| dc.contributor.author | Xiao, Yanyi | |
| dc.contributor.author | Wang, Wen | |
| dc.contributor.author | Zhang, Jianhua | |
| dc.date.accessioned | 2017-05-09T01:27:29Z | |
| dc.date.available | 2017-05-09T01:27:29Z | |
| dc.date.issued | 2016 | |
| dc.identifier.issn | 1528-9044 | |
| dc.identifier.other | jert_138_05_052209.pdf | |
| dc.identifier.uri | http://yetl.yabesh.ir/yetl/handle/yetl/160814 | |
| dc.description.abstract | Temperature distribution is the key factor affecting the bonding quality in the glass/glass laser bonding process. In this work, the finite element method was used to establish threedimensional (3D) numerical analysis model of the temperature field during bonding. Based on the result of the finite element analysis, the crucial parameters and their influences on the temperature distribution were discussed. In order to predetermine the necessary process parameter values for bonding, a nonlinear multiparameter fitting formula was established to predict the maximum temperature. The fitting model was validated experimentally by recording the maximum temperature during laser bonding via an infrared thermal imager. | |
| dc.publisher | The American Society of Mechanical Engineers (ASME) | |
| dc.title | Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis | |
| dc.type | Journal Paper | |
| dc.journal.volume | 138 | |
| dc.journal.issue | 2 | |
| dc.journal.title | Journal of Electronic Packaging | |
| dc.identifier.doi | 10.1115/1.4033106 | |
| dc.journal.fristpage | 21006 | |
| dc.journal.lastpage | 21006 | |
| dc.identifier.eissn | 1043-7398 | |
| dc.tree | Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 002 | |
| dc.contenttype | Fulltext | |
