Journal of Electronic Packaging: Recent submissions
Now showing items 681-700 of 2123
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From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency
(The American Society of Mechanical Engineers (ASME), 2012)The power consumption of the chip package is known to vary with operating temperature, independently of the workload processing power. This variation is commonly known as chip leakage power, ... -
Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste
(The American Society of Mechanical Engineers (ASME), 2012)Conduction-cooled high power laser diodes have a variety of significant commercial, industrial, and military applications. For these devices to perform effectively, an appropriate die-attached ... -
Confined, Milliscale Unsteady Laminar Impinging Slot Jets: Effects of Slot Width on Surface Stagnation Point Nusselt Numbers
(The American Society of Mechanical Engineers (ASME), 2012)The effects of slot width for confined, laminar impinging slot jets of millimeter-scale are considered, including experimental measurements of spatially resolved distributions of local Nusselt ... -
Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications
(The American Society of Mechanical Engineers (ASME), 2012)Thermally conductive composites as compared to metals have reduced density, decreased oxidation, and improved chemical resistance, as well as adjustable properties to fit a given application. ... -
From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiencyor1
(The American Society of Mechanical Engineers (ASME), 2012)In the drive to enhance data center energy efficiency, much attention has been placed on the prospect of airflow containment in hot-aisle cold-aisle raised floor arrangements. Such containment ... -
Optimization and Design of a Multipass Branching Microchannel Heat Sink for Electronics Cooling
(The American Society of Mechanical Engineers (ASME), 2012)This article is focused on the optimization and design of a multipass branching microchannel heat sink for high heat flux electronics cooling applications. A multiphysics topology optimization ... -
Pull Force and Displacement of Cu/Au Wire Interconnects
(The American Society of Mechanical Engineers (ASME), 2012)The pull force and displacement of gold (Au) and copper (Cu) wires in microelectronics are investigated in this study. Emphasis is placed on (1) the development of a set of equations for ... -
Heat Transfer of an IGBT Module Integrated With a Vapor Chamber
(The American Society of Mechanical Engineers (ASME), 2011)Presently, many methods are adopted to reduce the junction-to-case thermal resistance (Rjc) of insulated-gate bipolar transistor (IGBT) modules in order to increase their power density. One of ... -
An Artificial Neural Network Approach to Cooling Analysis of Electronic Components in Enclosures Filled With Nanofluids
(The American Society of Mechanical Engineers (ASME), 2011)Computational fluid dynamics (CFD) and artificial neural network (ANN) are used to examine the cooling performance of two electronic components in an enclosure filled with a Cu-water nanofluid. ... -
Improved Packaging Design for Maximizing the Thermal Performance of Multifinger Collector-Up HBTs
(The American Society of Mechanical Engineers (ASME), 2011)Advanced collector-up (C-up) heterojunction bipolar transistors (HBTs) with the thermal-via configuration (TVC) have been analyzed using a genetic algorithm (GA). Novel packaging structures are ... -
Thermal Investigation and Placement Design of High-Brightness LED Array Package on PCB for Uniform Illuminance
(The American Society of Mechanical Engineers (ASME), 2011)This paper reports the thermal performance of a high-brightness light-emitting diode (LED) array package with a novel placement method on a printed circuit board (PCB). The precise heat transfer ... -
Packaging of Phosphor Based High Power White LEDs: Effects of Phosphor Concentration and Packaging Configuration
(The American Society of Mechanical Engineers (ASME), 2011)Two types of packaged white light emitting diodes in which one has a flat-top (FT) emitting surface and the other is a flat-top-with-lens (FTWL) type are fabricated by using the same leadframe ... -
Numerical and Experimental Study of the Effect of Underfloor Blockages on Data Center Performance
(The American Society of Mechanical Engineers (ASME), 2011)Due to the increase in computer rack equipment power in recent years, thermal management of data centers has become a challenging problem. Data center facilities with raised floor plenums are ... -
Conjugate Thermal Transport in Gas Flow in Long Rectangular Microchannel
(The American Society of Mechanical Engineers (ASME), 2011)This paper is directed at the numerical simulation of pressure-driven nitrogen slip flow in long microchannels, focusing on conjugate heat transfer under uniform heat flux wall boundary condition. ... -
Boiling Heat Transfer and Flow Regimes in Microchannels—A Comprehensive Understanding
(The American Society of Mechanical Engineers (ASME), 2011)Flow boiling in microchannels has been investigated extensively over the past decade for electronics cooling applications; however, the implementation of microchannel heat sinks operating in the ... -
Film Thickness and Heat Transfer Measurements in a Spray Cooling System With R134a
(The American Society of Mechanical Engineers (ASME), 2011)Experimental measurements in a spray cooling test rig have been carried out for several heat fluxes in the heater and different spray volumetric fluxes with the dielectric refrigerant R134a. ... -
Thermal Investigations of Integrated Circuits and Systems, THERMINIC'09
(The American Society of Mechanical Engineers (ASME), 2011)Microelectronics thermal experts from four continents met in the fall of 2009 at the 15th THERMINIC Workshop in Leuven, Belgium. The event was sponsored by the IEEE Computer Society Test ... -
Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages
(The American Society of Mechanical Engineers (ASME), 2011)In the current study, a network-based resistor model has been developed for thermal analysis of a complex opto-electronic package called small form-factor pluggable device (SFP). This is done ... -
From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet
(The American Society of Mechanical Engineers (ASME), 2011)To achieve reductions in the power consumption of the data center cooling infrastructure, the current strategy in data center design is to increase the inlet temperature to the rack, while the ... -
A Thermomechanical Solver for Multilayer Power Electronic Assemblies Integrated Into the DJOSER Thermal Simulator
(The American Society of Mechanical Engineers (ASME), 2011)The DJOSER analytical thermal solver for multilayer mounting structures has been tested as a useful and friendly tool for the thermal analysis of power electronic devices and their packages, ...