Journal of Electronic Packaging: Recent submissions
Now showing items 201-220 of 2123
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Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys
(The American Society of Mechanical Engineers (ASME), 2020)Electronic components in downhole oil drilling and gas industry applications, automotive, and avionics may be exposed to high temperatures (>150 °C) and high strain rates (1–100 per sec) during storage, operation, and ... -
Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid
(The American Society of Mechanical Engineers (ASME), 2021)High-performance computing (HPC) data centers demand cutting edge cooling techniques like direct contact liquid cooling (DCLC) for safe and secure operation of their high-power density servers. The two-phase flow boiling ... -
Modular Heat Sinks for Enhanced Thermal Management of Electronics
(The American Society of Mechanical Engineers (ASME), 2021)Power electronics are vital for the generation, conversion, transmission, and distribution of electrical energy. Improving the efficiency, power density, and reliability of power electronics is an important challenge that ... -
Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging
(The American Society of Mechanical Engineers (ASME), 2021)Alumina-based die-attach and encapsulation for high-temperature (300–500 °C) electronic packaging were investigated. The alumina paste material comprises aluminum dihydric phosphate as a binder and alumina powder as a ... -
Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging
(The American Society of Mechanical Engineers (ASME), 2021)Rapid detection of hardware Trojans on a semiconductor chip that may run malicious processes on the chip is a critical and ongoing security need. Several approaches have been investigated in the past for hardware Trojan ... -
Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
(The American Society of Mechanical Engineers (ASME), 2021)This review introduces relevant nanoscale thermal transport processes that impact thermal abatement in power electronics applications. Specifically, we highlight the importance of nanoscale thermal transport mechanisms at ... -
Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting Ink
(The American Society of Mechanical Engineers (ASME), 2020)This paper focuses on the influence of carrier gas flow rate (CGFR) and sheath gas flow rate (SGFR) on the quality of conductive traces printed with nanoparticle inks using aerosol jet printing (AJP). This investigation ... -
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm2) Power Electronics Cooling
(The American Society of Mechanical Engineers (ASME), 2020)Thermal management of power electronics modules is one of the limiting factors in the peak power capability of the traction inverter system and overall efficiency of the e-drive. Liquid cooling using embedded microchannels ... -
Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules
(The American Society of Mechanical Engineers (ASME), 2020)Pluggable optoelectronic transceiver modules are widely used in the fiber-optic communication infrastructure. It is essential to mitigate thermal contact resistance between the high-power optical module and its riding heat ... -
Thermal Fatigue Evaluation Model of a Microelectronic Chip in Terms of Interfacial Singularity
(The American Society of Mechanical Engineers (ASME), 2020)Thermal fatigue failure of microelectronic chip often initiates from the interface between solder and substrate, and the service life of the chip is largely dependent on the singular stress–strain at this interface. To ... -
Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers
(The American Society of Mechanical Engineers (ASME), 2020)Thermal interface materials (TIMs) are an important component in electronic packaging, and there is a concerted effort to understand their reliability when used under various environmental load conditions. Previous researchers ... -
Measurement of the Thermal Performance of a Custom-Build Single-Phase Immersion Cooled Server at Various High and Low Temperatures for Prolonged Time
(The American Society of Mechanical Engineers (ASME), 2020)The next radical change in the thermal management of data centers is to shift from conventional cooling methods like air-cooling to direct liquid cooling to enable high thermal mass and corresponding superior cooling. There ... -
Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling
(The American Society of Mechanical Engineers (ASME), 2020)As modern-day electronics develop, electronic devices become smaller, more powerful, and are expected to operate in more diverse configurations. However, the thermal control systems that help these devices maintain stable ... -
System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials
(The American Society of Mechanical Engineers (ASME), 2020)Electronic packaging for automotive applications are at particular risk of thermomechanical failure due to the naturally harsh conditions it is exposed to. With the rise of electric and hybrid electric vehicles (EVs and ... -
An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads
(The American Society of Mechanical Engineers (ASME), 2020)Increasing power densities in data centers due to the rise of artificial intelligence, high-performance computing, and machine learning compel engineers to develop new cooling strategies and designs for high-performance ... -
Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization
(The American Society of Mechanical Engineers (ASME), 2020)A remarkable amount of energy in data centers is consumed in eliminating the heat generated by the information technology (IT) equipment to maintain and ensure safe operating conditions and optimum performance. The ... -
Flexure and Twist Test Reliability Assurance of Flexible Electronics
(The American Society of Mechanical Engineers (ASME), 2020)Additively printed flexible electronics in wearable application may be subjected to twisting or flexing depending on the form factor and the intended use. There is a dearth of standards for testing and reliability assurance ... -
Special Issue on InterPACK 2019 – Part 1
(The American Society of Mechanical Engineers (ASME), 2020)We hope that you find the content of the Special Issues useful and wish you the very best.The two-part 2019 InterPACK Special Issues of the ASME Journal of Electronic Packaging (JEP) was developed from manuscripts submitted ... -
The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates
(The American Society of Mechanical Engineers (ASME), 2020)Gallium nitride (GaN) has emerged as one of the most attractive base materials for next-generation high-power and high-frequency electronic devices. Recent efforts have focused on realizing vertical power device structures ... -
Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements
(The American Society of Mechanical Engineers (ASME), 2020)The use of flexible electronics wearable applications has prompted the need to understand the stresses imposed during human motion for a range of activities. Wearable applications may involve situations in which the ...