Journal of Electronic Packaging: Recent submissions
Now showing items 301-320 of 2123
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Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure
(The American Society of Mechanical Engineers (ASME), 2019)White light-emitting diodes (WLEDs) composed of blue LED chip, yellow phosphor, and red quantum dots (QDs) are considered as a potential alternative for next-generation artificial light source with their high luminous ... -
Numerical Study on Mitigation of Flow Maldistribution in Parallel Microchannel Heat Sink: Channels Variable Width Versus Variable Height Approach
(The American Society of Mechanical Engineers (ASME), 2019)Microchannel heat sink on one hand enjoys benefits of intensified several folds heat transfer performance but on the other hand has to suffer aggravated form of trifling limitations associated with imperfect hydrodynamics ... -
Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect
(The American Society of Mechanical Engineers (ASME), 2019)A critical current density, a criterion of electromigration (EM) resistance in interconnects, above which EM damages initiate has been studied to minimize EM damages of interconnects. In general, the assessment of a critical ... -
Phenomenological Modeling of Carpeted Surface for Drop Simulation of Portable Electronics
(The American Society of Mechanical Engineers (ASME), 2019)Using finite element (FE) analysis to simulate drop impact is widely adopted by the consumer electronics industry in the design process of portable devices. Most of such simulations model impact surface as a rigid or simple ... -
Reliability Considerations for Oil Immersion-Cooled Data Centers
(The American Society of Mechanical Engineers (ASME), 2019)The improved efficiency of mineral oil may offer simplicity in facility design compared to traditional air cooling and provide a means for cost savings. Despite its improved cooling efficiency and cost savings, a mineral ... -
Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques
(The American Society of Mechanical Engineers (ASME), 2019)Power electronic components' reliability depends, to a great extent, on the quality of die-attach technology. The voids appearance in the die-attach regions is almost unavoidable during the manufacturing process. The aim ... -
Design of Thermal Ground Planes for Cooling of Foldable Smartphones
(The American Society of Mechanical Engineers (ASME), 2019)Foldable smartphones are expected to be widely commercialized in the near future. Thermal ground plane (TGP), known as vapor chamber or two-dimensional flat heat pipe, is a promising solution for the thermal management of ... -
Liquid Cooling of Compute System
(The American Society of Mechanical Engineers (ASME), 2019)The continued demand for increasing compute performance results in an increasing system power and power density of many computers. The increased power requires more efficient cooling solutions than traditionally used air ... -
Mechanical Characterization of Thermal Interface Materials and Its Challenges
(The American Society of Mechanical Engineers (ASME), 2019)Thermal interface materials (TIMs) play a vital role in the performance of electronic packages by enabling improved heat dissipation. These materials typically have high thermal conductivity and are designed to offer a ... -
Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms
(The American Society of Mechanical Engineers (ASME), 2019)The demands for both thinner bare-die ball grid array (BGA) packages and thinner thermal solutions have added complexity for the thermal enabling design and material options associated with system on chip packages in mobile ... -
Special Section of Review Articles From Intel Corporation
(The American Society of Mechanical Engineers (ASME), 2019) -
Simultaneous Optimization of an Array of Heat Sinks
(The American Society of Mechanical Engineers (ASME), 2019)We provide an algorithm to optimize the geometry of the fins in an array of longitudinal-fin heat sinks (HSs) in, e.g., a blade server, which is a prohibitively long task using computational fluid dynamics (CFD). First, ... -
Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications
(The American Society of Mechanical Engineers (ASME), 2019)GaN-based high-power wide-bandgap semiconductor electronics and photonics have been considered as promising candidates to replace conventional devices for automotive applications due to high energy conversion efficiency, ... -
Reviewer's Recognition
(The American Society of Mechanical Engineers (ASME), 2019) -
Characterization of Hybrid Wicking Structures for Flexible Vapor Chambers
(The American Society of Mechanical Engineers (ASME), 2019)Thin vapor chambers provide a novel solution to thermal management in mobile electronics. In the pursuit of vapor chamber optimization, characterization of the wicking structure can allow for a better understanding of the ... -
Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition
(The American Society of Mechanical Engineers (ASME), 2019)Long bonding wires may swing significantly and touch with adjacent ones, which will result in short circuit under mechanical condition, especially in aerospace applications. This may seriously affect the operational ... -
Study on BEOL Failures in a Chip by Shear Tests of Copper Pillar Bumps
(The American Society of Mechanical Engineers (ASME), 2019)A chip with 40 nm technology node and beyond generally incorporates low-k/ultra-low-k (LK/ULK) dielectric materials and copper traces in the back end of line (BEOL) to improve its electrical performance. Owing to the fragile ... -
Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects
(The American Society of Mechanical Engineers (ASME), 2019)The high current densities in today's microelectronic devices and microchips lead to hotspot formations and other adverse effects on their performance. Therefore, a computational tool is needed to not only analyze but also ... -
Study on Heat Transfer and Corrosion Resistance of Anodized Aluminum Alloy in Gallium-Based Liquid Metal
(The American Society of Mechanical Engineers (ASME), 2019)Gallium-based liquid metal (LM) inherits excellent thermophysical properties and pollution-free characteristics. However, it has long been a fatal problem that LM would cause serious corrosion and embrittlement on the ... -
Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack Retention
(The American Society of Mechanical Engineers (ASME), 2019)For more than a decade, land grid array (LGA) has been one of the main central processor unit (CPU) packages developed at Intel and AMD, and widely used in different computer systems. LGA loading mechanism has become more ...