Journal of Electronic Packaging: Recent submissions
Now showing items 701-720 of 2123
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Thermal Transport in Self-Assembled Conductive Networks for Thermal Interface Materials
(The American Society of Mechanical Engineers (ASME), 2011)We present a concept for development of high thermal conductivity thermal interface materials (TIMs) via a rapid formation of conductive network. In particular we use molecular dynamics simulations ... -
Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects
(The American Society of Mechanical Engineers (ASME), 2011)New nondestructive inspection methods with high spatial resolution are expected to support the evaluation and enhancement of the reliability of microjoints on printed circuit boards. An X-ray ... -
Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly
(The American Society of Mechanical Engineers (ASME), 2011)Five halogen-free (HF) dummy plastic ball grid array (PBGA) components with daisy-chains and Sn4.0Ag0.5Cu (SAC405) Pb-free solder balls were assembled on a HF high density interconnection (HDI) ... -
Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates
(The American Society of Mechanical Engineers (ASME), 2011)Pure gold (Au) is used as a bonding medium to bond silicon (Si) chips to alumina substrates. The bonding process is performed at 260 °C with only 150 psi (1.0 MPa) static pressure ... -
Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging
(The American Society of Mechanical Engineers (ASME), 2011)A fundamental study is carried out to investigate the microstructure and surface treatment possibilities of 304 stainless steel (304SS) substrates. To expose the microstructure, mirror-finished ... -
Simplified Thermal Model of a Stacked Ball Grid Array Package
(The American Society of Mechanical Engineers (ASME), 2011)Simplified integrated approaches to thermal modeling of electronics packages call for fast and easy thermal models. However, this is often in contrast with the complexity of the thermal problem ... -
Effects of Cycling Parameters on the Thermal Fatigue Life of Mixed SnAgCu/SnPb Solder Joints
(The American Society of Mechanical Engineers (ASME), 2011)The mandated switch of the overwhelming part of microelectronics assembly to lead-free soldering has left the manufacturers of many high reliability products, which are still exempt from the ... -
Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations
(The American Society of Mechanical Engineers (ASME), 2011)Reported in this paper is a quantum mechanics study on the electronic structure and contact resistance at the interfaces formed when an open-end single-walled carbon nanotube (CNT) is in ... -
Oxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix Composites
(The American Society of Mechanical Engineers (ASME), 2011)We report a 40% improvement of the thermal conductivity of graphite nanoplatelets–epoxy composites by chemical functionalization of graphite nanoplatelets utilizing nitric acid treatment, which also ... -
A Review of Carbon Nanotube Ensembles as Flexible Electronics and Advanced Packaging Materials
(The American Society of Mechanical Engineers (ASME), 2011)The exceptional electronic, thermal, mechanical, and optical characteristics of carbon nanotubes offer significant improvement in diverse applications such as flexible electronics, energy conversion, ... -
Synthesis of Double Wall Carbon Nanotubes Using Sulfur as Catalyst
(The American Society of Mechanical Engineers (ASME), 2011)The requirements of simple and reliable protocols for the synthesis of nanostructures with controlled morphology continue to be a major challenge in nanoscale. We demonstrate a novel and simplified ... -
Introduction for JEP Special Issue on Carbon Nanotubes
(The American Society of Mechanical Engineers (ASME), 2011)Since the first identification of carbon nanotubes in 1991, more than 60,000 research papers have been published (with around 3500 papers just published in 2009), reporting findings on electrical, ... -
Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces
(The American Society of Mechanical Engineers (ASME), 2011)Carbon nanotube (CNT) arrays can be effective thermal interface materials with high compliance and conductance over a wide temperature range. Here, we study CNT interface structures in which ... -
Application of Carbon Nanotubes to Thermal Interface Materials
(The American Society of Mechanical Engineers (ASME), 2011)Improvements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages and reduce high temperatures. TIMs are generally composed of highly conductive particle fillers ... -
The Effects of Thermal Loading on the Mechanical Properties of Interfaces of Dissimilar Materials by Nanoindentation Simulations
(The American Society of Mechanical Engineers (ASME), 2011)Heat transfer across the interfaces of dissimilar materials is a critical consideration in a wide variety of scientific and engineering applications. In this paper, molecular dynamics (MD) ... -
The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulations
(The American Society of Mechanical Engineers (ASME), 2011)The unravelling of (10, 10) and (18, 0) single-walled carbon nanotubes (SWCNTs) is simulated using molecular dynamics simulations at different temperatures. Two different schemes are proposed to ... -
Three-Dimensional CFD Model of Pressure Drop in µTAS Devices in a Microchannel
(The American Society of Mechanical Engineers (ASME), 2011)Microposts are utilized to enhance heat transfer, adsorption/desorption, and surface chemical reactions. In a previous study [Yeom et al. , J. Micromech. Microeng., 19, p. 065025 (2009)], based ... -
40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding
(The American Society of Mechanical Engineers (ASME), 2011)Formation of pure silver (Ag) flip-chip interconnect of silicon (Si) chips on copper (Cu) substrates is reported. Arrays of Ag columns, each 36 μm in height and 40 μm in diameter, are ... -
Impact of Printed Circuit Board Via and Micro-Via Structures on Component Thermal Performances
(The American Society of Mechanical Engineers (ASME), 2011)Latest electronic component package types are pushing the need to more efficiently remove the dissipated heat using optimized thermal paths going through the printed circuit board (PCB) to reach ... -
Accelerated Life Testing in Epoxy Packaged High Luminosity Light Emitting Diodes
(The American Society of Mechanical Engineers (ASME), 2011)In this work, we have evaluated the reliability of epoxy packaged light emitting diodes (LEDs) for outdoor applications by specific tests to enhance catastrophic failures that appear under high ...