Journal of Electronic Packaging: Recent submissions
Now showing items 461-480 of 2123
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Lid Integral Cold Plate Topology: Integration, Performance, and Reliability
(The American Society of Mechanical Engineers (ASME), 2016)We demonstrate the lidintegral silicon coldplate topology as a way to bring liquid cooling closer to the heat source integrated circuit (IC). It allows us to eliminate one thermal interface material (TIM2), to establish ... -
Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities
(The American Society of Mechanical Engineers (ASME), 2016)A fully dynamic model of a microchannel evaporator is presented. The aim of the model is to study the highly dynamic parallel channel instabilities that occur in these evaporators in more detail. The numerical solver for ... -
Microfeature Heat Exchanger Using Variable Density Arrays for Near Isothermal Cold Plate Operation
(The American Society of Mechanical Engineers (ASME), 2016)The purpose of this paper is to demonstrate the possibility to selectively tune the convective heat transfer coefficient in different sections of a heat sink by varying the density of microfeatures in order to minimize ... -
Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead Free Solder Joints
(The American Society of Mechanical Engineers (ASME), 2016)This paper investigates the formation and the growth of the intermetallic compound (IMC) layer at the interface between the Sn3.0Ag0.5Cu Pbfree solder and the Cu substrate during isothermal aging at 150 آ°C. We measure ... -
Experimental Characterization of the Vertical and Lateral Heat Transfer in Three Dimensional Stacked Die Packages
(The American Society of Mechanical Engineers (ASME), 2016)In this paper, we present the experimental characterization of threedimensional (3D) packages using a dedicated stackable test chip. An advanced complementary metal oxide silicon (CMOS) test chip with programmable power ... -
Modeling Thermal Microspreading Resistance in Via Arrays
(The American Society of Mechanical Engineers (ASME), 2016)As thermal management techniques for threedimensional (3D) chip stacks and other highpower density electronic packages continue to evolve, interest in the thermal pathways across substrates containing a multitude of ... -
A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection
(The American Society of Mechanical Engineers (ASME), 2016)Vapor chamber technologies offer an attractive approach for passive cooling in portable electronic devices. Due to the market trends in device power consumption and thickness, vapor chamber effectiveness must be compared ... -
Analysis of ZnO Thin Film as Thermal Interface Material for High Power Light Emitting Diode Application
(The American Society of Mechanical Engineers (ASME), 2016)All solidstate lighting products produce heat which should be removed by use of a heat sink. Since the two mating surfaces of light emitting diode (LED) package and heat sink are not flat, a thermal interface material (TIM) ... -
Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate
(The American Society of Mechanical Engineers (ASME), 2015)This paper researches temporary bonding/debonding based on propylene carbonate (PPC). The highest shear strength of 4.1 MPa was achieved when pure PPC was used as bonding adhesive. Room temperature debonding methods were ... -
Natural Convection Immersion Cooling With Enhanced Optical Performance of Light Emitting Diode Systems
(The American Society of Mechanical Engineers (ASME), 2015)Electronics driven at high currents may experience local hot spots, which may cause thermal degradation or even catastrophic failures. This common problem occurs at lightemitting diode (LED) chips and it is not easily ... -
Measurement of Air Flow Rate Sensitivity to the Differential Pressure Across a Server Rack in a Data Center
(The American Society of Mechanical Engineers (ASME), 2015)Presently, air cooling is the most common method of thermal management in data centers. In a data center, multiple servers are housed in a rack, and the racks are arranged in rows to allow cold air entry from the front ... -
Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study
(The American Society of Mechanical Engineers (ASME), 2015)Currently, intermetallics (IMCs) in the solder joint are getting much attention due to their higher volume fraction in the smaller thickness interconnects. They possess different mechanical properties compared to bulk ... -
Multiple Quality Characteristics Optimization of Ball Grid Array Wire Bonding Process
(The American Society of Mechanical Engineers (ASME), 2015)This paper presents an integrated approach combining principal component analysis (PCA) and Taguchi methods to develop a ball grid array (BGA), gold (Au) wire bonding process with multiple quality characteristics optimization. ... -
Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages
(The American Society of Mechanical Engineers (ASME), 2015)Firstlevel and secondlevel compliant interconnect structures are being pursued in universities and industries to accommodate the differential displacement induced by the coefficient of thermal expansion mismatch between ... -
Nanothermal Interface Materials: Technology Review and Recent Results
(The American Society of Mechanical Engineers (ASME), 2015)Thermal interface materials (TIMs) play a critical role in conventionally packaged electronic systems and often represent the highest thermal resistance and/or least reliable element in the heat flow path from the chip to ... -
Size Compatible, Polymer Based Air Gap Formation Processes, and Polymer Residue Analysis for Wafer Level MEMS Packaging Applications
(The American Society of Mechanical Engineers (ASME), 2015)This study aims at investigating a polymerbased airgap creation method for the packaging of microelectromechanical systems (MEMS), and exploring the chemical composition of the polymer residue on the final package. ... -
A Brief Overview of Recent Developments in Thermal Management in Data Centers
(The American Society of Mechanical Engineers (ASME), 2015)Data centers are mission critical facilities that typically contain thousands of data processing equipment, such as servers, switches, and routers. In recent years, there has been a boom in data center usage, leading their ... -
A Review of Two Phase Forced Cooling in Three Dimensional Stacked Electronics: Technology Integration
(The American Society of Mechanical Engineers (ASME), 2015)Threedimensional (3D) stacked electronics present significant advantages from an electrical design perspective, ranging from shorter interconnect lengths to enabling heterogeneous integration. However, multitier stacking ... -
Double Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials
(The American Society of Mechanical Engineers (ASME), 2015)Recently, much attention has been given to reducing the thermal resistance attributed to thermal interface materials (TIMs) in electronic devices, which contribute significantly to the overall package thermal resistance. ... -
Subcooled Boiling Heat Transfer for Cooling of Power Electronics in Hybrid Electric Vehicles
(The American Society of Mechanical Engineers (ASME), 2015)At present, singlephase liquid, forced convection cooled heat sinks with fins are used to cool power electronics in hybrid electric vehicles (HEVs). Although use of fins in the cooling channels increases heat transfer rates ...