• Login
    View Item 
    •   DSpace Home
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   DSpace Home
    • ASME
    • Journal of Electronic Packaging
    • View Item
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis

    Thumbnail
    View/Open
    jert_138_05_052209.pdf (2.205Mb)
    Date
    2016
    Author
    Xiao, Yanyi
    Wang, Wen
    Zhang, Jianhua
    Metadata
    Show full item record
    Abstract
    Temperature distribution is the key factor affecting the bonding quality in the glass/glass laser bonding process. In this work, the finite element method was used to establish threedimensional (3D) numerical analysis model of the temperature field during bonding. Based on the result of the finite element analysis, the crucial parameters and their influences on the temperature distribution were discussed. In order to predetermine the necessary process parameter values for bonding, a nonlinear multiparameter fitting formula was established to predict the maximum temperature. The fitting model was validated experimentally by recording the maximum temperature during laser bonding via an infrared thermal imager.
    URI
    http://yetl.yabesh.ir/yetl/handle/yetl/160814
    Collections
    • Journal of Electronic Packaging

    DSpace software copyright © 2002-2015  DuraSpace
    Contact Us | Send Feedback
    Theme by 
    @mire NV
     

     

    Browse

    All of DSpaceCommunities & CollectionsBy Issue DateAuthorsTitlesSubjectsThis CollectionBy Issue DateAuthorsTitlesSubjects

    My Account

    LoginRegister

    Statistics

    View Usage Statistics

    DSpace software copyright © 2002-2015  DuraSpace
    Contact Us | Send Feedback
    Theme by 
    @mire NV