Journal of Electronic Packaging: Recent submissions
Now showing items 401-420 of 2123
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Electroplated Connections Between Carbon Fiber and Nickel
(The American Society of Mechanical Engineers (ASME), 2017)Carbon has become an attractive material for electronic packaging applications, such as interconnects, because of its low density and reasonable electrical conductivity. One challenge in these applications is overcoming ... -
Qualitative Study of Cumulative Corrosion Damage of Information Technology Equipment in a Data Center Utilizing Air-Side Economizer Operating in Recommended and Expanded ASHRAE Envelope
(The American Society of Mechanical Engineers (ASME), 2017)Deployment of airside economizers (ASEs) in data centers is rapidly gaining acceptance to reduce cost of cooling energy by reducing hours of operation of computer room air conditioning (CRAC) units. Airside economization ... -
Assembly of Heterogeneous Materials for Biology and Electronics: From Bio-Inspiration to Bio-Integration
(The American Society of Mechanical Engineers (ASME), 2017)Specific function or application in electronics often requires assembly of heterogeneous materials in a single system. Schemes to achieve such goals are of critical importance for applications ranging from the study in ... -
Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding
(The American Society of Mechanical Engineers (ASME), 2017)In this paper, we present the design of a passive test chip with thermal test structures in the Metal 1 layer of the back-end of line (BEOL) for the experimental thermal characterization of the intertier thermal resistance ... -
Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications
(The American Society of Mechanical Engineers (ASME), 2017)Engineered porous structures are being used in many applications including aerospace, electronics, biomedical, and others. The objective of this paper is to study the effect of three-dimensional (3D)-printed porous ... -
Special Section on IMECE 2016
(The American Society of Mechanical Engineers (ASME), 2017) -
Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review
(The American Society of Mechanical Engineers (ASME), 2017)Reliability issues associated with moisture have become increasingly important as advanced electronic devices are nowhere more evident than in portable electronic products. The transition to the Pb-free solders, which ... -
Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
(The American Society of Mechanical Engineers (ASME), 2016)Heat dissipation from three-dimensional (3D) chip stacks can cause large thermal gradients due to the accumulation of dissipated heat and thermal interfaces from each integrated die. To reduce the overall thermal resistance ... -
Measurement of Air Flow Rate Through Perforated Floor Tiles in a Raised Floor Data Center
(The American Society of Mechanical Engineers (ASME), 2017)In a raised floor data center, cold air from a pressurized subfloor plenum reaches the data center room space through perforated floor tiles. Presently, commercial tool “Flow Hood” is used to measure the tile air flow rate. ... -
Modeling and Analysis for Thermal Management in Gallium Nitride HEMTs Using Microfluidic Cooling
(The American Society of Mechanical Engineers (ASME), 2017)In this paper, thermal management in GaN (gallium nitride) based microelectronic devices is addressed using microfluidic cooling. Numerical modeling is done using finite element analysis (FEA), and the results for temperature ... -
Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology
(The American Society of Mechanical Engineers (ASME), 2017)Thermal ground planes (TGPs) are passive thermal management devices that utilize the phase-change of a working fluid to achieve high thermal conductivity and low thermal resistance. TGPs are flat, two-dimensional heat ... -
Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps
(The American Society of Mechanical Engineers (ASME), 2017)As integration levels increase in next generation electronics, high power density devices become more susceptible to hotspot formation, which often imposes a thermal limitation on performance. Flow boiling of R134a in two ... -
Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management
(The American Society of Mechanical Engineers (ASME), 2017)Thermal management of very large-scale computers will have to leave the traditional well-beaten path. Up to the present time, the primary concern has been with rising heat flux on the integrated circuit chip, while a space ... -
Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument
(The American Society of Mechanical Engineers (ASME), 2017)Thermal interface materials (TIMs) constitute a critical component for heat dissipation in electronic packaging systems. However, the extent to which a conventional steady-state thermal characterization apparatus can resolve ... -
Investigation on the Optimized Binary and Ternary Gallium Alloy as Thermal Interface Materials
(The American Society of Mechanical Engineers (ASME), 2017)This work presents an experimental study to enhance the thermal contact conductance of high performance thermal interface materials (TIMs) using gallium alloy. In this experiment, the gallium alloy-based TIMs are synthesized ... -
Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance
(The American Society of Mechanical Engineers (ASME), 2017)Multi-microchannel evaporators are often used to cool down electronic devices subjected to continuous heat load variations. However, so far, rare studies have addressed the transient flow boiling local heat transfer data ... -
Optimization of a Thermoelectric Cooler for Time-Varying Heat Load and Sink Temperature
(The American Society of Mechanical Engineers (ASME), 2016)Thermoelectric coolers (TECs) are solid-state cooling devices that operate on the Seebeck effect. They can be used in electronic cooling applications as well as other refrigeration systems. Among the various factors that ... -
A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction
(The American Society of Mechanical Engineers (ASME), 2016) -
Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples
(The American Society of Mechanical Engineers (ASME), 2016) -
Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials
(The American Society of Mechanical Engineers (ASME), 2016)Thermal conductivity and interfacial thermal conductance play crucial roles in the design of engineering systems where temperature and thermal stress are of concerns. To date, a variety of measurement techniques are available ...