Journal of Electronic Packaging: Recent submissions
Now showing items 161-180 of 2123
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Recent Developments in Air Pumps for Thermal Management of Electronics
(The American Society of Mechanical Engineers (ASME), 2021)For electronics, poor thermal management could cause severe mechanical and electrical failures. Forced convective air cooling, i.e., flowing air over a hot surface, is one of the most efficient and economical solutions to ... -
Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics
(The American Society of Mechanical Engineers (ASME), 2022)As power densities and switching frequencies dramatically increase in wide bandgap power electronics, electromagnetic interference (EMI) increasingly impacts power conversion efficiency, and reliability, which requires ... -
Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics
(The American Society of Mechanical Engineers (ASME), 2022)Continuous rise in cloud computing and other web-based services propelled the data center proliferation seen over the past decade. Traditional data centers use vapor-compression-based cooling units that not only reduce ... -
Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology
(The American Society of Mechanical Engineers (ASME), 2022)The transition of additive printed electronics into high-volume production requires process consistency to allow quality control of the manufactured product. Process recipes are needed for multilayer substrates with z-axis ... -
Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging
(The American Society of Mechanical Engineers (ASME), 2022)Heterogeneous and complex electronic packages may require unique thermomechanical structures to provide optimal heat guiding. In particular, when a heat source and a heat sink are not aligned and do not allow a direct path, ... -
Process-Recipe Development for Printing of Multilayer Circuitry With Z-Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias
(The American Society of Mechanical Engineers (ASME), 2022)Flexible electronics is emerging as a new consumer-industry phenomenon. The promise of additively printed flexible electronics has sparked interest in a detailed understanding of the parameters and interactions of the ... -
Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature
(The American Society of Mechanical Engineers (ASME), 2022)In extreme environmental applications, such as aerospace and automotive, electronics may endure high or low operating temperatures during service, handling, and storage. An electronic assembly may experience strain rates ... -
High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors
(The American Society of Mechanical Engineers (ASME), 2022)Magnetic field sensors based on the Hall-effect have a variety of applications such as current sensing in power electronics and position and velocity sensing in vehicles. Additionally, they have benefits such as easy ... -
Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model
(The American Society of Mechanical Engineers (ASME), 2022)One of the key challenges for the electric vehicle industry is to develop high-power-density electric motors. Achieving higher power density requires efficient heat removal from inside the motor. In order to improve thermal ... -
Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation
(The American Society of Mechanical Engineers (ASME), 2022)Automotive underhood electronics are subjected to high operating temperatures in the neighborhood of 150–200 °C for prolonged periods in the neighborhood of 10 yr. Consumer grade off-the-shelf electronics are designed to ... -
Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures
(The American Society of Mechanical Engineers (ASME), 2022)The demand for wearable consumer electronics, fitness accessories, and biomedical equipment has led to the growth research and development of thin flexible batteries. Wearable equipment and other asset monitoring applications ... -
Remaining Useful Life Estimation and Prognostication of SAC305 Printed Circuit Boards for Dynamic Conditions of Temperature and Vibration Loads
(The American Society of Mechanical Engineers (ASME), 2021)This study focuses on the feature vector identification and remaining useful life (RUL) estimation of SAC305 solder alloy printed circuit boards (PCBs) of two different configurations during varying conditions of temperature ... -
Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
(The American Society of Mechanical Engineers (ASME), 2021)This study is focused on the experimental characterization of two-phase heat transfer performance and pressure drops within an ultracompact heat exchanger (UCHE) suitable for electronics cooling applications. In this ... -
Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling
(The American Society of Mechanical Engineers (ASME), 2021)The adoption of single-phase liquid immersion cooling (Sp-LIC) for Information Technology equipment provides an excellent cooling platform coupled with significant energy savings. There are, however, very limited studies ... -
High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days
(The American Society of Mechanical Engineers (ASME), 2021)Electronic components are subject to high strain, during shock and vibration in many applications such as the automobile and aerospace. In many cases, this kind of electronic components will also be exposed to harsh ... -
System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile
(The American Society of Mechanical Engineers (ASME), 2021)Monitoring and predicting temperatures at critical locations of a power electronic system is important for safety, reliability, and efficiency. As the market share of vehicles with electric powertrains continues to increase, ... -
Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications
(The American Society of Mechanical Engineers (ASME), 2021)Canary structures being used as early warning indicators represent an important tool for condition and health monitoring of electronic components and systems. In this paper, printed circuit boards (PCBs) with canary ... -
Special Issue on InterPACK2020
(The American Society of Mechanical Engineers (ASME), 2022)The microelectronics packaging industry is facing challenges to meet demanding performance and functional needs of modern microprocessors, radio frequency components, and power electronic devices for various product segments ... -
Reviewer's Recognition
(The American Society of Mechanical Engineers (ASME), 2022)The Reviewers of the Year Award is given to reviewers who have made an outstanding contribution to the journal in terms of the quantity, quality, and turnaround time of reviews completed during the past 12 months. The prize ... -
Please Join the ASME Community and the Bar-Cohen Family to Support the Establishment of the ASME Avram Bar-Cohen Memorial Medal
(The American Society of Mechanical Engineers (ASME), 2021)This prestigious society-wide medal will memorialize Avi's legacy and impact on our community. Medal recipients must not only exhibit excellence in electronics, photonics, mechanics, and packaging phenomena but also exhibit ...