Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate

Abstract

This paper researches temporary bonding/debonding based on propylene carbonate (PPC). The highest shear strength of 4.1 MPa was achieved when pure PPC was used as bonding adhesive. Room temperature debonding methods were investigated and compared with thermal debonding. Chemical debonding at room temperature was realized for bonding with the pure PPC. Several different chemicals can be used for chemical debonding. A photo acid generator (PAG)assisted debonding method was demonstrated at room temperature when PAGloaded PPC (PAGPPC) was used as bonding adhesive. The ultraviolet (UV) radiation was used to enhance the PAGassisted debonding.