Journal of Electronic Packaging: Recent submissions
Now showing items 221-240 of 2123
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A System to Package Perspective on Transient Thermal Management of Electronics
(The American Society of Mechanical Engineers (ASME), 2020)There are many applications throughout the military and commercial industries whose thermal profiles are dominated by intermittent and/or periodic pulsed thermal loads. Typical thermal solutions for transient applications ... -
Comparative Study on Power Module Architectures for Modularity and Scalability
(The American Society of Mechanical Engineers (ASME), 2020)Silicon carbide (SiC) wide bandgap power electronics are being applied in hybrid electric vehicle (HEV) and electrical vehicles (EV). The Department of Energy (DOE) has set target performance goals for 2025 to promote EV ... -
Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules
(The American Society of Mechanical Engineers (ASME), 2020)Direct bonded copper (DBC) substrates used in power modules have limited heat spreading and manufacturing capability due to ceramic properties and manufacturing technology. The ceramic and copper bonding is also subject ... -
Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits
(The American Society of Mechanical Engineers (ASME), 2020)The semiconductor packaging technologies have seen its growth from multichip module (MCM), system in package (SiP), system on chip (SoC) to the heterogeneous integration of the MCM. Thermal management of multichip vertically ... -
High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C
(The American Society of Mechanical Engineers (ASME), 2020)Leadfree electronics in harsh environments often may be exposed to elevated temperature for the duration of storage, transport, and usage in addition to high strain rate triggering loads during drop-impact, vibration, and ... -
A Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort
(The American Society of Mechanical Engineers (ASME), 2020)Liquid cooling garments (LCGs) are considered feasible cooling equipment to protect individuals from hyperthermia and heat-related illness when working in extremely hot and stressful environments. So far, the goals for the ... -
Electro-Thermal Codesign Methodology of an On-Board Electric Vehicle Charger
(The American Society of Mechanical Engineers (ASME), 2020)Significant advances are needed to optimize the charging speed, reliability, safety, and cost of today's conservatively designed electric vehicle (EV) charging systems. The design and optimization of these novel engineering ... -
Design of Diffractive Optical Elements by Direct and Indirect Construction of Diffraction Pattern: A Comparative Study
(The American Society of Mechanical Engineers (ASME), 2020)In this work, we present the design method of diffractive beam splitters via two comparative technical routes, the first referred as the direct scheme and the second referred as the indirect scheme. Comparative study is ... -
Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior
(The American Society of Mechanical Engineers (ASME), 2020)In this work, we develop and evaluate algorithms for generating ultrapacked microstructures of particles. Simulated microstructures reported in the literature rarely contain particle volume fractions greater than 60%. ... -
Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization
(The American Society of Mechanical Engineers (ASME), 2020)With the increase of electronic device power density, thermal management and reliability are increasingly critical in the design of power electronic systems. First, increased density challenges the capability of conventional ... -
Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours
(The American Society of Mechanical Engineers (ASME), 2020)Traditionally, printed circuit assemblies have been fabricated through a combination of imaging and plating-based subtractive processes involving the use of photo-exposure followed by baths for plating and etching in order ... -
Additively Printed Multilayer Substrate Using Aerosol-Jet Technique
(The American Society of Mechanical Engineers (ASME), 2020)Printing technologies, such as aerosol-jet, open possibilities of miniaturizing interconnects and designing circuits on nonplanar surfaces. Aerosol-jet is a direct-printing technique that provides an alternative manufacturing ... -
Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements
(The American Society of Mechanical Engineers (ASME), 2020)The share of equipment and power use in smaller data centers (DCs) is comparable with that of more massive counterparts. However, they grabbed less attention in the literature despite being less energy-efficient. This study ... -
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices
(The American Society of Mechanical Engineers (ASME), 2020)Laser machining is an inexpensive and fast alternative to conventional microfabrication techniques and has the capability to produce complicated three-dimensional (3D), hierarchical structures. It is especially important ... -
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa
(The American Society of Mechanical Engineers (ASME), 2020)High performance and economically viable cooling solutions must be developed to reduce weight and volume, allowing for a wide-spread utilization of hybrid electric vehicles. The traditional embedded microchannel cooling ... -
Nearly Efficiency-Droop-Free AlGaN-Based Deep-Ultraviolet Light-Emitting Diode Without Electron-Blocking Layer
(The American Society of Mechanical Engineers (ASME), 2020)An aluminum-rich AlGaN layer is commonly implemented to act as an electron-blocking layer (EBL) to block electron overflow from the active region in the conventional deep-ultraviolet light-emitting diodes (DUV LEDs). Herein, ... -
Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics
(The American Society of Mechanical Engineers (ASME), 2020)Researchers have been extensively studying wide-bandgap (WBG) semiconductor materials such as gallium nitride (GaN) with an aim to accomplish an improvement in size, weight, and power of power electronics beyond current ... -
Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis
(The American Society of Mechanical Engineers (ASME), 2020)Due to the inherently low adhesive strength and structural integrity of polymer thermal interface materials (TIMs), they present a likely point of failure when succumbed to thermomechanical stresses in electronics packaging. ... -
Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads
(The American Society of Mechanical Engineers (ASME), 2020)Solder joints in electronic assemblies experience damage due to cyclic thermomechanical loading that eventually leads to fatigue fracture and electrical failure. While solder joints in smaller, die-sized area-array packages ... -
Reviewer’s Recognition
(The American Society of Mechanical Engineers (ASME), 2020)The Reviewer of the Year Award is given to reviewers who have made an outstanding contribution to the journal in terms of the quantity, quality, and turnaround time of reviews completed during the past 12 months. The prize ...