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Journal of Electronic Packaging
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Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag., 127, pp. 147–156)
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JEPAE4-26319#045502_1.pdf (72.77Kb)
Date
2011
Author
M. Dube
T. Kundu
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Abstract
We respond to the technical content of the discussion as follows:
URI
http://yetl.yabesh.ir/yetl/handle/yetl/145761
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