Journal of Electronic Packaging: Recent submissions
Now showing items 721-740 of 2123
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From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy
(The American Society of Mechanical Engineers (ASME), 2011)The chiller cooled data center environment consists of many interlinked elements that are usually treated as individual components. This chain of components and their influences on each other ... -
On the Strain Rate- and Temperature-Dependent Tensile Behavior of Eutectic Sn–Pb Solder
(The American Society of Mechanical Engineers (ASME), 2011)The present study examines the thermomechanical strain-rate sensitivity of eutectic 63Sn–37Pb solder over a broad range of strain-rates from 0.0002 s–1 to 200 s–1 , thus encompassing failure ... -
Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards
(The American Society of Mechanical Engineers (ASME), 2011)A low-cost (with bare chips) and high (optical, electrical, thermal, and mechanical) performance optoelectronic system embedded into a PCB (printed circuit board) or an organic laminated substrate ... -
Joint Level Test Methods for Solder Pad Cratering Investigations
(The American Society of Mechanical Engineers (ASME), 2011)The introduction of less compliant lead free solders together with weaker and more brittle laminate materials has led to major concerns with respect to the resistance of the latter to pad ... -
Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System
(The American Society of Mechanical Engineers (ASME), 2011)Comprehensive analysis of microelectronic cooling systems utilizing thermoelectric modules is time consuming because it involves solving many parametric equations, which require solving complex ... -
Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop Impact Loading
(The American Society of Mechanical Engineers (ASME), 2011)The significant difference between failure modes of lead-containing and lead-free solder joints under drop impact loading remains to be not well understood. In this paper, we propose a feasible ... -
Prediction of Electromigration Failure of Solder Joints and Its Sensitivity Analysis
(The American Society of Mechanical Engineers (ASME), 2011)Electromigration (EM) in solder joints under high current density has become a critical reliability issue for the future high density microelectronic packaging. This paper presents atomic density ... -
Thermo-Mechanical Response of Thru-Silicon Vias Under Local Thermal Transients Using Experimentally Validated Finite Element Models
(The American Society of Mechanical Engineers (ASME), 2011)Significant research has focused on the reliability of through-silicon-vias (TSVs) under conventional uniform thermal loading conditions such as accelerated thermal cycling (0–100 °C) or deep ... -
Evaluating Life-Cycle Environmental Impact of Data Centers
(The American Society of Mechanical Engineers (ASME), 2011)Numerous evaluation metrics and standards are being proposed across industry and government to measure and monitor the energy efficiency of data centers. However, the energy use of data centers ... -
Optimization of Parallel, Horizontal, and Laminar Forced Air-Cooled Heat Generating Boards
(The American Society of Mechanical Engineers (ASME), 2011)The objective of this study is to predict numerically the optimal spacing between parallel heat generating boards. The isothermal boards are stacked in a fixed volume of electronic package ... -
Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results
(The American Society of Mechanical Engineers (ASME), 2011)In this study, the transient response of electronic assemblies to mechanical loading encountered in drop and shock conditions are investigated with transient finite element methods. Many manufacturers ... -
Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations
(The American Society of Mechanical Engineers (ASME), 2011)Reliable drop test simulations of electronic packages require reliable material characterization of solder joints. Mechanical properties of lead-free solder were here experimentally investigated for ... -
Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change
(The American Society of Mechanical Engineers (ASME), 2011)When two thin plates or layers are bonded together, an extremely thin bond layer of third material exists between the two layers. This research work examines the effect of bond layer on the ... -
Thermal Modeling Technique for Multiple Transistors Within Silicon Chip
(The American Society of Mechanical Engineers (ASME), 2011)Although thermal performance is always a critical issue in electronic packaging design at every packaging level, there is a significant lack of reliable and efficient thermal modeling and analysis ... -
Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model
(The American Society of Mechanical Engineers (ASME), 2011)In this paper, the packaging aspects of directly modulated laser (DML) modules are investigated using detailed electromagnetic (EM) simulations. The packaging influences of the laser module are ... -
A Creep Model for Solder Alloys
(The American Society of Mechanical Engineers (ASME), 2011)Demand for long-term reliability of electronic packaging has lead to a large number of studies on viscoplastic behavior of solder alloys. Various creep models for solder alloys have been proposed. ... -
Constructal Design Applied to the Geometric Optimization of Y-shaped Cavities Embedded in a Conducting Medium
(The American Society of Mechanical Engineers (ASME), 2011)In this paper, we rely on the Constructal method to optimize the geometry of a Y-shaped cavity embedded into a solid conducting wall. The structure has four degrees of freedom. The objective ... -
Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental Results
(The American Society of Mechanical Engineers (ASME), 2011)The development of portable electronics poses design challenges when evolving new designs for high strain-rate life cycle loading, such as in drop events, blast events, vibration, ultrasonic ... -
Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C
(The American Society of Mechanical Engineers (ASME), 2011)Silver (Ag) foils are bonded to alumina substrates by a low temperature solid state bonding process. The alumina substrate is premetalized with 40 nm titanium tungsten (TiW) and 2.54 μm gold ... -
A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems
(The American Society of Mechanical Engineers (ASME), 2011)Three dimensional (3D) integration offers numerous electrical advantages like shorter interconnection distances between different dies in the stack, reduced signal delay, reduced interconnect power ...