Journal of Electronic Packaging: Recent submissions
Now showing items 141-160 of 2123
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Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints
(The American Society of Mechanical Engineers (ASME), 2022)Low-silver solders are increasingly being used because silver improves the tensile strength. In this study, the variation in fracture behavior with silver content in lead-free solder joints was studied using double cantilever ... -
A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification
(The American Society of Mechanical Engineers (ASME), 2022)The practice of commissioning data centers (DCs) is necessary to confirm the compliance of the cooling system to the information technology equipment (ITE) load (design capacity). In a typical DC, there are different types ... -
Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator
(The American Society of Mechanical Engineers (ASME), 2022)The issue of regenerative cooling is one of the most important key technologies of flight vehicles, which is applied into both the engine and high-power electrical equipment. One pattern of regenerative cooling channels ... -
Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes
(The American Society of Mechanical Engineers (ASME), 2022)Recent years, the sintered silver paste was introduced and further developed for power electronics packaging due to low processing temperature and high working temperature. The pressure-less sintering technology reduces ... -
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current
(The American Society of Mechanical Engineers (ASME), 2022)Printed electronics (PEs) have attracted attention for the fabrication of microscale electronic circuits. PEs use conductive inks which include metal nanoparticles. The conductive ink can be printed on flexible substrates ... -
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
(The American Society of Mechanical Engineers (ASME), 2022)In a two-phase immersion cooling system, boiling on the spreader surface has been experimentally found to be nonuniform, and it is highly related to the surface temperature and the heat transfer coefficient. An experimentally ... -
Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing
(The American Society of Mechanical Engineers (ASME), 2022)Conventional reliability tests for the evaluation of pad cratering resistance are mainly classified into two categories: the board level test and the joint level test. The board-level test is to imitate the loading conditions ... -
Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package
(The American Society of Mechanical Engineers (ASME), 2021)Recent advances in the micro-electronics industry have increased the demand for smaller and more compact package devices with higher performance. This paper presents an analytical multiparametric design optimization approach ... -
Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers
(The American Society of Mechanical Engineers (ASME), 2021)Transistor density trends till recently have been following Moore's law, doubling every generation resulting in increased power density. The computational performance gains with the breakdown of Moore's law were achieved ... -
Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel
(The American Society of Mechanical Engineers (ASME), 2021)Miniaturization of electronic components requires compact and effective cooling techniques to dissipate large heat flux without a significant increase in pumping power. Microchannel heat sink with liquid as working fluid ... -
Influence of Laser Soldering Temperatures on Through-Hole Component
(The American Society of Mechanical Engineers (ASME), 2021)The conventional method of selective soldering has been practiced using wave soldering, convection reflow, and hand soldering. However, due to industry automation and high demand for quality, repeatability and flexibility, ... -
Design and Fabrication of Leadless Package Structure for Pressure Sensors
(The American Society of Mechanical Engineers (ASME), 2021)Silicon piezoresistive pressure sensors can only operate below 125 °C due to the leakage current of the PN junction. However, silicon-on-insulator (SOI) high-temperature pressure sensors use SiO2 for total dielectric ... -
Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration
(The American Society of Mechanical Engineers (ASME), 2021)Next-generation interconnects utilizing mechanically interlocking structures enable permanent and reworkable joints between micro-electronic devices. Mechanical metamaterials, specifically dry adhesives, are an active area ... -
A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging
(The American Society of Mechanical Engineers (ASME), 2021)This paper presents a new approach to formulating an analytical model for the underfill process in flip-chip packaging to predict the flow front and the filling time. The new approach is based on the concept of surface ... -
Coupled Calculations of Data Center Cooling and Power Distribution Systems
(The American Society of Mechanical Engineers (ASME), 2021)Physics-based modeling aids in designing efficient data center power and cooling systems. These systems have traditionally been modeled independently under the assumption that the inherent coupling of effects between the ... -
Optimized Design of Various Ag Decorated Sn-xAg-Cu0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging
(The American Society of Mechanical Engineers (ASME), 2021)Effects of Ag content (0 ∼ 3 wt%) in Sn-xAgCu0.7 solders on microstructure characteristics and low cycling fatigue at different temperature conditions are overall investigated. To increase Ag content, the solidus points ... -
A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules
(The American Society of Mechanical Engineers (ASME), 2022)The blocking voltage level of silicon carbide (SiC) can reach 10–25 kV, which will significantly increase the power density and capacity of power modules. However, high voltage can induce a high electric field, increase ... -
Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology
(The American Society of Mechanical Engineers (ASME), 2022)An increasingly common power saving practice in data center thermal management is to swap out air cooling unit blower fans with electronically commutated plug fans, Although, both are centrifugal blowers. The blade design ... -
Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading
(The American Society of Mechanical Engineers (ASME), 2022)With the development of packaging devices toward high performance and high density, electronic devices are subjected to thermo-electric stresses under service conditions, which has become a particularly important reliability ... -
A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime
(The American Society of Mechanical Engineers (ASME), 2022)A reduced weakly-coupled thermo-mechanical model based on the proper generalized decomposition method was developed for the numerical analysis of power modules. The employed model reduction method enabled us to obtain, in ...