Journal of Electronic Packaging: Recent submissions
Now showing items 121-140 of 2123
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Effective Constitutive Relations for Sintered Nano Copper Joints
(The American Society of Mechanical Engineers (ASME), 2022)Sintered copper nanoparticles are being considered as alternatives to solder and/or sintered silver in different applications. Like for the alternatives, the interpretation of accelerated fatigue test results does however ... -
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers
(The American Society of Mechanical Engineers (ASME), 2022)Heat spreading from local, time-dependent heat sources in electronic packages results in the propagation of temperature nonuniformities through the stack of material layers attached to the chip. Available models either ... -
Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers
(The American Society of Mechanical Engineers (ASME), 2022)Silicon-based embedded microchannel with three-dimensional (3D) manifold (MF) μ-cooler offers lower pressure drop and increased heat removal capability (>1 kW/cm2) for microprocessors and power electronics cooling using ... -
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis
(The American Society of Mechanical Engineers (ASME), 2022)The reliability of Sn-Ag-Cu (SAC)-based solder alloys has been extensively investigated after the prohibition of lead in the electronics industry owing to their toxicity. Low-temperature solder (LTS) alloys have recently ... -
Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density
(The American Society of Mechanical Engineers (ASME), 2022)The electromigration (EM) damage is becoming a severe problem in the printed flexible electronics as the printed circuits are fabricated thinner and thinner due to the development of printing technology. In this work, the ... -
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review
(The American Society of Mechanical Engineers (ASME), 2022)Miniaturization as well as manufacturing processes that electronics devices are subjected to often results in to increase in operational parameters such as current density, temperature, mechanical load, and with potential ... -
Reviewer's Recognition
(The American Society of Mechanical Engineers (ASME), 2023)The Reviewers of the Year Award is given to reviewers who have made an outstanding contribution to the journal in terms of the quantity, quality, and turnaround time of reviews completed during the past 12 months. The prize ... -
Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging
(The American Society of Mechanical Engineers (ASME), 2022)Due to the necessity for flexibility without compromising the Li-ion battery (LIB) state of health (SOH), LIB is a critical challenge for flexible hybrid electronic (FHE) devices. A thin form factor-based LIB with a thickness ... -
Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies
(The American Society of Mechanical Engineers (ASME), 2022)A methodology is presented that allows the evaluation of the thermomechanical reliability of electronic packages using “virtual prototyping.” Here, a virtual flip chip ball grid array (FC-BGA) is examined in comparison to ... -
Module-Level Thermal Interface Material Degradation in HALT
(The American Society of Mechanical Engineers (ASME), 2022)In this study, thermal interface material (TIM) degradation is driven through highly accelerated life test (HALT) using temperature cycling with a prescribed vibrational acceleration for two commercially available materials ... -
HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions
(The American Society of Mechanical Engineers (ASME), 2022)Power densification and rising module heat losses cannot be managed by traditional “external-to-case” cooling solutions. This is especially pronounced in high voltage systems, where intervening layers of insulating material ... -
Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids
(The American Society of Mechanical Engineers (ASME), 2022)Boiling heat transfer (BHT) is a promising technique for cooling the high heat flux emitted from next-generation electronic devices. However, critical heat flux (CHF) is a significant problem in BHT because it restricts ... -
Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer
(The American Society of Mechanical Engineers (ASME), 2022)Redistribution layer (RDL) is one key enabling technology for advanced packaging. RDL is usually fabricated at wafer level by a photolithography process. An alternative approach for implementing RDL by additive manufacturing ... -
Special Section on InterPACK2021
(The American Society of Mechanical Engineers (ASME), 2023)The International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) is a flagship conference of ASME Electronic and Photonic Packaging Division (EPPD). It ... -
Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the DualPhaseLag Model
(The American Society of Mechanical Engineers (ASME), 2021)This study investigates the heat transport mechanism in semiconductor elements within a homogeneous thermoelectric cooling system using the dualphaselag (DPL) model. The thermal lagging behavior is analyzed and explored ... -
Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review
(The American Society of Mechanical Engineers (ASME), 2022)Pool boiling heat transfer offers high-performance cooling opportunities for thermal problems of electronics limited with high heat fluxes. Therefore, many researchers have been extensively studying over the last six ... -
Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink
(The American Society of Mechanical Engineers (ASME), 2022)The increased power consumption and continued miniaturization of high-powered electronic components have presented many challenges to their thermal management. To improve the efficiency and reliability of these devices, ... -
Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation
(The American Society of Mechanical Engineers (ASME), 2022)For micro-electronic components and systems, reliability under thermomechanical stress is of critical importance. Experimental characterization of hotspots and temperature gradients, which can lead to deformation in the ... -
Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation
(The American Society of Mechanical Engineers (ASME), 2022)Laser soldering is becoming more popular for soldering pin through-hole (PTH) components onto printed circuit boards (PCBs). Solder volume influences soldering joint reliability. However, it is difficult to accurately ... -
Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations
(The American Society of Mechanical Engineers (ASME), 2022)Although the reliability of flexible electronics during bending deformation is of great interest nowadays, the mechanical reliability that has mainly been investigated is of single electronic components or simple devices, ...