Journal of Electronic Packaging: Recent submissions
Now showing items 361-380 of 2123
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Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134a
(The American Society of Mechanical Engineers (ASME), 2018)The present paper proposes a proof of concept of a completely passive thermosyphon for cooling of power electronics. This thermosyphon is composed of an evaporator to cool down a four-heater pseudo-transistor module and a ... -
Error Reduction in Infrared Thermography by Multiframe Super-Resolution
(The American Society of Mechanical Engineers (ASME), 2018)Accurate temperature measurement techniques are critical for monitoring hotspots that induce thermal stresses in electronics packages. Infrared thermography is a popular nonintrusive method for emissivity mapping and ... -
Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes
(The American Society of Mechanical Engineers (ASME), 2018)Due to its superior electrical and thermal characteristics, silicon carbide power modules will soon replace silicon modules to be mass-produced and implemented in all-electric and hybrid-electric vehicles (HEVs). Redesign ... -
Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept
(The American Society of Mechanical Engineers (ASME), 2018)A novel reliability evaluation procedure of lead-free solders used in electronic packaging (EP) subjected to thermomechanical loading is proposed. A solder ball is represented by finite elements (FEs). Major sources of ... -
Failure Analysis of Direct Liquid Cooling System in Data Centers
(The American Society of Mechanical Engineers (ASME), 2018)In this paper, the impact of direct liquid cooling (DLC) system failure on the information technology (IT) equipment is studied experimentally. The main factors that are anticipated to affect the IT equipment response ... -
Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles
(The American Society of Mechanical Engineers (ASME), 2018)This paper presents an experimentally validated room-level computational fluid dynamics (CFD) model for raised-floor data center configurations employing active tiles. Active tiles are perforated floor tiles with integrated ... -
Effectiveness of Rack-Level Fans—Part I: Energy Savings Through Consolidation
(The American Society of Mechanical Engineers (ASME), 2017)In general, smaller fans operate at lower efficiencies than larger fans of proportional linear dimensions. In this work, the applicability of replacing smaller, 60 mm baseline fans from within the chassis of web servers ... -
Embarked Quad Flat Nonlead 16, 32, and 64 Electronic Devices Subjected to Free Convection: Influence of the Adhesive Paste on the Junction Temperature
(The American Society of Mechanical Engineers (ASME), 2017)The junction temperature of the quad flat nonlead (QFN) electronic devices equipping embarked assemblies may be controlled so that it does not exceed the maximum value recommended by the manufacturer. The packaging design ... -
Effectiveness of Rack-Level Fans—Part II: Control Strategies and System Redundancy
(The American Society of Mechanical Engineers (ASME), 2017)Fan efficiency is known to increase with size. In part I of this study, savings in server fan power on the order of 50% were reported by replacing server-enclosed 60 mm fans with a rear-mounted wall of larger fans (80 mm ... -
Airflow Management on the Efficiency Index of a Container Data Center Having Overhead Air Supply
(The American Society of Mechanical Engineers (ASME), 2017)Effect of airflow managements on the efficiency index of a small container data center having overhead air supply is reported in this study. Seventeen arrangements and configurations regarding the airflow and blockage ... -
Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers
(The American Society of Mechanical Engineers (ASME), 2017)In this work, a novel ball grid array (BGA) interconnection process has been developed using solderable polymer–solder composites (SPCs) with low-melting-point alloy (LMPA) fillers to enhance the processability of the ... -
Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding
(The American Society of Mechanical Engineers (ASME), 2017)Low-temperature microjoining, such as wire (or ribbon) bonding, tape automated bonding (TAB), and flip chip bonding (FCB), is necessary for electronics packaging. Each type of microjoining takes on various aspects but has ... -
Thermal Performance and Efficiency of a Mineral Oil Immersed Server Over Varied Environmental Operating Conditions
(The American Society of Mechanical Engineers (ASME), 2017)Complete immersion of servers in dielectric mineral oil has recently become a promising technique for minimizing cooling energy consumption in data centers. However, a lack of sufficient published data and long-term ... -
Display Light Guide Swelling Due to Moisture Absorption
(The American Society of Mechanical Engineers (ASME), 2017)Display light guides, commonly constructed of a polymer such as polymethyl methacrylate (PMMA), are known to be susceptible to moisture absorption, swelling, and warping in the field when exposed to elevated ambient humidity ... -
Experimental Analysis of a Novel Piezoelectric Jetting System for Micrograms Deposition in Electronic Assemblies
(The American Society of Mechanical Engineers (ASME), 2017)Over the past ten years, there has been an exponential growth in innovations and designs to offer cutting edge electronic devices that are smaller, faster, with advanced features built in. The existence of smartphones, ... -
Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 μm Cu Microbumps
(The American Society of Mechanical Engineers (ASME), 2017)The effect of applied current in enhancing bonding was studied in Cu-to-Cu direct bonding using Cu microbumps. A daisy-chain structure of electroplated Cu microbumps (20 μm × 20 μm) was fabricated on Si wafer. Cu-to-Cu ... -
Ultraminiaturized Three-Dimensional IPAC Packages With 100 μm Thick Glass Substrates for Radio Frequency Front-End Modules
(The American Society of Mechanical Engineers (ASME), 2017)This paper presents innovative compact three-dimensional integrated passive and active components (3D IPAC) packages with ultrathin glass substrates for radio frequency (RF) long-term evolution (LTE) front-end modules ... -
Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages
(The American Society of Mechanical Engineers (ASME), 2017)Overhang and/or pyramid stacked packages are the trend in the semiconductor industry. As the stacked layers increase drastically, the wire sweep and wire sag problems become more and more serious. Based on some types of ... -
Determination of Energy Release Rate Through Sequential Crack Extension
(The American Society of Mechanical Engineers (ASME), 2017)A method to determine the critical energy release rate of a peel tested sample using an energy-based approach within a finite element framework is developed. The method uses a single finite element model, in which the ... -
Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components
(The American Society of Mechanical Engineers (ASME), 2017)Portable electronic devices are commonly exposed to shock and impact loading due to accidental drops. After external impact, internal collisions (termed “secondary impacts” in this study) between vibrating adjacent ...