Journal of Electronic Packaging: Recent submissions
Now showing items 181-200 of 2123
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Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies
(The American Society of Mechanical Engineers (ASME), 2021)In order to meet the increasing performance demand of high-performance computing and edge computing, thermal design power (TDP) of central processing unit (CPU) and graphics processing unit (GPU) needs to increase. This ... -
The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing Boiling
(The American Society of Mechanical Engineers (ASME), 2021)As the size, weight, and performance requirements of electronic devices grow increasingly demanding, their packaging has become more compact. As a result of thinning or removing the intermediate heat spreading layers, ... -
Reduced Order Design Optimization of Liquid Cooled Heat Sinks
(The American Society of Mechanical Engineers (ASME), 2021)The recent growth in electronics power density has created a significant need for effective thermal management solutions. Liquid-cooled heat sinks or cold plates are typically used to achieve high volumetric power density ... -
Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
(The American Society of Mechanical Engineers (ASME), 2021)This paper investigated the effect of heat spreading on the boiling of the Novec 649™ for two-phase immersion cooling of electronics. Reference pool boiling tests were performed by attaching a 25.4 mm by 25.4 mm square ... -
Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control
(The American Society of Mechanical Engineers (ASME), 2021)Flow boiling in microchannel evaporators is widely recognized and promising for its compact structure, lower coolant usage, high heat transfer coefficient, ability to provide higher heat fluxes, and better temperature ... -
Special Section on Nanoscale/Microscale Energy Transport, Conversion and Storage in Electronics Packaging
(The American Society of Mechanical Engineers (ASME), 2021)This Special Section of the ASME Journal of Electronic Packaging (JEP) is dedicated to state-of-the-art advancements made in nanoscale and microscale thermal energy transport across a variety of electronics cooling platforms. ... -
Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology
(The American Society of Mechanical Engineers (ASME), 2021)Ninety percent of high temperature electronic devices operate in temperatures in the range of 150 to 300 °C, and for such temperature needs, technologies typical for the military range might be adapted. To make it possible, ... -
Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores
(The American Society of Mechanical Engineers (ASME), 2021)Cu pillar microbumps with polymer cores have been demonstrated to effectively reduce thermomechanical stress and improve joint reliability. Fabricating polymer cores by a printing approach was proposed to overcome the ... -
Influences of Small Jet-to-Wall Spacings on Heat Transfer Characteristics and Flow-Field Entrainment Effects of Microscale Jets
(The American Society of Mechanical Engineers (ASME), 2021)Detailed heat transfer distributions of multiple microscaled tapered jets orthogonally impinging on the surface of a high-power density silicon wall is presented. The tapered jets issued from two different impingement setup ... -
Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage Modules
(The American Society of Mechanical Engineers (ASME), 2021)This paper presents a new design architecture for mechanically flexible light-emitting diode (LED) signage modules for applications in digital advertising on curved surfaces. The new design comprises an array of commonly ... -
Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap
(The American Society of Mechanical Engineers (ASME), 2021)Three-dimensional (3D) stacked integrated circuit (SIC) chips are one of the most promising technologies to achieve compact, high-performance, and energy-efficient architectures. However, they face a heat dissipation ... -
Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes
(The American Society of Mechanical Engineers (ASME), 2021)In this paper, we present the results of an experimental study involving low thermal resistance cooling of high heat flux power electronics in a forced convection mode, as well as in a thermosiphon (buoyancy-driven) mode. ... -
Study of Different Dispensing Patterns of No-Flow Underfill Using Numerical and Experimental Methods
(The American Society of Mechanical Engineers (ASME), 2021)The conventional capillary underfill process has been a common practice in the industry, somehow the process is costly and time-consuming. Thus, no-flow underfill process is developed to increase the effective lead time ... -
Flow-Controlled Spray Cooling Approaches for Dynamic Thermal Management
(The American Society of Mechanical Engineers (ASME), 2021)Two-phase spray cooling is considered as one of the most promising thermal management techniques characterized by high heat transfer coefficient (HTC) and critical heat flux (CHF), as well as near-uniform temperatures on ... -
Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams
(The American Society of Mechanical Engineers (ASME), 2021)High porosity, high pore-density (pores per inch: PPI) metal foams are a popular choice in high heat flux cooling applications as they offer large heat transfer area over a given volume, however, accompanied by a concomitant ... -
Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint
(The American Society of Mechanical Engineers (ASME), 2021)Cu foam (Cu-F) and Ag-coated Cu-F were added into nano-Ag paste to obtain Cu-F@nano-Ag composite sintered joint. The microstructure, hardness, and shear behavior of the sintered joints were investigated. Experimental results ... -
Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling
(The American Society of Mechanical Engineers (ASME), 2021)Data centers are a large group of networked servers used by organizations for computational and storage purposes. In 2014, data centers consumed an estimated 70 billion kWh in the United States alone. It is incumbent on ... -
A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling
(The American Society of Mechanical Engineers (ASME), 2021)High porosity metal foams offer large surface area per unit volume and have been considered as effective candidates for convection heat transfer enhancement, with applications as heat sinks in electronics cooling. In this ... -
Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks
(The American Society of Mechanical Engineers (ASME), 2020)The industry shift to multicore microprocessor architecture will likely cause higher temperature nonuniformity on chip surfaces, exacerbating the problem of chip reliability and lifespan. While advanced cooling technologies ... -
Aging and Fatigue of Aerosol Jet-Printed Nano-Ag Traces on Flexible Substrate
(The American Society of Mechanical Engineers (ASME), 2020)Conducting traces on a flexible substrate often have to survive significant and repeated deformation, making their fatigue resistance and the stability of it during long-term storage and use a potential concern. The question ...