Journal of Electronic Packaging: Recent submissions
Now showing items 341-360 of 2123
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Special Section on InterPACK 2017—Part 2
(The American Society of Mechanical Engineers (ASME), 2018) -
Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective
(The American Society of Mechanical Engineers (ASME), 2018)This paper intends to address an important gap between reliability standards and the physics of how components respond to real use conditions using a knowledge-based qualification (KBQ) process. Bridging the gap is essential ... -
Lead-Free Alternatives for Interconnects in High-Temperature Electronics
(The American Society of Mechanical Engineers (ASME), 2018)Predominant high melting point solders for high-temperature and harsh environment electronics (operating temperatures from 200 to 250 °C) are Pb-based systems, which are being subjected to RoHS regulations because of their ... -
Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers
(The American Society of Mechanical Engineers (ASME), 2018)The increasing heat densities in electronic components and focus on energy efficiency have motivated utilization of embedded two-phase cooling, which reduces system-level thermal resistance and pumping power. To achieve ... -
Fabrication of Multimeasurand Sensor for Monitoring of a Li-Ion Battery
(The American Society of Mechanical Engineers (ASME), 2018)This paper details the fabrication and testing of a combined temperature and expansion sensor to improve state of charge (SOC) and state of health (SOH) estimation for Li-ion batteries. These sensors enable the characterization ... -
Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis
(The American Society of Mechanical Engineers (ASME), 2018)Gravity-driven two-phase liquid cooling systems using flow boiling within microscale evaporators are becoming a game-changing solution for electronics cooling. The optimization of the system's filling ratio (FR) can however ... -
Enhanced Heat Transfer Using Microporous Copper Inverse Opals
(The American Society of Mechanical Engineers (ASME), 2018)Enhanced boiling is one of the popular cooling schemes in thermal management due to its superior heat transfer characteristics. This study demonstrates the ability of copper inverse opal (CIO) porous structures to enhance ... -
Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop
(The American Society of Mechanical Engineers (ASME), 2018)Three-dimensional (3D) stacked integrated circuit (IC) chips offer significant performance improvement, but offer important challenges for thermal management including, for the case of microfluidic cooling, constraints on ... -
Impact of Tile Design on the Thermal Performance of Open and Enclosed Aisles
(The American Society of Mechanical Engineers (ASME), 2018)In raised floor data centers, tiles with high open area ratio or complex understructure are used to fulfill the demand of today's high-density computing. Using more open tiles reduces the pressure drop across the raised ... -
Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode Conjecture
(The American Society of Mechanical Engineers (ASME), 2018)The conjecture discussed in our previous paper [Jaeger, R. C., Motalab, M., Hussain, S., and Suhling, J. C., 2014, “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors,” ASME J. Electron. Packag., 136(4), ... -
Edge Trimming Induced Defects on Direct Bonded Wafers
(The American Society of Mechanical Engineers (ASME), 2018)The diamond abrasive process which is applied onto the silicon wafer edge, the so called “edge trimming,” is an important step in three-dimensional microelectronics processing technology, due to the significant thickness ... -
Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors
(The American Society of Mechanical Engineers (ASME), 2018)Improvements in turbine design methods have resulted in the development of blade profiles with both high lift and good Reynolds lapse characteristics. An increase in aerodynamic loading of blades in the low-pressure turbine ... -
Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips
(The American Society of Mechanical Engineers (ASME), 2018)Large thermal gradients represent major operational hazards in microprocessors; hence, there is a critical need to monitor possible hot spots both accurately and in real time. Thermal monitoring in microprocessors is ... -
Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermomechanical Simulation
(The American Society of Mechanical Engineers (ASME), 2018)Transient liquid phase sintering (TLPS) is a novel high-temperature attach technology. It is of particular interest for application as die attach in power electronic systems because of its high-melting temperature and high ... -
Regional Stiffness Reduction Using Lamina Emergent Torsional Joints for Flexible Printed Circuit Board Design
(The American Society of Mechanical Engineers (ASME), 2018)Flexible printed circuit boards (PCBs) make it possible for engineers to design devices that use space efficiently and can undergo changes in shape and configuration. However, they also suffer from tradeoffs due to nonideal ... -
Peel-and-Stick Sensors Powered by Directed Radio-Frequency Energy
(The American Society of Mechanical Engineers (ASME), 2018)PARC, a Xerox Company, is developing a low-cost system of peel-and-stick wireless sensors that will enable widespread building environmental sensor deployment with the potential to deliver up to 30% energy savings. The ... -
Challenges in Three-Dimensional Printing of High-Conductivity Copper
(The American Society of Mechanical Engineers (ASME), 2018)With recent advancements in additive manufacturing (AM) technology, it is possible to deposit copper conductive paths and insulation layers of an electric machine in a selective controlled manner. AM of copper enables ... -
Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon Structures
(The American Society of Mechanical Engineers (ASME), 2018)The fatigue characteristics of microelectromechanical systems (MEMS) material, such as silicon or polysilicon, have become very important. Many studies have focused on this topic, but none have defined a good methodology ... -
Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics
(The American Society of Mechanical Engineers (ASME), 2018)In this work, the elastic–plastic properties of the printed interconnects on a glass substrate with Ag-filled polymer-conductor ink are evaluated through a theoretical framework based on finite element (FE) modeling of ... -
Thermal Metamaterials for Heat Flow Control in Electronics
(The American Society of Mechanical Engineers (ASME), 2018)Rapid advancement of modern electronics has pushed the limits of traditional thermal management techniques. Novel approaches to the manipulation of the flow of heat in electronic systems have potential to open new design ...