Journal of Electronic Packaging: Recent submissions
Now showing items 421-440 of 2123
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Modular Microfluidic Filters Based on Transparent Membranes
(The American Society of Mechanical Engineers (ASME), 2016)We propose a new approach to the modular packaging of microfluidic components, in which different functional components are not only fabricated separately but are also designed to be individually removable for the purposes ... -
Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module
(The American Society of Mechanical Engineers (ASME), 2016)With the growth and acceptance of liquid immersion cooling as a viable thermal management technique for high performance microelectronics, fundamental questions regarding the nature of the flow within the system will need ... -
Modeling of a Smart Heat Pump Made of Laminated Thermoelectric and Electrocaloric Materials
(The American Society of Mechanical Engineers (ASME), 2016)In this study, a smart heat pump, which could be used for the cooling of electronics, made of laminated structure of thermoelectric (TE) and electrocaloric (EC) materials, is studied. A simple arrangement of two TE layers ... -
Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging
(The American Society of Mechanical Engineers (ASME), 2016)The sandwich structure Cu/Sn/Cu solder joints with different thicknesses of the solder layers (δ) are fabricated using a reflow solder method. The microstructure and composition of the solder joints are observed and analyzed ... -
Flow Boiling in Microgaps for Thermal Management of High Heat Flux Microsystems
(The American Society of Mechanical Engineers (ASME), 2016)In the first part of this paper, a review of fundamental experimental studies on flow boiling in plain and surface enhanced microgaps is presented. In the second part, complimentary to the literature review, new results ... -
Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
(The American Society of Mechanical Engineers (ASME), 2016)A blister testing procedure combined with a numerical procedure can be used effectively for characterizing the adhesion strength. A challenge arises when it is implemented after subjecting samples to various environmental ... -
Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response
(The American Society of Mechanical Engineers (ASME), 2016)Boardlevel physical test performance of CSP/BGA packages need in depth characterization of loading parameters and material behavioral properties. In recent years, many calibration methods were adopted by the researchers ... -
Recent Advances and New Trends in Flip Chip Technology
(The American Society of Mechanical Engineers (ASME), 2016)Recent advances in flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be presented in this study. Emphasis is placed on the latest developments of these areas in the past ... -
Numerical and Experimental Investigation of Shell and Tube Phase Change Material Thermal Energy Storage Unit
(The American Society of Mechanical Engineers (ASME), 2016)Solid liquid phasechange materials (PCMs) present a promising approach for reducing data center cooling costs. We review prior research in this area. A shellandtube PCM thermal energy storage (TES) unit is then analyzed ... -
Flexible RFID Tag Inductor Printed by Liquid Metal Ink Printer and Its Characterization
(The American Society of Mechanical Engineers (ASME), 2016)In order to fulfill various growing needs of application fields, the development of lowcost directly printable radiofrequency identification (RFID) tag is essential for item level tracking. Currently, there lacks an easily ... -
Effect of Design Parameters on Thermomechanical Stress in Silicon of Through Silicon Via
(The American Society of Mechanical Engineers (ASME), 2016)We examined the effect of the design parameters of a throughsilicon via (TSV) on the thermomechanical stress distribution at the bottom of the TSV using finite element analysis. Static analyses were carried out at 350 آ°C ... -
Thermal Response of Multi Microchannel Evaporators During Flow Boiling of Refrigerants Under Transient Heat Loads With Flow Visualization
(The American Society of Mechanical Engineers (ASME), 2016)Multimicrochannel evaporators with flow boiling, used for cooling high heat flux devices, usually experience transient heat loads in practical applications. These transient processes may cause failure of devices due to a ... -
Double Layer Microchannel Heat Sinks With Transverse Flow Configurations
(The American Society of Mechanical Engineers (ASME), 2016)The performances of various transverseflow doublelayer microchannel heat sink configurations were evaluated compared to those of parallelflow heat sink configurations via conjugate heat transfer analysis. For the analysis, ... -
Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study†[ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069]
(The American Society of Mechanical Engineers (ASME), 2016)The corresponding author is K. S. Siow. -
Reviewers Acknowledgment for the Journal of Electronic Packaging
(The American Society of Mechanical Engineers (ASME), 2016) -
Surface and Indoor Temperature Effects on User Thermal Responses to Holding a Simulated Tablet Computer
(The American Society of Mechanical Engineers (ASME), 2016)A series of experiments was conducted to investigate participant thermal responses to different surface temperatures, from 34 to 44 آ°C, for a simulated tablet computer in different ambient temperatures (13 آ°C, 23 آ°C, ... -
Use of a Gel Finger to Feel the Skin Temperatures of a Smartphone
(The American Society of Mechanical Engineers (ASME), 2016)It is important to control the skin temperatures of smartphones, tablets, and wearable electronics. The comfort levels of the skin temperatures are determined by surveys with subjective evaluations on a limited number of ... -
Modified Body Force Model for Air Flow Through Perforated Floor Tiles in Data Centers
(The American Society of Mechanical Engineers (ASME), 2016)Generally, porous jump (PJ) model is used for rapid air flow simulations (without resolving the tile pore structure) through perforated floor tiles in data centers. The PJ model only specifies a step pressure loss across ... -
Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies
(The American Society of Mechanical Engineers (ASME), 2016)Most solders used in electronic systems have lowmelting temperature and hence experience significant amount of creep deformation throughout their lifecycle because typical operational and test conditions represent high ... -
Embedded Two Phase Cooling of Large Three Dimensional Compatible Chips With Radial Channels
(The American Society of Mechanical Engineers (ASME), 2016)Thermal performance for embedded twophase cooling using dielectric coolant (R1234ze) is evaluated on a ∼20 mm أ— 20 mm large die. The test vehicles incorporate radial expanding channels with embedded pin fields suitable ...