Journal of Electronic Packaging: Recent submissions
Now showing items 501-520 of 2123
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Thermal Cycling Study of Quilt Packaging
(The American Society of Mechanical Engineers (ASME), 2015)The continued progress of microelectronics often requires functionality that is spread across multiple chips. This need has led to the development of a variety of alternative chippackaging technologies that offer increased ... -
Study of Electromigration Induced Stress of Solder
(The American Society of Mechanical Engineers (ASME), 2015)This study designed and produced a special microsolder specimen (Sn3.8Ag0.7Cu) to equalize current density under stressing. The specimen was generated to avoid temperature gradient and thermal migration. The inelastic ... -
Steady State and Transient Experimentally Validated Analysis of Hybrid Data Centers
(The American Society of Mechanical Engineers (ASME), 2015)Data centers consume a considerable amount of energy which is estimated to be about 2% of the total electrical energy consumed in the U.S. in the year 2010, and this number continues to increase every year. Thermal management ... -
Self Propelled Sliding Bubble Motion Induced by Surface Microstructure in Pool Boiling of a Dielectric Fluid Under Microgravity
(The American Society of Mechanical Engineers (ASME), 2015)This paper reports bubble dynamics observed during pool boiling over microstructures with an asymmetric sawtooth cross section, under reduced gravity. The periodic sawtoothed ratchets etched on a silicon surface include ... -
A Computational and Experimental Investigation of Synthetic Jets for Cooling of Electronics
(The American Society of Mechanical Engineers (ASME), 2015)Seamless advancements in electronics industry resulted in high performance computing. These innovations lead to smaller electronics systems with higher heat fluxes than ever. However, shrinking nature of real estate for ... -
Assessment of Lumen Degradation and Remaining Life of Light Emitting Diodes Using Physics Based Indicators and Particle Filter
(The American Society of Mechanical Engineers (ASME), 2015)The development of lightemitting diode (LED) technology has resulted in widespread solid state lighting (SSL) use in consumer and industrial applications. Previous researchers have shown that LEDs from the same manufacturer ... -
Thermal Performance of Nanofluid Charged Heat Pipe With Phase Change Material for Electronics Cooling
(The American Society of Mechanical Engineers (ASME), 2015)The paper reports the thermal performance of a nanofluid (MCNT/water) charged heat pipe with phase change material (PCM) as energy storage material (ESM) for electronic cooling. The adiabatic section of heat pipe is covered ... -
Analysis of Using Ferrofluid as an Interface Material in a Field Reversible Thermal Connector
(The American Society of Mechanical Engineers (ASME), 2015)The electrical functionality of an avionics chassis is limited due to heat dissipation limits. The limits arise due to the fact that components in an avionic computer boxes are packed very compactly, with the components ... -
Improved Flow Rate in Electro Osmotic Micropumps for Combinations of Substrates and Different Liquids With and Without Nanoparticles
(The American Society of Mechanical Engineers (ASME), 2015)A new design for an electroosmotic flow (EOF) driven micropump was fabricated. Considering thermal management applications, three different types of micropumps were tested using multiple liquids. The micropumps were ... -
Stress–Strain Behavior of SAC305 at High Strain Rates
(The American Society of Mechanical Engineers (ASME), 2015)Electronic products are subjected to high Glevels during mechanical shock and vibration. Failuremodes include solderjoint failures, pad cratering, chipcracking, copper trace fracture, and underfill fillet failures. The ... -
Experimental Investigation of Air Flow Through a Perforated Tile in a Raised Floor Data Center
(The American Society of Mechanical Engineers (ASME), 2015)Raised floor data centers supply cold air from a pressurized plenum to the server racks through perforated floor tiles. Hence, the design of an efficient air delivery scheme requires better understanding of the flow features, ... -
Modeling and Experimental Study of a Wire Clamp for Wire Bonding
(The American Society of Mechanical Engineers (ASME), 2015)A wire clamp is used to grip a gold wire with in 1–2 ms during thermosonic wire bonding. Modern wire bonders require faster and larger opening wire clamps. In order to simplify the design process and find the key ... -
Two Phase Thermal Ground Planes: Technology Development and Parametric Results
(The American Society of Mechanical Engineers (ASME), 2015)Defense Advanced Research Project Agency's (DARPA's) thermal ground plane (TGP) effort was aimed at combining the advantages of vapor chambers or twodimensional (2D) heat pipes and solid conductors by building thin, high ... -
Experimental Characterization of Various Cold Aisle Containment Configurations for Data Centers
(The American Society of Mechanical Engineers (ASME), 2015)The data center industry has experienced significant growth over the last decade, mainly due to the increased use of the internet for our day to day activities such as ecommerce, social media, video streaming, and healthcare. ... -
Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation
(The American Society of Mechanical Engineers (ASME), 2015)The elastic and plastic mechanical properties of intermetallic compound (IMC) phases of a leadfree Sn3.5Ag/Cusubstrate soldering system are investigated in different sized joints using nanoindentation. The specimens were ... -
Compact Model Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three Dimensional Stacked Pin Fin Enhanced Microgap
(The American Society of Mechanical Engineers (ASME), 2015)Overcooling of electronic devices and systems results in excess energy consumption, which can be reduced by closely linking cooling requirements with actual power dissipation. A thermal modelbased flow rate controller for ... -
A New Analytical Method for Calculating Maximum Junction Temperature of Packaged Devices Incorporating the Temperature Distribution at the Base of the Substrate
(The American Society of Mechanical Engineers (ASME), 2015)All current analytical methods for calculating junction temperature of field effect transistor (FET) and monolithic microwave integrated circuits (MMIC) devices have assumed a constant uniform temperature at the base of ... -
Comparison of Electronic Component Durability Under Uniaxial and Multiaxial Random Vibrations
(The American Society of Mechanical Engineers (ASME), 2015)Multiaxial and uniaxial vibration experiments were conducted in order to study the differences in failure modes and fatigue life for the two types of excitation. An electrodynamic (ED) shaker capable of controlled vibration ... -
Fast and Accurate Evaluation of Cooling in Data Centers
(The American Society of Mechanical Engineers (ASME), 2015)Cooling is a major component in the enormous energy consumption in data centers. Accurate evaluation of cooling inside a data center forms the backbone of all the attempts for improving cooling efficiency. Models based on ... -
Effect of a Slotted Shield on Thermal and Hydraulic Performance of a Heat Sink
(The American Society of Mechanical Engineers (ASME), 2015)The attachment of a shield to a heat sink enhances the thermal performance. But, forming slots in the shield increases thermal resistance. We found that increasing the slot width enhances the flow performance over the heat ...