Journal of Electronic Packaging: Recent submissions
Now showing items 621-640 of 2123
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Effect of Indium Content on the Melting Point, Dross, and Oxidation Characteristics of Sn 2Ag 3Bi xIn Solders
(The American Society of Mechanical Engineers (ASME), 2013)This paper presents the effect of indium (In) content on the melting temperature, wettabililty, dross formation, and oxidation characteristics of the Sn2Ag3BixIn alloy. The melting temperature of the Sn2Ag3BixIn alloy ... -
Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid Liquid Interdiffusion Sn3.5Ag/Cu Substrate Solder Joints
(The American Society of Mechanical Engineers (ASME), 2013)The effect of joint size on the interfacial reaction in the Sn3.5Ag/Cusubstrate soldering system was examined. An experiment was conducted in which parameters such as bonding time, temperature, and pressure were varied at ... -
Promising Technology for Electronic Cooling: Nanofluidic Micro Pulsating Heat Pipes
(The American Society of Mechanical Engineers (ASME), 2013)Currently, the thermal management of microelectromechanical systems (MEMS) has become a challenge. In the present research, a micro pulsating heat pipe (MPHP) with a hydraulic diameter of 508 خ¼m, is experimented. The ... -
Study on Heat Conduction in a Simulated Multicore Processor Chip—Part I: Analytical Modeling
(The American Society of Mechanical Engineers (ASME), 2013)A system of temperature calculations is developed to study the conditions leading to hot spot occurrence on multicore processor chips. The analysis is performed on a physical model which incorporates certain salient features ... -
Development of a Fused Deposition Modeling System for Low Melting Temperature Metal Alloys
(The American Society of Mechanical Engineers (ASME), 2013)This research focused on extending the applications of fused deposition modeling (FDM) by extrusion and deposition of low melting temperature metal alloys to create threedimensional metal structures and singlelayer contacts ... -
Two Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module
(The American Society of Mechanical Engineers (ASME), 2013)Recent trends including rapid increases in the power ratings and continued miniaturization of semiconductor devices have pushed the heat dissipation of power electronics well beyond the range of conventional thermal ... -
Direct Write Stretchable Sensors Using Single Walled Carbon Nanotube/Polymer Matrix
(The American Society of Mechanical Engineers (ASME), 2013)There have been increasing demands and interests in stretchable sensors with the development of flexible or stretchable conductive materials. These sensors can be used for detecting large strain, 3D deformation, and a ... -
Inkjet Printing of Radio Frequency Electronics: Design Methodologies and Application of Novel Nanotechnologies
(The American Society of Mechanical Engineers (ASME), 2013)We discuss here the use of inkjet printing technology as an attractive alternative for the fabrication of radio frequency (RF) electronics. Inkjet printing is compared to widelyused traditional methods such as wet etching ... -
Temperature Dependent Electrical Characteristics of Ag Schottky Contacts to Differently Grown O Polar Bulk ZnO
(The American Society of Mechanical Engineers (ASME), 2013)The temperaturedependent electrical properties of Ag Schottky contacts to differently grown Opolar bulk ZnO single crystals were comparatively investigated in the temperature range of 100–300 K. Schottky contact to ... -
The Standardization of Printable Materials and Direct Writing Systems
(The American Society of Mechanical Engineers (ASME), 2013)Directwriting systems will be leading the future of additive manufacturing in that they have simple and costeffective processes. There are various types of directwriting systems, such as the rolltoroll (R2R), microdispensing ... -
Statistical Manufacturing Model of Printing Technology
(The American Society of Mechanical Engineers (ASME), 2013)There has been an evident increase in the demand for accurate and complex patterns for particles used in microsized electronic devices. Direct printing technology has been promoted as a solution for these needs, as the ... -
Enhanced Diffusion of Silver Atoms on the Surface of Nanoparticles at Low Temperatures
(The American Society of Mechanical Engineers (ASME), 2013)Microstructure development of 35 nm silver nanoparticles during the low temperature sintering was examined in situ as the ambient temperature increased from room temperature up to 450 آ°C using Xray diffraction and ... -
Synthesis of Silver Nanoparticles at the Liquid–Liquid Using Ultrasonic Wave
(The American Society of Mechanical Engineers (ASME), 2013)The high demand of flexible electronics and the miniaturization of electronic components have been increasing very rapidly. Nanotechnology and in particular nanoparticles have become very important for the development of ... -
Computational Monolayer for Tertiary Nanoparticles Using Supercomputer
(The American Society of Mechanical Engineers (ASME), 2013)Computer simulation is a practical approach for the accurate study of nanosized materials. In order to produce conductive nanoinks for microelectrodes, we need to simulate different nanoparticles (NPs)’ arrangements to ... -
Preparation of Water Based Carbon Nanotube Inks and Application in the Inkjet Printing of Carbon Nanotube Gas Sensors
(The American Society of Mechanical Engineers (ASME), 2013)Waterbased carbon nanotube (CNT) is highly desirable for inkjet printing devices due to its environmentally benign and lowcost features. To improve the dispersion of CNT in water, oxygencontaining functional groups are ... -
Introduction for JEP Special Issue on Printed Electronics
(The American Society of Mechanical Engineers (ASME), 2013)While the use of metal movabletype printing was first invented in Asia as early as the 13th century, the westernstyle printing press was not fully adopted until centuries later. Since then, printing technologies have evolved ... -
Reviewer Acknowledgment for the Journal of Electronic Packaging
(The American Society of Mechanical Engineers (ASME), 2013) -
Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method
(The American Society of Mechanical Engineers (ASME), 2012)The quality and reliability of interconnects in microelectronics is a major challenge considering the increasing level of integration and high current densities. This work studied the problem of ... -
Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies
(The American Society of Mechanical Engineers (ASME), 2012)Underfilling will almost certainly improve the performance of an area array assembly in drop, vibration, etc. However, depending on the selection of materials, the thermal fatigue life may easily ... -
Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test
(The American Society of Mechanical Engineers (ASME), 2012)In this study, a lead-free dummy plastic ball grid array component with daisy-chains and Sn4.0 Ag0.5 Cu Pb-free solder balls was assembled on an halogen-free high density interconnection printed ...