society of Mechanical Engineers (ASME), 2014)Threedimensional (3D) throughsiliconvia (TSV) technology is emerging as a powerful technology to reduce package footprint, decrease interconnection power, higher frequencies, and provide efficient integration of heterogeneous ... -
Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit
(The American Society of Mechanical Engineers (ASME), 2014)In 2011, IBM announced the Power 775 supercomputing node/system which, for the time, was a significant increase in computing performance and energy efficiency. The system was designed from the start with water cooling in ... -
Effective Mitigation of Shock Loads in Embedded Electronic Packaging Using Bilayered Potting Materials
(The American Society of Mechanical Engineers (ASME), 2014)Shock loads which are characterized by high intensity, short duration, and vibration at varied frequencies can lead to the failure of embedded electronics typically used to operate/control numerous devices. Failure of ... -
Advanced Natural Convection Cooling Designs for Light Emitting Diode Bulb Systems
(The American Society of Mechanical Engineers (ASME), 2014)The movement to lightemitting diode (LED) lighting systems worldwide is accelerating quickly as energy savings and reduction in hazardous materials increase in importance. Government regulations and rapidly lowering prices ... -
Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams
(The American Society of Mechanical Engineers (ASME), 2014)An experimental study is performed to characterize the effect of meniscus recession on the effective pore radius and capillary pumping of copper metal foams which are to be used as wicks in heat pipes for electronic cooling. ... -
Void Detection in Dielectric Films Using a Floating Network of Substrate Embedded Electrodes
(The American Society of Mechanical Engineers (ASME), 2014)A sensor is developed for simple, in situ characterization of dielectric thermal interface materials (TIMs) at bond line thicknesses less than 100 خ¼m. The working principle is based on the detection of regions of ... -
UCPD Model for Pb Free Solder
(The American Society of Mechanical Engineers (ASME), 2014)A unified creep plasticity damage (UCPD) model for eutectic SnPb and Pbfree solders was developed and implemented into finite element analysis codes. The new model will be described along with the relationship between the ... -
Performance Analysis of a Combination System of Concentrating Photovoltaic/Thermal Collector and Thermoelectric Generators
(The American Society of Mechanical Engineers (ASME), 2014)Thermoelectric (TE) modules utilize available temperature differences to generate electricity by the Seebeck effect. The current study investigates the merits of employing thermoelectrics to harvest additional electric ... -
Design of Thermoelectric Modules for High Heat Flux Cooling
(The American Society of Mechanical Engineers (ASME), 2014)Thermoelectric (TE) coolers work on the Seebeck effect, where an electrical current is used to drive a heat flux against a temperature gradient. They have applications for active cooling of electronic devices but have low ... -
Special Section on InterPACK 2013
(The American Society of Mechanical Engineers (ASME), 2014)InterPACK is the premier international forum for the exchange of stateoftheart knowledge in research, development, manufacturing, and applications of electronic packaging, MEMS, and NEMS. It is the flagship conference of ... -
Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors
(The American Society of Mechanical Engineers (ASME), 2014)This paper presents a strain transfer investigation for Surface Acoustic Wave (SAW) strain sensors. For evaluation, a SAW strain sensor is assembled with a pretested bond material for potentially high strain transfer on a ...