Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

Abstract

In order to meet the increasing performance demand of high-performance computing and edge computing, thermal design power (TDP) of central processing unit (CPU) and graphics processing unit (GPU) needs to increase. This creates thermal challenge to corresponding electronic packages with respect to heat dissipation. In order to address this challenge, two-phase immersion cooling is gaining attention as its primary mode of heat of removal is via liquid-to-vapor phase change, which can occur at relatively low and constant temperatures. In this paper, an integrated heat spreader (IHS) with boiling enhancement features is proposed. Three-dimensional metal printing and metal injection molding (MIM) are the two approaches used to manufacture the new IHS. The resultant IHS with boiling enhancement features is used to build thermal test vehicles (TTV) by following the standard electronic package assembly process. Experimental results demonstrate that boiling enhanced TVs improved two-phase immersion cooling capability by over 50% as compared to baseline TTV without boiling enhanced features.