Journal of Electronic Packaging: Recent submissions
Now showing items 641-660 of 2123
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Bio-inspired Passive Skin Cooling for Handheld Microelectronics Devices
(The American Society of Mechanical Engineers (ASME), 2012)Increasing functionality demands more heat dissipation from the skin of handheld devices. The maximum amount of heat that can be dissipated passively, prescribed by the natural convection and ... -
Performance Study of a 980 nm GaAs Based Laser Diode Chip in a Moisture Condensing Environment
(The American Society of Mechanical Engineers (ASME), 2012)This paper presents a performance study done on a semiconductor laser diode in a moisture condensing environment. Devices with laser diodes are used in a wide variety of electronic applications ... -
Performance of Axial Fans in Close Proximity to the Electromagnetic Compatibility Screens
(The American Society of Mechanical Engineers (ASME), 2012)The performance of axial fans in close proximity to the electromagnetic compatibility (EMC) screens was analyzed by means of an experimental parametric study. The following geometrical parameters ... -
Optimization of Heating Temperature History for Anisotropic Conductive Film Interconnection
(The American Society of Mechanical Engineers (ASME), 2012)Anisotropic conductive film (ACF) interconnection is used for mounting electronic components, because this method can decrease the mounting area and electric connection length, as well as the ... -
Thermal Energy Storage Thermal Response Model With Application to Thermal Management of High Power-Density Hand-Held Electronics
(The American Society of Mechanical Engineers (ASME), 2012)An important design objective that is unique to hand-held units is the need to constrain two temperatures: the maximum temperature of the electronic components and the maximum skin temperature ... -
Comparison Between Numerical and Experimental Results of Airflow Distribution in Diffuser Based Data Center
(The American Society of Mechanical Engineers (ASME), 2012)This paper studies the flow and temperature patterns in an overhead diffuser based data center. In-situ measurements of the data center were carried out to validate a mathematic model for ... -
An Experimental and Computational Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic Packages
(The American Society of Mechanical Engineers (ASME), 2012)Moisture induced epoxy swelling is a potential failure mechanism in nonhermetic packages. Epoxy materials used in the package absorb moisture and swell in a relatively humid environment. This ... -
Influence of Gap Height in Flip Chip Underfill Process With Non-Newtonian Flow Between Two Parallel Plates
(The American Society of Mechanical Engineers (ASME), 2012)In this paper, the finite volume method (FVM) is used for the simulation of flip chip underfill process by considering non-Newtonian flow between two parallel plates that emulate the silicon ... -
Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO3 Composite Dielectric
(The American Society of Mechanical Engineers (ASME), 2012)Accelerated temperature and voltage stress tests were conducted on embedded planar capacitors with epoxy–BaTiO3 composite dielectric. The failure modes were found to be a sudden increase in the ... -
Array of Thermoelectric Coolers for On-Chip Thermal Management
(The American Society of Mechanical Engineers (ASME), 2012)Site-specific on-demand cooling of hot spots in microprocessors can reduce peak temperature and achieve a more uniform thermal profile on chip, thereby improve chip performance and increase the ... -
Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps
(The American Society of Mechanical Engineers (ASME), 2012)Since the thickness of stacked silicon chips in 3D integration has been thinned to less than 100 μm, the local thermal deformation of the chips has increased drastically because of the decrease ... -
A Multiphysics Finite Element Model of a 35A Automotive Connector Including Multiscale Rough Surface Contact
(The American Society of Mechanical Engineers (ASME), 2012)Electrical contacts influence the reliability and performance of relays, electrical connectors, high power connectors, and similar systems, and are therefore a key region which needs to be ... -
Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control
(The American Society of Mechanical Engineers (ASME), 2012)Robust precision temperature control of heat-dissipating photonics components is achieved by mounting them on thermoelectric modules (TEMs), which are in turn mounted on heat sinks. However, the ... -
Multiobjective Optimization of a Pin-Fin Heat Sink Using Evolutionary Algorithms
(The American Society of Mechanical Engineers (ASME), 2012)This paper presents the use of multiobjective evolutionary algorithms for the optimal geometrical design of a pin-fin heat sink. The multiobjective design problem is posed to minimize two ... -
40 μm Copper–Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding
(The American Society of Mechanical Engineers (ASME), 2012)Copper–silver (Cu–Ag) composite flip-chip interconnect between silicon (Si) chips and Cu substrates is demonstrated. Array of Cu–Ag columns, each 28 μm in height and 40 μm in diameter, is ... -
Influences of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronic Devices Assembly
(The American Society of Mechanical Engineers (ASME), 2012)Solder self-alignment is an important phenomenon enabling cost-effective optoelectronics assembly. In this study, the wetting of Sn-rich solder to under bump metallization (UBM) pads is identified ... -
Vacuum Packaging of MEMS by Self-Assembly
(The American Society of Mechanical Engineers (ASME), 2012)The development of a solder-based vacuum bonding technique for micro-electro mechanical systems (MEMS) applications is presented. A chip with a micro-sensor was bonded to a cover plate to form ... -
Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects
(The American Society of Mechanical Engineers (ASME), 2012)Understanding the effect of high current density on void formation and growth and relating the size of the void to the resulting electrical/mechanical failure is a critical need at the present ... -
Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact
(The American Society of Mechanical Engineers (ASME), 2012)Leading indicators of failure have been developed based on high-frequency characteristics, and system-transfer function derived from resistance spectroscopy measurements during shock and vibration. ... -
An Overview of the IBM Power 775 Supercomputer Water Cooling System
(The American Society of Mechanical Engineers (ASME), 2012)In 2008 IBM reintroduced water cooling technology into its high performance computing platform, the Power 575 Supercomputing node/system. Water cooled cold plates were used to cool the processor ...