Journal of Electronic Packaging: Recent submissions
Now showing items 481-500 of 2123
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Liquid Jet Impingement With an Angled Confining Wall for Spent Flow Management for Power Electronics Cooling With Local Thermal Measurements
(The American Society of Mechanical Engineers (ASME), 2015)The local surface temperature, heat flux, heat transfer coefficient, and Nusselt number were measured for an inline array of circular, normal jets of singlephase, liquid water impinging on a copper block with a common ... -
Reliability Assessment of Wafer Level Packages With Novel FeNi Under Bump Metallization
(The American Society of Mechanical Engineers (ASME), 2015)FeNi alloy is considered a possible substitute for Cu as under bump metallization (UBM) in wafer level package (WLP) since it forms very thin intermetallic compound (IMC) layer with Pbfree solder in the reflow process. In ... -
Reviewers Acknowledgment for the Journal of Electronic Packaging
(The American Society of Mechanical Engineers (ASME), 2015)The people listed below have served as Reviewers to the ASME Journal of Electronic Packaging (JEP) during the period of September 2014 through June 2015. Serving as a Reviewer for the JEP is a critical service necessary ... -
Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model
(The American Society of Mechanical Engineers (ASME), 2015)Temperature rise could be a crucial issue for some electronic connectors subjected to the relative large electrical current. A nonstatistical multiscale sinusoidal rough surface (MSRS) model is adopted to estimate the ... -
Simulation of Secondary Contact to Generate Very High Accelerations
(The American Society of Mechanical Engineers (ASME), 2015)This paper investigates the design of a typical commercially available drop system for generating very high shock and drop accelerations. Some commercially available drop towers produce accelerations greater than 5000 G ... -
Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture
(The American Society of Mechanical Engineers (ASME), 2015)In this study, the reliability performance of two capillarytype underfill materials with different glass transition temperatures (Tg) and coefficients of thermal expansion (CTE) were assessed for a chip stacking architecture. ... -
Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics
(The American Society of Mechanical Engineers (ASME), 2015)Various designs of compliant interconnects are being pursued in universities and industry to accommodate the coefficient of thermal expansion (CTE) mismatch between die and substrate or substrate and board. Although such ... -
Transient Response of an Oscillating Heat Pipe by a Pulsed Heating in a High Magnetic Field Environment
(The American Society of Mechanical Engineers (ASME), 2015)An experimental investigation of a compact, triplelayer oscillating heat pipe (OHP) has been conducted to determine the fasttransient heating effect on the heat transport capability of an OHP in a high magnetic field ... -
Thermal Modeling of Microfluidic Channels for Cooling High Power Resistors on Multilayer Organic Liquid Crystal Polymer Substrate
(The American Society of Mechanical Engineers (ASME), 2015)Thermal management is an important aspect for any packaging technology incorporating high power devices. In this paper, we present an integrated microfluidic cooling solution for high power surface mount thin film resistors ... -
Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric Modules
(The American Society of Mechanical Engineers (ASME), 2015)The increasing integration of high performance processors and dense circuits in current computing devices has produced high heat flux in localized areas (hot spots), which limits their performance and reliability. To control ... -
Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead Free Solders Incorporating Special Pileup Effects Using Nanoindentation
(The American Society of Mechanical Engineers (ASME), 2015)Sn–Ag–Cu (SAC) alloys are considered as good replacements of Sn–Pb alloys which are banned due to the toxic nature of Pb. But, SAC alloys have a coarse microstructure that consists of خ²Sn rich and eutectic phases. ... -
Multiscale Transient Thermal Analysis of Microelectronics
(The American Society of Mechanical Engineers (ASME), 2015)In a microelectronic device, thermal transport needs to be simulated on scales ranging from tens of nanometers to hundreds of millimeters. High accuracy multiscale models are required to develop engineering tools for ... -
Ohmic Curing of Three Dimensional Printed Silver Interconnects for Structural Electronics
(The American Society of Mechanical Engineers (ASME), 2015)Ohmic curing was utilized as a method to improve the conductivity of threedimensional (3D) interconnects printed from silverloaded conductive inks and pastes. The goal was to increase conductivity of the conductive path ... -
Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections
(The American Society of Mechanical Engineers (ASME), 2015)Effects of crystallographic quality of grain boundaries on mechanical and electrical properties were investigated experimentally. A novel method using two parameters of image quality (IQ) and confidence index (CI) values ... -
Thermo Fluid Stress Deformation Analysis of Two Layer Microchannels for Cooling Chips With Hot Spots
(The American Society of Mechanical Engineers (ASME), 2015)Twolayer single phase flow microchannels were studied for cooling of electronic chips with a hot spot. A chip with 2.45 أ— 2.45 mm footprint and a hot spot of 0.5 أ— 0.5 mm in its center was studied in this research. ... -
Analysis of Thermal Stress and Its Influence on Carrier Mobility in Three Dimensional Microelectronic Chip Stack
(The American Society of Mechanical Engineers (ASME), 2015)A numerical assessment on the thermal stress in a threedimensional (3D) microelectronic package structure is performed. The objectives are to study how the chip stack/microbump assembly responds to thermal mismatch induced ... -
Sequential Reflow Process Optimization to Reduce Die Attach Solder Voids
(The American Society of Mechanical Engineers (ASME), 2015)Solder voids are detrimental to the thermal, mechanical, and reliability performance of integrated circuit (IC) packages and must be controlled within certain specifications. A sequential method of optimizing solderreflow ... -
Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue
(The American Society of Mechanical Engineers (ASME), 2015)The extrapolation and generalization of accelerated test results for lead free solder joints require the identification of a damage function that can be counted on to apply beyond the region of the test. Individual ball ... -
Heat Transfer and Pressure Drop Characteristics of Finned Metal Foam Heat Sinks Under Uniform Impinging Flow
(The American Society of Mechanical Engineers (ASME), 2015)A numerical investigation was carried out to characterize the thermal performance of finned metal foam heat sinks subject to an impinging air flow. The main objective of the study was to quantify the effects of all relevant ... -
Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle Containment
(The American Society of Mechanical Engineers (ASME), 2015)This paper presents the results of an experimentally validated computational fluid dynamics (CFD) model for a data center with fully implemented fan curves on both the servers and the computer room air conditioner (CRAC). ...