Journal of Electronic Packaging: Recent submissions
Now showing items 241-260 of 2123
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Characterization of the Interdependence Between the Light Output and Self-Heating of Gallium Nitride Light-Emitting Diodes
(The American Society of Mechanical Engineers (ASME), 2020)With the advent of gallium nitride (GaN) as an enabling material system for the solid-state lighting industry, high-power and high-brightness light-emitting diodes (LEDs) with wavelengths ranging from near ultraviolet to ... -
Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles
(The American Society of Mechanical Engineers (ASME), 2020)Metallic phase change materials (mPCMs) have been demonstrated as potential passive cooling solution for pulse power applications. The possibility of integrating a metallic PCM directly on top of a heat source, reducing ... -
Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications
(The American Society of Mechanical Engineers (ASME), 2020)Rapid temperature transients sustained during the operation of high-voltage electronics can be difficult to manage by relying solely on uniform heat removal mechanisms. Phase-change materials (PCMs) can be useful as a ... -
Systematical and Numerical Investigations on InGaN-Based Green Light-Emitting Diodes: Si-Doped Quantum Barriers, Engineered p-Electron Blocking Layer and AlGaN/GaN Structured p-Type Region
(The American Society of Mechanical Engineers (ASME), 2020)Here, we numerically prove that the severe polarization-induced electric field in the active region for [0001]-oriented InGaN-based green light-emitting diodes (LEDs) is reduced when heavily Si-doped GaN quantum barriers ... -
Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink
(The American Society of Mechanical Engineers (ASME), 2020)Flexible printed circuits (FPCs) are widely used in electronic equipment such as mobile devices and wearable sensors. The conductive electric lines in these circuits are printed using nanoparticle metal ink and ink-jet ... -
Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach
(The American Society of Mechanical Engineers (ASME), 2020)This work will specifically detail the development of a processing and fabrication route for a three-dimensional asynchronous field-programmable gate array (3D-AFPGA) design based on an extension of pre-existing ... -
Multiscale Evaporation Rate Measurement Using Microlaser-Induced Fluorescence
(The American Society of Mechanical Engineers (ASME), 2020)As the heat generation at device footprint continuously increases in modern high-tech electronics, there is an urgent need to develop new cooling devices that balance the increasing power demands. To meet this need, ... -
The Optical Properties of Dual-Wavelength InxGa1−xN/GaN Nanorods for Wide-Spectrum Light-Emitting Diodes
(The American Society of Mechanical Engineers (ASME), 2020)We fabricated the dual-wavelength InxGa1−xN/GaN nanorods for wide-spectrum light-emitting diodes (LEDs) by silica nanosphere lithography (SNL) technique. The emission properties of the dual-wavelength nanorods are characterized ... -
Surface Current Improvement of Magnesium-Doped Hexagonal Boron Nitride Monolayer by Additional Nitrogen Gas Flow
(The American Society of Mechanical Engineers (ASME), 2020)Hexagonal boron nitride (h-BN) is the most well-known wide band gap two-dimensional (2D) material (> 6 eV). To achieve its applications in optoelectronic devices, the conductance of h-BN must be implemented to the extent ... -
Rapid Anneal-Free Welding of Cu Nanowires Network by Ultraviolet Light Irradiation for Transparent Electrodes in Optoelectronic Applications
(The American Society of Mechanical Engineers (ASME), 2020)We demonstrate a novel ultraviolet (UV) light irradiation strategy to rapidly weld Cu nanowires (NWs) network and remove the organic residues for transparent electrodes. Shortly irradiated by UV light source, the Cu NWs ... -
High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting
(The American Society of Mechanical Engineers (ASME), 2020)Inorganic Ce doped yttrium aluminum garnet (YAG:Ce) fluorescent plates based on various manufacturing methods have been studied in recent years for laser lighting systems. A laser lighting optical system is designed to ... -
Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components
(The American Society of Mechanical Engineers (ASME), 2020)The use of computational fluid dynamics/heat transfer (CFD/HT) software has become common in exploring the thermal and hydrodynamic behavior of many electronic products. Well-designed CFD/HT models are very valuable for ... -
Experimental Description of Information Technology Equipment Reliability Exposed to a Data Center Using Airside Economizer Operating in Recommended and Allowable ASHRAE Envelopes in an ANSI/ISA Classified G2 Environment
(The American Society of Mechanical Engineers (ASME), 2020)Airside economizers lower the operating cost of data centers by reducing or eliminating mechanical cooling. It, however, increases the risk of reliability degradation of information technology (IT) equipment due to ... -
Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs
(The American Society of Mechanical Engineers (ASME), 2020)The increasing demand for tightly integrated gallium nitride high electron mobility transistors (HEMT) into electronics systems requires accurate thermal evaluation. While these devices exhibit favorable electrical ... -
Lifetime Model for the Fatigue Fracture in Cu/Al2O3/Cu Composites: Experimental Validation of a Substantial Lifetime Enhancement by Cu Step Etching
(The American Society of Mechanical Engineers (ASME), 2020)Direct bonded copper (DBC) alumina (Al2O3) substrates are used in power electronic devices in order to transfer the heat from semiconductor devices to the heat sink and to carry high electric currents. Fatigue-induced ... -
Electrical Joining of Paper-Based Multilayer Magneto-Resistive Sensor Stacks
(The American Society of Mechanical Engineers (ASME), 2020)With the increase in the new development of paper electronics, there is a great demand for paper-compatible and reliable electrical joining techniques. In this work, we particularly addressed the interconnecting of multilayers ... -
Predictive Model Development and Validation for Raised Floor Plenum Data Center
(The American Society of Mechanical Engineers (ASME), 2020)With the explosion in digital traffic, the number of data centers as well as demands on each data center, continue to increase. Concomitantly, the cost (and environmental impact) of energy expended in the thermal management ... -
Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance
(The American Society of Mechanical Engineers (ASME), 2020)Repeated loading is an important reason to cause pad cratering fatigue failure in ball grid array (BGA) device in printed circuit board (PCB) assembly. For industry application, the board level drop test is commonly applied ... -
Mechanical Characterization of Embedded Serpentine Conductors in Wearable Electronics
(The American Society of Mechanical Engineers (ASME), 2020)Wearable electronics undergo stretching, flexing, bending, and twisting during the process of being put on and while being worn. In addition, wearable textile electronics also need to survive under cyclic washing. During ... -
Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures
(The American Society of Mechanical Engineers (ASME), 2020)Low temperature soldering has been realized to create a strong metallurgical interconnection between Cu using the self-propagating exothermic reaction by Al–Ni NanoFoil. This technique presents a great potential for ...