Journal of Electronic Packaging: Recent submissions
Now showing items 381-400 of 2123
-
The Effects of Silica Fillers on the Properties of Encapsulation Molding Compounds
(The American Society of Mechanical Engineers (ASME), 2017)Encapsulation molding compounds (EMCs) are commonly used to protect integrated circuit (IC) chips. Their composition always contains fillers of a large amount (about 70%) and will affect the properties of the compounds. ... -
Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling
(The American Society of Mechanical Engineers (ASME), 2017)The performance of a novel impinging two-phase jet heat sink operating with single and multiple jets is presented and the influence of the following parameters is quantified: (i) thermal load applied on the heat sink and ... -
Modified Constitutive Creep Laws With Micromechanical Modeling of Pb-Free Solder Alloys
(The American Society of Mechanical Engineers (ASME), 2017)This paper explicitly establishes a modified creep model of a Sn–3.8Ag–0.7Cu alloy using a physical-based micromechanical modeling technique. Through experimentation and reformulation, steady-state creep behavior is analyzed ... -
Effect of Packaging Architecture on the Optical and Thermal Performances of High-Power Light Emitting Diodes
(The American Society of Mechanical Engineers (ASME), 2017)The phosphor and die bonding configuration affect the optical efficiency and thermal performance in phosphor-coated white light emitting diodes (LEDs). In this paper, light emission studies reveal that the chromaticity ... -
Bio-Based Epoxy Resins Derived From Eugenol With Low Dielectric Constant
(The American Society of Mechanical Engineers (ASME), 2017)In this paper, a series of bio-based epoxy resins containing organic silicone were prepared from eugenol through a mild synthetic route. Then, 4,4′-diaminophenyl methane (DDM) was applied to cure these epoxy resins, and ... -
Far Back End of Line Aluminum Stress Reduction Methods for Two-Dimensional/2.5D Fine Pitch Assemblies
(The American Society of Mechanical Engineers (ASME), 2017)Fine pitch interconnects when used with two-dimensional (2D)/2.5D packaging technology offer enormous potential toward decreasing signal latency and by making it possible to package increased electrical functionality within ... -
Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator
(The American Society of Mechanical Engineers (ASME), 2017)The development of newer and more efficient cooling techniques to sustain the increasing power density of high-performance computing systems is becoming one of the major challenges in the development of microelectronics. ... -
Overview of Human Thermal Responses to Warm Surfaces of Electronic Devices
(The American Society of Mechanical Engineers (ASME), 2017)Literature was reviewed and summarized on a few topics including: existing standards about the limits of devices' surface temperature, recent studies on the devices that caused discomfort and skin damage, human thermal ... -
Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board Technologies
(The American Society of Mechanical Engineers (ASME), 2017)In recent years, light emitting diodes (LEDs) have become an attractive technology for general and automotive illumination systems replacing old-fashioned incandescent and halogen systems. LEDs are preferable for automobile ... -
A Review on Laser Processing in Electronic and MEMS Packaging
(The American Society of Mechanical Engineers (ASME), 2017)The packaging of electronic and microelectromechanical systems (MEMS) devices is an important part of the overall manufacturing process as it ensures mechanical robustness as well as required electrical/electromechanical ... -
Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections
(The American Society of Mechanical Engineers (ASME), 2017)Dominant factors of electromigration (EM) resistance of electroplated copper thin-film interconnections were investigated from the viewpoint of temperature and crystallinity of the interconnection. The EM test under the ... -
Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits
(The American Society of Mechanical Engineers (ASME), 2017)Three-dimensional integrated circuits (3D ICs) attract much interest due to several advantages over traditional microelectronics design, such as electrical performance improvement and reducing interconnect delay. While the ... -
Mechanical Testing for Stretchable Electronics
(The American Society of Mechanical Engineers (ASME), 2017)Stretchable electronics have been a subject of increased research over the past decade (Lacour, S., et al., 2006, “Mechanisms of Reversible Stretchability of Thin Metal Films on Elastomeric Substrates,” Appl. Phys. Lett., ... -
Heat Transfer in Liquid–Liquid Taylor Flow in Miniscale Curved Tubing for Constant Wall Temperature
(The American Society of Mechanical Engineers (ASME), 2017)In this paper, heat transfer enhancement using liquid–liquid Taylor flow in miniscale curved tubing for isothermal boundary conditions is examined. Copper tubing with an inner tube diameter of D = 1.65 mm and different ... -
Carrier Mobility Shift in Advanced Silicon Nodes Due to Chip-Package Interaction
(The American Society of Mechanical Engineers (ASME), 2017)Potential challenges with managing mechanical stress and the consequent effects on device performance for advanced three-dimensional (3D) integrated circuit (IC) technologies are outlined. The growing need for a simulation-based ... -
Characterization of Bulk and Thin Film Fracture in Electronic Packaging
(The American Society of Mechanical Engineers (ASME), 2017)As semiconductor packaging technologies continue to scale, it drives the use of existing and new materials in thin layer form factors. Increasing packaging complexity implies that materials in thin layers are subject to ... -
Experimental Development and Computational Optimization of Flat Heat Pipes for CubeSat Applications
(The American Society of Mechanical Engineers (ASME), 2017)Due to the compact and modular nature of CubeSats, thermal management has become a major bottleneck in system design and performance. In this study, we outline the development, initial testing, and modeling of a flat, ... -
High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method
(The American Society of Mechanical Engineers (ASME), 2017)This paper describes the use of the double cantilever beam (DCB) method for characterizing the adhesion strength of interfaces in advanced microelectronic packages at room and high temperatures. Those interfaces include ... -
Erratum: “Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks” [ASME J. Electron. Packag., 2016, 138(4), p. 041009; DOI: 10.1115/1.4034927]
(The American Society of Mechanical Engineers (ASME), 2017) -
Transient Analysis of Nonuniform Heat Input Propagation Through a Heat Sink Base
(The American Society of Mechanical Engineers (ASME), 2017)For thermal management architectures wherein the heat sink is embedded close to a dynamic heat source, nonuniformities may propagate through the heat sink base to the coolant. Available transient models predict the effective ...