Journal of Electronic Packaging: Recent submissions
Now showing items 261-280 of 2123
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Atomic Study on Copper–Copper Bonding Using Nanoparticles
(The American Society of Mechanical Engineers (ASME), 2020)Thermocompression bonding of copper to copper using copper nanoparticles is studied using molecular dynamics. The bonding interface formation process is investigated frst. For the bonding process, the effects of temperature ... -
Investigation of Elevated Temperature Mechanical Properties of Intermetallic Compounds in the Cu–Sn System Using Nanoindentation
(The American Society of Mechanical Engineers (ASME), 2020)In electronic packaging, most researchers are mainly focused on the mechanical properties of Cu–Sn intermetallic compounds (IMCs) at room temperature; few studies have looked into the relationship between hardness, elastic ... -
Investigation of Strip Warpage Behavior in Wire Bonding Process
(The American Society of Mechanical Engineers (ASME), 2020)This study successfully established a strip warpage simulation model that is applied to the wire bonding process, and explored the effects of structural designs, material types, and processes such as molding, post and mold ... -
Examination of Consistent Application of Interfacial Fracture Energy Versus Mode-Mixity Curve for Delamination Prediction
(The American Society of Mechanical Engineers (ASME), 2020)Experimentally characterized critical interfacial fracture energy is often written as an explicit trigonometric function of mode-mixity and is used to determine whether an interfacial crack will propagate or not under given ... -
Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger
(American Society of Mechanical Engineers (ASME), 2019)The flow field inside the heat exchangers is associated with maximum heat transfer and minimum pressure drop. Designing a heat exchanger and employing various techniques to enhance its overall performance has been widely ... -
Orientation Effects in Two-Phase Microgap Flow
(American Society of Mechanical Engineers (ASME), 2019)The high power density of emerging electronic devices is driving the transition from remote cooling, which relies on conduction and spreading, to embedded cooling, which extracts dissipated heat on-site. Two-phase microgap ... -
Special Issue on InterPACK 2018
(American Society of Mechanical Engineers (ASME), 2019) -
Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems
(American Society of Mechanical Engineers (ASME), 2019)The increasing complexity of electronics in systems used in safety critical applications, such as self-driving vehicles, requires new methods to assure the hardware reliability of the electronic assemblies. Prognostics and ... -
Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization
(American Society of Mechanical Engineers (ASME), 2019)Contamination due to the use of airside economizer has become a major issue that cost companies revenue. This issue will continue to rise as server components become smaller, densely packed, and as companies move into more ... -
Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test
(American Society of Mechanical Engineers (ASME), 2019)In this work, a rapid and low-cost accelerated reliability test methodology which was designed to simulate mechanical stresses induced in flip–chip bonded devices during the thermal cycling reliability test under isothermal ... -
Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation
(American Society of Mechanical Engineers (ASME), 2019)In this paper, several methods suitable for real time on-chip temperature measurements of power AlGaN/GaN-based high-electron mobility transistor (HEMT) grown on a SiC substrate are presented. The measurement of temperature ... -
Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel
(American Society of Mechanical Engineers (ASME), 2019)Recently, microchannel heat sinks have been emerged as a kind of high performance cooling scheme to meet the heat dissipation requirement of electronics packaging and integration. In this study, an experimental investigation ... -
Embedded Cooling for Wide Bandgap Power Amplifiers: A Review
(American Society of Mechanical Engineers (ASME), 2019)Successful utilization of the inherent capability of wide bandgap materials and architectures for radio frequency (RF) power amplifiers (PAs) necessitates the creation of an alternative thermal management paradigm. Recent ... -
Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages
(American Society of Mechanical Engineers (ASME), 2019)With recent advances in the state-of-the-art of power electronic devices, packaging has become one of the critical factors limiting the performance and durability of power electronics. To this end, this study investigates ... -
A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint
(American Society of Mechanical Engineers (ASME), 2019)Fatigue failure of solder joints is one of the major causes of failure in electronic devices. Fatigue life prediction models of solder joints were first put forward in the early 1960s, and since then, numbers of methods ... -
Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging
(American Society of Mechanical Engineers (ASME), 2019)The recent advances and trends in fan-out wafer/panel-level packaging (FOW/PLP) are presented in this study. Emphasis is placed on: (A) the package formations such as (a) chip first and die face-up, (b) chip first and die ... -
Design of Thermal Ground Planes for Cooling of Foldable Smartphones
(American Society of Mechanical Engineers (ASME), 2019)Foldable smartphones are expected to be widely commercialized in the near future. Thermal ground plane (TGP), known as vapor chamber or two-dimensional flat heat pipe, is a promising solution for the thermal management of ... -
Investigation of the Mechanism of Temperature Rise in a Data Center With Cold Aisle Containment
(American Society of Mechanical Engineers (ASME), 2019)This paper theoretically investigates the relationships among factors that affect the temperature rise of server racks and experimentally tests the influence of variable space contained arrangements on the thermal performance. ... -
Experimental SAC305 Shear Stress–Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements
(American Society of Mechanical Engineers (ASME), 2019)Temperature-induced solder joint fatigue is a main reliability concern for aerospace and military industries whose electronic equipment used in the field is required to remain functional under harsh loadings. Due to the ... -
New Electronic Packaging Method for Potted Guidance Electronics to Sustain Temperature Cycling and Survive High-G Applications
(American Society of Mechanical Engineers (ASME), 2019)Potted Guidance Electronics have been widely used in precision guided munitions. In the current generation of projectiles, soft potting materials have been sufficient to protect the electronics from the G-forces of gun ...