Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate

dc.contributor.author	Zhu, Zhiyuan
dc.contributor.author	Yu, Min
dc.contributor.author	Liu, Lisha
dc.contributor.author	Jin, Yufeng
dc.date.accessioned	2017-05-09T01:17:06Z
dc.date.available	2017-05-09T01:17:06Z
dc.date.issued	2015
dc.identifier.issn	1528-9044
dc.identifier.other	ep_137_04_044501.pdf
dc.identifier.uri	http://yetl.yabesh.ir/yetl/handle/yetl/157718
dc.description.abstract	This paper researches temporary bonding/debonding based on propylene carbonate (PPC). The highest shear strength of 4.1â€‰MPa was achieved when pure PPC was used as bonding adhesive. Room temperature debonding methods were investigated and compared with thermal debonding. Chemical debonding at room temperature was realized for bonding with the pure PPC. Several different chemicals can be used for chemical debonding. A photo acid generator (PAG)assisted debonding method was demonstrated at room temperature when PAGloaded PPC (PAGPPC) was used as bonding adhesive. The ultraviolet (UV) radiation was used to enhance the PAGassisted debonding.
dc.publisher	The American Society of Mechanical Engineers (ASME)
dc.title	Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate
dc.type	Journal Paper
dc.journal.volume	137
dc.journal.issue	4
dc.journal.title	Journal of Electronic Packaging
dc.identifier.doi	10.1115/1.4031750
dc.journal.fristpage	44501
dc.journal.lastpage	44501
dc.identifier.eissn	1043-7398
dc.tree	Journal of Electronic Packaging:;2015:;volume( 137 ):;issue: 004
dc.contenttype	Fulltext