Journal of Electronic Packaging: Recent submissions
Now showing items 761-780 of 2123
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Data Center Housing High Performance Supercomputer Cluster: Above Floor Thermal Measurements Compared To CFD Analysis
(The American Society of Mechanical Engineers (ASME), 2010)With the ever increasing heat dissipated by information technology (IT) equipment housed in data centers, it is becoming more important to project the changes that can occur in the data center ... -
Numerical Modeling of Perforated Tile Flow Distribution in a Raised-Floor Data Center
(The American Society of Mechanical Engineers (ASME), 2010)This paper is centered on quantifying the effect of computer room and computer room air conditioning (CRAC) unit modeling on the perforated tile flow distribution in a representative raised-floor ... -
Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers
(The American Society of Mechanical Engineers (ASME), 2010)Presently, stack dice are used widely as low-power memory applications because thermal management of 3D architecture such as high-power processors inherits many thermal challenges. Inadequate thermal ... -
Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Application Using a Laser Ultrasound Inspection System
(The American Society of Mechanical Engineers (ASME), 2010)Microelectronics packaging technology has evolved from through-hole, and bulk configuration to surface-mount, and small-profile ones. Today’s electronics industry is also transiting from SnPb to ... -
Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture
(The American Society of Mechanical Engineers (ASME), 2010)Integration of different functional components such as level two (L2) cache memory, high-speed I/O interfaces, and memory controller has enhanced microprocessor performance. In this architecture, ... -
Singularities at Solder Joint Interfaces and Their Effects on Fracture Models
(The American Society of Mechanical Engineers (ASME), 2010)In this study, we focus on investigating the nature of the stress and strain behavior in solder joints and their effect on the hybrid damage modeling approach, which is inspired by cohesive ... -
Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis
(The American Society of Mechanical Engineers (ASME), 2010)This paper presents a simulation method to evaluate the thermal fatigue life of a power module. A coupled electrical-thermal analysis was performed to obtain the nonuniform temperature distribution ... -
An Experimental Investigation in the Performance of Water-Filled Silicon Microheat Pipe Arrays
(The American Society of Mechanical Engineers (ASME), 2010)This study details the fabrication and measurements of a water-filled 5 mm wide by 10 mm long silicon microheat pipe (MHP) array consisting of 22–100 μm square channels. This study is unique ... -
Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films
(The American Society of Mechanical Engineers (ASME), 2010)This paper is focused on evaluating the dominant factor for electromigration (EM) in sputtered high purity Al films. A closed-form equation of atomic flux divergence by treating grain boundary ... -
Mechanical Design of Electronic Systems
(The American Society of Mechanical Engineers (ASME), 2010)Mechanical Design of Electronic Systems,. College House Enterprises, LLC, Knoxville, TN, 2008 -
Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly
(The American Society of Mechanical Engineers (ASME), 2010)The thermal efficacy of thermal interface material (TIM) is highly dependent on its ability to adhere to the surfaces of interest. Any delamination of the TIM from the die or the lid will ... -
Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs
(The American Society of Mechanical Engineers (ASME), 2010)Broad societal needs have focused attention on technologies that can effectively dissipate huge amount of heat from high power density electronic devices. Liquid metal cooling, which has been ... -
Interactions Between Flip Chip Underfill and Solder Alloy
(The American Society of Mechanical Engineers (ASME), 2010)The effects of underfill selection on flip chip reliability were always a complex issue. Mechanical optimization of the underfill performance, achieved by the addition of appropriate fillers, is ... -
Study on a Pulsating Heat Pipe With Self-Rewetting Fluid
(The American Society of Mechanical Engineers (ASME), 2010)This paper discusses a pulsating heat pipe (PHP) using a self-rewetting fluid. Unlike other common liquids, self-rewetting fluids have the property that the surface tension increases with ... -
Coordinated Optimization of Cooling and IT Power in Data Centers
(The American Society of Mechanical Engineers (ASME), 2010)Concurrency and exchanging design knowledge among thermal and IT management are required to achieve an energy efficient operational data center. In this paper, a design approach is presented to ... -
Phosphor Concentration Effects on Optothermal Characteristics of Phosphor Converted White Light-Emitting Diodes
(The American Society of Mechanical Engineers (ASME), 2010)The thermal and optical characteristics of phosphor converted white light-emitting diodes (LEDs) with different phosphor concentrations ranging from 4 wt % to 13 wt % are investigated. The light ... -
Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials
(The American Society of Mechanical Engineers (ASME), 2010)As a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due ... -
CFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic Device
(The American Society of Mechanical Engineers (ASME), 2010)Natural convection cooling provides a reliable, cost-effective, energy-efficient and noise-free method to cool electronic equipment. However, the heat transfer coefficient associated with natural ... -
Silver Flip-Chip Technology by Solid-State Bonding
(The American Society of Mechanical Engineers (ASME), 2010)Silver flip-chip joints between silicon (Si) chips and copper (Cu) substrates were fabricated using a solid-state bonding process without any solder and without flux. The bonding process was ... -
Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package
(The American Society of Mechanical Engineers (ASME), 2010)Phenolic and amine epoxy systems are widely used as hardeners in underfill materials for flip chip packaging. A comparison was made between these two systems in order to evaluate the reliability ...