Journal of Electronic Packaging: Recent submissions
Now showing items 441-460 of 2123
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Numerical and Experimental Study on the Transferred Volume in Phosphor Dip Transfer Coating Process of Light Emitting Diodes Packaging
(The American Society of Mechanical Engineers (ASME), 2016)The phosphor diptransfer coating method is simple and flexible for transferring a preanalyzed volume of phosphor gel, which can be beneficial to the high angular color uniformity (ACU) of white lightemitting diodes (LEDs). ... -
Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal Simulations
(The American Society of Mechanical Engineers (ASME), 2016)A printed circuit board (PCB) comprises a solid piece of dielectric material with embedded layers of current carrying metal traces and vias. Geometric features of these metal traces and vias in modern PCBs are highly ... -
Quantum Dots Converted Light Emitting Diodes Packaging for Lighting and Display: Status and Perspectives
(The American Society of Mechanical Engineers (ASME), 2016)Recent years, semiconductor quantum dots (QDs) have attracted tremendous attentions for their unique characteristics for solidstate lighting (SSL) and thinfilm display applications. The pure and tunable spectra of QDs make ... -
Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis
(The American Society of Mechanical Engineers (ASME), 2016)Temperature distribution is the key factor affecting the bonding quality in the glass/glass laser bonding process. In this work, the finite element method was used to establish threedimensional (3D) numerical analysis model ... -
Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study
(The American Society of Mechanical Engineers (ASME), 2016)Sintered silver joint is a porous silver that bonds a semiconductor die to the substrate as part of the packaging process. Sintered Ag is one of the few possible bonding methods to fulfill the operating conditions of wide ... -
Decomposable and Template Polymers: Fundamentals and Applications
(The American Society of Mechanical Engineers (ASME), 2016)Polymers can be used as temporary place holders in the fabrication of embedded air gaps in a variety of electronic devices. Embedded air cavities can provide the lowest dielectric constant and loss for electrical insulation, ... -
Effects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal Cycling
(The American Society of Mechanical Engineers (ASME), 2016)The behavior of leadfree solder alloys under realistic service conditions is still not well understood. Life prediction of solder joints relies on conducting accelerated tests and extrapolating results to service conditions. ... -
A Study on Electrical Reliability Criterion on Through Silicon Via Packaging
(The American Society of Mechanical Engineers (ASME), 2016)Threedimensional (3D) structure with through silicon via (TSV) technology is emerging as a key issue in microelectronic packaging industry, and electrical reliability has become one of the main technical subjects for the ... -
Stretchable Thin Film Materials: Fabrication, Application, and Mechanics
(The American Society of Mechanical Engineers (ASME), 2016)Stretchable thin film materials have promising applications in many areas, including stretchable electronics, precision metrology, optical gratings, surface engineering, packaging, energy harvesting, and storage. They are ... -
Temperature Dependent Dwell Fatigue Behavior of Nanosilver Sintered Lap Shear Joint
(The American Society of Mechanical Engineers (ASME), 2016)A series of dwellfatigue tests were conducted on nanosilver sintered lap shear joint at elevated temperatures from 125 آ°C to 325 آ°C. The effects of temperature and loading conditions on dwellfatigue behavior of ... -
Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN on SiC Semiconductor Devices
(The American Society of Mechanical Engineers (ASME), 2016)Gallium nitride (GaN) highelectronmobility transistors (HEMTs) dissipate high power densities which generate hotspots and cause thermomechanical problems. Here, we propose and simulate GaNbased HEMT technologies that can ... -
Gas–Liquid Flow Dispersion in Micro Orifices and Bubble Coalescence With High Flow Rates
(The American Society of Mechanical Engineers (ASME), 2016)The flow of microbubbles in millichannels with typical dimensions in the range of few millimeters offers a reduced pressure loss with simultaneous large specific contact surface. The transformation of pressure into kinetic ... -
Special Section on InterPACK 2015
(The American Society of Mechanical Engineers (ASME), 2016)InterPACK 2015, the flagship conference of the ASME Electronic and Photonic Packaging Division held on July 6–9, 2015 in San Francisco, CA, is the premier international forum for the exchange of stateoftheart knowledge ... -
Analytical Solution for Electronic Assemblies Under Vibration
(The American Society of Mechanical Engineers (ASME), 2016)An analytical solution using Ritz method for the electronic assembly vibration problem has been presented in detail. In this solution, a special treatment for platemountedonstandoffs boundary conditions scheme was required, ... -
Three Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications
(The American Society of Mechanical Engineers (ASME), 2016)This paper reports on novel thermal testbeds with embedded micropinfin heat sinks that were designed and microfabricated in silicon. Two micropinfin arrays were presented, each with a nominal pin height of 200 خ¼m and ... -
Influence of Secondary Impact on Printed Wiring Assemblies—Part I: High Frequency “Breathing Mode†Deformations in the Printed Wiring Board
(The American Society of Mechanical Engineers (ASME), 2016)Design rules for portable electronic device are continuously striving for thinner printed wiring assemblies (PWAs) and smaller clearances because of everincreasing demand for functionality and miniaturization. As a result, ... -
A Holistic Evaluation of Data Center Water Cooling Total Cost of Ownership
(The American Society of Mechanical Engineers (ASME), 2016)The generationtogeneration information technology (IT) performance and density demands continue to drive innovation in data center cooling technologies. For many applications, the ability to efficiently deliver cooling via ... -
Molecular Dynamics Study on Explosive Boiling of Thin Liquid Argon Film on Nanostructured Surface Under Different Wetting Conditions
(The American Society of Mechanical Engineers (ASME), 2016)Molecular dynamics (MDs) simulations have been performed to investigate the boiling phenomena of thin liquid film adsorbed on a nanostructured solid surface with particular emphasis on the effect of wetting condition of ... -
Benchmarking Study on the Thermal Management Landscape for Three Dimensional Integrated Circuits: From Back Side to Volumetric Heat Removal
(The American Society of Mechanical Engineers (ASME), 2016)An overview of the thermal management landscape with focus on heat dissipation from threedimensional (3D) chip stacks is provided in this study. Evolutionary and revolutionary topologies, such as singleside, dualside, and ... -
Durability of Low Melt Alloys as Thermal Interface Materials
(The American Society of Mechanical Engineers (ASME), 2016)This study investigates the reliability of low melt alloys (LMAs) containing gallium (Ga), indium (In), bismuth (Bi), and tin (Sn) for the application as Thermal interface materials (TIMs). The analysis described herein ...