Journal of Electronic Packaging: Recent submissions
Now showing items 281-300 of 2123
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Numerical Study on Mitigation of Flow Maldistribution in Parallel Microchannel Heat Sink: Channels Variable Width Versus Variable Height Approach
(American Society of Mechanical Engineers (ASME), 2019)Microchannel heat sink on one hand enjoys benefits of intensified several folds heat transfer performance but on the other hand has to suffer aggravated form of trifling limitations associated with imperfect hydrodynamics ... -
Enhanced Sintered Silver for SiC Wide Bandgap Power Electronics Integrated Package Module
(American Society of Mechanical Engineers (ASME), 2019)Thermal interface materials (TIMs) are crucial elements for packaging of power electronics. In particular, development of high-temperature lead-free die-attach TIMs for silicon carbide wide bandgap power electronics is a ... -
Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design
(American Society of Mechanical Engineers (ASME), 2019)There are various designs for segregating hot and cold air in data centers such as cold aisle containment (CAC), hot aisle containment (HAC), and chimney exhaust rack. These containment systems have different characteristics ... -
Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure
(American Society of Mechanical Engineers (ASME), 2019)White light-emitting diodes (WLEDs) composed of blue LED chip, yellow phosphor, and red quantum dots (QDs) are considered as a potential alternative for next-generation artificial light source with their high luminous ... -
Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging
(American Society of Mechanical Engineers (ASME), 2019)In this study, we realized a cylindrical tuber silicone layer for improving the light efficiency of chip-on-board light-emitting diodes (COB-LEDs) by fabricating patterned LED substrate with both silicone-wetting and ... -
Reliability Considerations for Oil Immersion-Cooled Data Centers
(American Society of Mechanical Engineers (ASME), 2019)The improved efficiency of mineral oil may offer simplicity in facility design compared to traditional air cooling and provide a means for cost savings. Despite its improved cooling efficiency and cost savings, a mineral ... -
Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect
(American Society of Mechanical Engineers (ASME), 2019)A critical current density, a criterion of electromigration (EM) resistance in interconnects, above which EM damages initiate has been studied to minimize EM damages of interconnects. In general, the assessment of a critical ... -
Phenomenological Modeling of Carpeted Surface for Drop Simulation of Portable Electronics
(American Society of Mechanical Engineers (ASME), 2019)Using finite element (FE) analysis to simulate drop impact is widely adopted by the consumer electronics industry in the design process of portable devices. Most of such simulations model impact surface as a rigid or simple ... -
Special Section of Review Articles From Intel Corporation
(American Society of Mechanical Engineers (ASME), 2019) -
Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques
(American Society of Mechanical Engineers (ASME), 2019)Power electronic components' reliability depends, to a great extent, on the quality of die-attach technology. The voids appearance in the die-attach regions is almost unavoidable during the manufacturing process. The aim ... -
Liquid Cooling of Compute System
(American Society of Mechanical Engineers (ASME), 2019)The continued demand for increasing compute performance results in an increasing system power and power density of many computers. The increased power requires more efficient cooling solutions than traditionally used air ... -
Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms
(American Society of Mechanical Engineers (ASME), 2019)The demands for both thinner bare-die ball grid array (BGA) packages and thinner thermal solutions have added complexity for the thermal enabling design and material options associated with system on chip packages in mobile ... -
Mechanical Characterization of Thermal Interface Materials and Its Challenges
(American Society of Mechanical Engineers (ASME), 2019)Thermal interface materials (TIMs) play a vital role in the performance of electronic packages by enabling improved heat dissipation. These materials typically have high thermal conductivity and are designed to offer a ... -
Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers
(American Society of Mechanical Engineers (ASME), 2019)Data center energy usage keeps growing every year and will continue to increase with rising demand for ecommerce, scientific research, social networking, and use of streaming video services. The miniaturization of ... -
Thermal Control Strategies for Reliable and Energy-Efficient Data Centers
(American Society of Mechanical Engineers (ASME), 2019)Two self-developed control schemes, ON/OFF and supervisory control and data acquisition (SCADA), were applied on a hybrid evaporative and direct expansion (DX)-based model data center cooling system to assess the impact ... -
Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices
(American Society of Mechanical Engineers (ASME), 2019)Active power cycling (APC) is a standardized and well-established method for reliability assessment and product qualification in power electronics (PEs) technologies. Repetitive pulses of load current are applied to cause ... -
Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste
(American Society of Mechanical Engineers (ASME), 2019)In this work, an easy and low-temperature fabrication method of three-dimensional (3D) ceramic substrate was proposed. A 3DPC ceramic substrate was fabricated by molding alkali-activated aluminosilicate cement (AAAC) to ... -
Enhanced Sintered Silver for SiC Wide Bandgap Power Electronics Integrated Package Module
(The American Society of Mechanical Engineers (ASME), 2019)Thermal interface materials (TIMs) are crucial elements for packaging of power electronics. In particular, development of high-temperature lead-free die-attach TIMs for silicon carbide wide bandgap power electronics is a ... -
Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design
(The American Society of Mechanical Engineers (ASME), 2019)There are various designs for segregating hot and cold air in data centers such as cold aisle containment (CAC), hot aisle containment (HAC), and chimney exhaust rack. These containment systems have different characteristics ... -
Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging
(The American Society of Mechanical Engineers (ASME), 2019)In this study, we realized a cylindrical tuber silicone layer for improving the light efficiency of chip-on-board light-emitting diodes (COB-LEDs) by fabricating patterned LED substrate with both silicone-wetting and ...