Journal of Electronic Packaging: Recent submissions
Now showing items 321-340 of 2123
-
Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network
(The American Society of Mechanical Engineers (ASME), 2018)The design of three-dimensional (3D) power delivery network (PDN) is constrained by both power and thermal integrity. Through-silicon via (TSV) as an important part of transmission power and heat in stack, the rational ... -
Reviewer's Recognition
(The American Society of Mechanical Engineers (ASME), 2018) -
Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components
(The American Society of Mechanical Engineers (ASME), 2018)In recent years, due to the increased size of ball grid array (BGA) devices, the assembly of BGAs on printed circuit boards through surface mount technology has encountered unprecedented challenges from thermal warpage. ... -
A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices
(The American Society of Mechanical Engineers (ASME), 2018)As silicon carbide (SiC) power semiconductor devices continue to mature for market adoption, innovative power electronics packaging designs and materials are needed. Wire-bonding loop is one of the limiting factors in ... -
Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density
(The American Society of Mechanical Engineers (ASME), 2018)We have investigated a novel hybrid nanocomposite thermal interface material (TIM) that consists of silver nanoparticles (AgNPs), silver nanoflakes (AgNFs), and copper microparticles (CuMPs). Continuous metallic network ... -
Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding
(The American Society of Mechanical Engineers (ASME), 2018)The incorporation of a micro copper pillar is considered as the major interconnection method in three-dimensional (3D) integrated circuit (IC) intergradation under high-density I/O conditions. To achieve low-temperature ... -
A Further Study on the Analytical Model for the Permeability in Flip-Chip Packaging
(The American Society of Mechanical Engineers (ASME), 2018)The notion of permeability is very important in understanding and modeling the flow behavior of fluids in a special type of porous medium (i.e., the underfill flow in flip-chip packaging). This paper presents a new concept ... -
Gold-Tin Solder Wetting Behavior for Package Lid Seals
(The American Society of Mechanical Engineers (ASME), 2018)This study examined the cause of nonwetted regions of the gold (Au) finish on iron-nickel (Fe–Ni) alloy lids that seal ceramic packages using the 80Au-20Sn solder (wt %, abbreviated Au–Sn) and their impact on the final ... -
Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model
(The American Society of Mechanical Engineers (ASME), 2018)Particulate thermal interface materials (TIMs) are commonly used to transport heat from chip to heat sink. While high thermal conductance is achieved by large volume loadings of highly conducting particles in a compliant ... -
Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies
(The American Society of Mechanical Engineers (ASME), 2018)This study mainly focuses on site effects of the Ni pad interface on intermetallic compounds (IMCs) characteristic during assembly reflowing, and attempts to provide a reasonable explanation for this particular finding. ... -
Ripening Growth Kinetics of Cu6Sn5 Grains in Sn-3.0Ag-0.5Cu-xTiO2/Cu Solder Joints During the Reflow Process
(The American Society of Mechanical Engineers (ASME), 2018)The ripening growth kinetics of interfacial Cu6Sn5 grains between Cu substrates and Sn-3.0Ag-0.5Cu-xTiO2 (x = 0, 0.02, 0.05, 0.1, 0.3, and 0.6 wt %) (SAC305-xTiO2) solders were investigated. The results show that the Cu6Sn5 ... -
Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint
(The American Society of Mechanical Engineers (ASME), 2018)Solder joints in electronic assemblies are subjected to mechanical and thermal cycling. These cyclic loadings lead to the fatigue failure of solder joints involving damage accumulation, crack initiation, crack propagation, ... -
Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking
(The American Society of Mechanical Engineers (ASME), 2018)In this work, a sinusoidal vibration test method with resonance tracking is employed for reliability testing of circuit assemblies. The system continuously monitors for changes in the resonant frequency of the circuit board ... -
Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging
(The American Society of Mechanical Engineers (ASME), 2018)Due to low cost and good electrical performance, wafer-level chip scale packaging (WLCSP) has gained more attention in both industry and academia. However, because the coefficient of thermal expansion (CTE) mismatches ... -
Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor Approach
(The American Society of Mechanical Engineers (ASME), 2018)The aim of this paper is to model moisture ingress into a closed electronic enclosure under isothermal and non-isothermal conditions. As a consequence, an in-house code for moisture transport is developed using the ... -
Technological Advances to Maximize Solar Collector Energy Output: A Review
(The American Society of Mechanical Engineers (ASME), 2018)Since it is highly correlated with quality of life, the demand for energy continues to increase as the global population grows and modernizes. Although there has been significant impetus to move away from reliance on fossil ... -
Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches
(The American Society of Mechanical Engineers (ASME), 2018)The revolutionary changes in automotive industry toward fully connected automated electrical vehicles necessitate developments in automotive electronics at unprecedented speed. Signal, control, and power electronics will ... -
Reactive Joining of Thermally and Mechanically Sensitive Materials
(The American Society of Mechanical Engineers (ASME), 2018)Reactive joining, i.e., utilization of an exothermal reaction to locally generate the heat required for soldering or brazing, represents an emerging technology for flexible and benign joining of heat-sensitive materials, ... -
Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review
(The American Society of Mechanical Engineers (ASME), 2018)Arguably, the integrated circuit (IC) industry has received robust scientific and technological attention due to the ultra-small and extremely fast transistors since past four decades that consents to Moore's law. The ... -
Special Section on InterPACK 2017—Part 1
(The American Society of Mechanical Engineers (ASME), 2018)