Journal of Electronic Packaging: Recent submissions
Now showing items 741-760 of 2123
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Self-Driven Electronic Cooling Based on Thermosyphon Effect of Room Temperature Liquid Metal
(The American Society of Mechanical Engineers (ASME), 2011)Thermal management has been a critical issue for the safe running of an electronic device. Driving liquid metal with low melting point to extract heat from the thermal source is highly efficient ... -
Downhole Electronics Cooling Using a Thermoelectric Device and Heat Exchanger Arrangement
(The American Society of Mechanical Engineers (ASME), 2011)This paper investigates the use of thermoelectric (TE) devices for thermal management of downhole electronics. The research carried out will help in the mitigation of costs associated with thermal ... -
Different Conservation Laws Constructed on Warpage Analyses for Bimaterial Plates With Temperature-Dependent Properties
(The American Society of Mechanical Engineers (ASME), 2011)Polymeric material has been applied in electronic product extensively, especially for packaging applications, thus thermomechanical analyses for encapsulated structure are frequently encountered. ... -
Two-Phase Microchannel Heat Sinks: Theory, Applications, and Limitations
(The American Society of Mechanical Engineers (ASME), 2011)Boiling water in small channels that are formed along turbine blades has been examined since the 1970s as a means to dissipating large amounts of heat. Later, similar geometries could be found ... -
Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections
(The American Society of Mechanical Engineers (ASME), 2011)Finite element modeling (FEM) is an important component in the design of reliable chip-to-substrate connections. However, FEM can quickly become complex as the number of input/output connections ... -
Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel
(The American Society of Mechanical Engineers (ASME), 2011)Thermal analysis with comprehensive treatment of conjugate heat transfer is performed in this study for discrete flush-mounted heat sources in a horizontal channel cooled by air. The numerical ... -
The Use of Potting Materials for Electronic-Packaging Survivability in Smart Munitions
(The American Society of Mechanical Engineers (ASME), 2011)Potted electronics are becoming more common in precision-guided artillery due to demands for increased structural-robustness. In field artillery applications, the potted electronics are inactive for ... -
Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag., 127, pp. 147–156)
(The American Society of Mechanical Engineers (ASME), 2011)We respond to the technical content of the discussion as follows: -
Discussion: “Yield Function for Solder Elastoviscoplastic Modeling” (Dube, M., and Kundu, T., 2005, ASME J. Electron. Packag., 127, pp. 147–156)
(The American Society of Mechanical Engineers (ASME), 2011)This Discussion is submitted with the understanding that the authors would respond only to the technical issues with appropriate proofs and not address unrelated items and attack others’ work. ... -
Evaluation of Transverse Shear Effect on Film Delamination in Blister Test
(The American Society of Mechanical Engineers (ASME), 2010)The transverse shear effect has been frequently ignored in determining the debonding-related energy release rate and the phase angle in the blister test, resulting in underestimated values. This ... -
Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement
(The American Society of Mechanical Engineers (ASME), 2010)A three-dimensional numerical model is developed to simulate the mold filling behavior in the plastic encapsulation of microchips. The conventional Hele–Shaw approximation is inadequate to analyze ... -
Editorial
(The American Society of Mechanical Engineers (ASME), 2010)This issue of the Journal of Electronic Packaging has six papers selected from the second international conference on thermal issues in emerging technologies theory and applications. This conference ... -
Electromigration Simulation for Metal Lines
(The American Society of Mechanical Engineers (ASME), 2010)As the electronics industry continues to push for high performance and miniaturization, the demand for higher current densities, which may cause electromigration failures in an IC, interconnects. ... -
Numerical and Experimental Study of Interface Delamination in Flip Chip BGA Package
(The American Society of Mechanical Engineers (ASME), 2010)The reliability of the flip chip package is strongly influenced by underfill, which has a much higher coefficient of thermal expansion (CTE) compared with other packaging materials and leads ... -
Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages
(The American Society of Mechanical Engineers (ASME), 2010)Board-level thermomechanical fatigue lifetimes of five different wafer-level chip scale packages (WCSPs) with lead-free solder joints were studied by both experiment and finite element method ... -
High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer
(The American Society of Mechanical Engineers (ASME), 2010)This paper describes the development and characterization of anisotropically conductive films (ACFs) incorporated with copper (Cu) particles as electrically conductive fillers for environmentally ... -
Design of a Static TIM Tester
(The American Society of Mechanical Engineers (ASME), 2010)Testing the thermal properties of thermal interface material (TIM) has been a big challenge for decades. Recent development trends made this challenge even bigger, as now the values that have ... -
Evaluation of Stress Effects on Electrical Characteristics of N-Type MOSFETs: Variations of DC Characteristics During the Resin-Molding Process
(The American Society of Mechanical Engineers (ASME), 2010)Stress-induced changes in the electrical characteristics of a semiconductor device become a major concern in the production of semiconductor packages because the electrical characteristics are ... -
An Inverse Problem in Estimating the Volumetric Heat Generation for a Three-Dimensional Encapsulated Chip
(The American Society of Mechanical Engineers (ASME), 2010)A three-dimensional inverse heat conduction problem is solved in the present study by using the conjugate gradient method (CGM) and the general-purpose commercial code CFD−ACE+ to estimate the ... -
Viscous Scaling Phenomena in Miniature Centrifugal Flow Cooling Fans: Theory, Experiments and Correlation
(The American Society of Mechanical Engineers (ASME), 2010)This paper analyzes the scale effects that occur in miniature centrifugal flow fans and investigates the possibility of optimizing blade geometry so that performance can be enhanced. Such fans ...