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    Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag., 127, pp. 147–156)

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    JEPAE4-26319#045502_1.pdf (72.77Kb)
    Date
    2011
    Author
    M. Dube
    T. Kundu
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    Abstract
    We respond to the technical content of the discussion as follows:
    URI
    http://yetl.yabesh.ir/yetl/handle/yetl/145761
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