Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag., 127, pp. 147–156)

dc.contributor.author	M. Dube
dc.contributor.author	T. Kundu
dc.date.accessioned	2017-05-09T00:43:05Z
dc.date.available	2017-05-09T00:43:05Z
dc.date.copyright	December, 2011
dc.date.issued	2011
dc.identifier.issn	1528-9044
dc.identifier.other	JEPAE4-26319#045502_1.pdf
dc.identifier.uri	http://yetl.yabesh.ir/yetl/handle/yetl/145761
dc.description.abstract	We respond to the technical content of the discussion as follows:
dc.publisher	The American Society of Mechanical Engineers (ASME)
dc.title	Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag., 127, pp. 147–156)
dc.type	Journal Paper
dc.journal.volume	133
dc.journal.issue	4
dc.journal.title	Journal of Electronic Packaging
dc.identifier.doi	10.1115/1.4000902
dc.journal.fristpage	45502
dc.identifier.eissn	1043-7398
dc.keywords	Electrons AND Solders
dc.tree	Journal of Electronic Packaging:;2011:;volume( 133 ):;issue: 004
dc.contenttype	Fulltext