Journal of Electronic Packaging: Recent submissions
Now showing items 661-680 of 2123
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Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package
(The American Society of Mechanical Engineers (ASME), 2012)Thermal conduction and mechanical stresses in through silicon via (TSV) structures in three dimensional system in package (3D SiP) under device operation condition were discussed. A large scale ... -
Optimization of Enclosed Aisle Data Centers Using Bypass Recirculation
(The American Society of Mechanical Engineers (ASME), 2012)The work presented in this paper describes a simplified thermodynamic model that can be used for exploring optimization possibilities in air-cooled data centers. The model is used to evaluate ... -
Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages
(The American Society of Mechanical Engineers (ASME), 2012)Today’s consumer market demands electronics that are smaller, faster, and cheaper. To cater to these demands, novel materials, new designs, and new packaging technologies are introduced frequently. ... -
Special Issue Dedicated to Professor Avi Bar-Cohen in Celebration of His 65th Birthday
(The American Society of Mechanical Engineers (ASME), 2012) -
Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique
(The American Society of Mechanical Engineers (ASME), 2012)The next generation of thermal interface materials (TIMs) are currently being developed to meet the increasing demands of high-powered semiconductor devices. In particular, a variety of nanostructured ... -
Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in a Three-Dimensional Joint Structure
(The American Society of Mechanical Engineers (ASME), 2012)Portable electric devices such as mobile phones and portable music players have become compact and improved their performance. High-density packaging technology such as chip size package (CSP) ... -
Effect of Shield-Can on Dynamic Response of Board-Level Assembly
(The American Society of Mechanical Engineers (ASME), 2012)In order to protect the electronic components of electronic devices on a printed circuit board (PCB) against electromagnetic radiation, a conductive shield-can or box is normally attached to the ... -
Thermal Assessment of Naturally Cooled Electronic Enclosures With Rectangular Fins
(The American Society of Mechanical Engineers (ASME), 2012)Passive heat transfer from enclosures with rectangular fins is studied both experimentally and theoretically. Several sample enclosures with various lengths are prepared and tested. To calibrate ... -
Bulk Resistance Evaluation of Anisotropic Conductive Adhesive Particles Considering the Current Bending Effect
(The American Society of Mechanical Engineers (ASME), 2012)Because it is difficult to accurately estimate the electric resistance of anisotropic conductive adhesive (ACA) joints, the ACA’s applications in high density packaging field have been greatly ... -
Absorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants
(The American Society of Mechanical Engineers (ASME), 2012)The ionic liquid butylmethylimidazolium hexafluorophosphate (bmim)(PF6 ) and five different hydrofluorocarbon refrigerants were investigated as the working fluid pairs for a waste-heat driven absorption ... -
Norris–Landzberg Acceleration Factors and Goldmann Constants for SAC305 Lead-Free Electronics
(The American Society of Mechanical Engineers (ASME), 2012)Goldmann constants and Norris–Landzberg acceleration factors for SAC305 lead-free solders have been developed based on principal component regression models (PCR) for reliability prediction and part ... -
Monitoring Fatigue Cracking in Interconnects in a Ball Grid Array by Measuring Electrical Resistance
(The American Society of Mechanical Engineers (ASME), 2012)In displacement controlled mechanical fatigue of ball grid solder interconnect arrays, decrease in maximum load monitors total increase in crack area in an array while electrical resistance ... -
Impact of Self-Assembly Process Errors on Thermoelectric Performance
(The American Society of Mechanical Engineers (ASME), 2012)Thermoelectric devices have many scaling benefits that motivate miniaturization, but assembly of small components is a significant challenge. Self-assembly provides a promising method for integrating ... -
Parameter Calibrations on MOSFET Stress Sensors
(The American Society of Mechanical Engineers (ASME), 2012)Due to the carrier mobility changes with the mechanical loading and its small size, the MOSFET (metal-oxide-semiconductor field-effective-transistor) has the potential to be a suitable chip stress ... -
Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices
(The American Society of Mechanical Engineers (ASME), 2012)This investigation is aimed at the modeling of both the fabrication process and the reliability of press-fit interconnections on moulded interconnect devices (MID). These are multifunctional ... -
Study of Solder/Copper Interface Behavior Under Varying Strain Rates
(The American Society of Mechanical Engineers (ASME), 2012)This paper investigates the mechanical behavior of a copper–solder interface when subjected to varying strain rate loading between 0.05 s−1 and 10.0 s−1 . The copper is alloy 101, and the ... -
Characterization of Compressive Die Stresses in CBGA Microprocessor Packaging Due to Component Assembly and Heat Sink Clamping
(The American Society of Mechanical Engineers (ASME), 2012)Microprocessor packaging in modern workstations and servers often consists of one or more large flip chip die that are mounted to a high performance ceramic chip carrier. The final assembly ... -
Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling
(The American Society of Mechanical Engineers (ASME), 2012)With the increasing output power of the integrated circuit chips, the heat flux involved is being accordingly increased. In such situation, the air has almost reached its limit of cooling ... -
Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling
(The American Society of Mechanical Engineers (ASME), 2012)The ever increasing power density in modern semiconductor devices requires heat dissipation solution such as heat sink to remove heat away from the device. A compressive loading is usually ... -
Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level
(The American Society of Mechanical Engineers (ASME), 2012)Reliability of electronic assemblies at board level and solder joint integrity depend upon the stress applied to the assembly. The stress is often of thermomechanical or of vibrational nature. ...