Journal of Electronic Packaging: Recent submissions
Now showing items 781-800 of 2123
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Digital Moiré Subtraction Interferometry (DMS) for Electronics Cooling Applications in Enclosures
(The American Society of Mechanical Engineers (ASME), 2010)Optical noninvasive temperature measurement techniques, such as interferometry, are particularly advantageous in obtaining temperature information noninvasively from enclosed low velocity flows induced ... -
Solid-State Microrefrigeration in Conjunction With Liquid Cooling
(The American Society of Mechanical Engineers (ASME), 2010)Thermal design requirements are mostly driven by the peak temperatures. Reducing or eliminating hot spots could alleviate the design requirement for the whole package. Combination of solid-state ... -
Surface Topographical Characterization of Gold Aluminide Compound for Thermosonic Ball Bonding
(The American Society of Mechanical Engineers (ASME), 2010)Relatively little information is available on the growth patterns of gold aluminide compound in accurate 3D measurement as compared with 2D images of the projected surface. A 3D surface imaging ... -
Thermal Conductivity of Diamond-Containing Grease
(The American Society of Mechanical Engineers (ASME), 2010)As a thermal interface material, thermal grease (TG) has been extensively applied to facilitate heat dissipation in electronic devices. Despite the superior thermal conductivity of diamond, ... -
Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid
(The American Society of Mechanical Engineers (ASME), 2010)Conventional flip chip on board processing involves four major steps: flux application, solder reflow, underfill flow, and underfill cure. The latter two steps are particularly time consuming. ... -
Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV
(The American Society of Mechanical Engineers (ASME), 2010)A high time-resolution measurement of flow field in a glass plate with glass cover with two holes was done by a micro-DHPTV system. The two holes mentioned here were also inside the photo-curable ... -
How to Estimate Heat Spreading Effects in Practice
(The American Society of Mechanical Engineers (ASME), 2010)The nontrivial issues associated with calculating the steady state heat spreading effects generated by a heat source on top of a multilayer assembly such as a printed circuit board are discussed. ... -
Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film
(The American Society of Mechanical Engineers (ASME), 2010)Nonconductive film (NCF) is a challenging potential material to substitute the application of anisotropic conductive film in the ultrafine pitch chip-on-glass (COG) packaging. The NCF interconnection ... -
Multi-Objective Optimization of Thermo-Ultrasonic Flip-Chip Bonding Process for High-Brightness Light Emitting Diodes
(The American Society of Mechanical Engineers (ASME), 2010)Flip-chip bonding is a kind of chip packaging technology, which can make fabricated chips lighter and smaller. Thermo-ultrasonic flip-chip bonding is a technology that directly joins gold pad ... -
Successive Softening and Cyclic Damage in Viscoplastic Material
(The American Society of Mechanical Engineers (ASME), 2010)A successive initiation finite element modeling approach is presented in which an empirical continuum damage model, energy partitioning damage evolution model, developed by the author is used to ... -
Solid-State Refrigeration Based on the Electrocaloric Effect for Electronics Cooling
(The American Society of Mechanical Engineers (ASME), 2010)Subambient temperature operations of advanced semiconductor devices offer many benefits, including improved reliability, reduced leakage currents, and enhanced signal to noise ratios. We discuss a ... -
Application of a Taguchi Method Technique in Determining the Laminating Process Parameters for a Bonding Sheet
(The American Society of Mechanical Engineers (ASME), 2010)This paper investigates the application of a Taguchi method to reduce warpage problem dealing with process parameters during production of bonding sheets. For this purpose, analysis was carried ... -
The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks
(The American Society of Mechanical Engineers (ASME), 2010)A numerical study on the effect of thermal contact resistance and its impact on the performance of finned aluminum foam heat sinks has been conducted. Calculations are based on the solution ... -
Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves
(The American Society of Mechanical Engineers (ASME), 2010)We previously proposed an elastic-plastic-creep model to estimate the fatigue strength of lead-free solder joints subjected to cyclic thermal loading. The proposed model requires detailed experimental ... -
Fast Organic Conditioning of Patterned Surfaces for Capillary Part-to-Substrate Self-Assembly
(The American Society of Mechanical Engineers (ASME), 2010)Selective chemical preconditioning of geometrically patterned substrates and parts is necessary to enable capillary part-to-substrate self-assembly. On the other hand, long preparation procedures may ... -
On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator
(The American Society of Mechanical Engineers (ASME), 2010)A technique for on-line quality detection of ultrasonic wire bonding is developed. The electrical signals from the ultrasonic generator supply, namely, voltage and current, are picked up by a ... -
An Investigation of Flat-Plate Oscillating Heat Pipes
(The American Society of Mechanical Engineers (ASME), 2010)The heat transfer performance of flat-plate oscillating heat pipes (FP-OHPs) was investigated experimentally and theoretically. Two layers of channels were created by machining grooves on both ... -
Determination of Spread Activation Energy and Assessment of Wetting Behavior of Solders on Metallic Substrates
(The American Society of Mechanical Engineers (ASME), 2010)The effects of substrate material, substrate surface roughness, and operating temperature on the wetting behavior of Sn–37Pb, Sn–3.5Ag, and Sn–9Zn eutectic solders on metallic substrates were ... -
Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves
(The American Society of Mechanical Engineers (ASME), 2010)The fatigue life of a material varies with the strain rate if it has time-dependent deformation. An interesting phenomenon related to the effect of the strain rate on the fatigue life can ... -
Chimney Effect on Natural Convection Cooling of a Transistor Mounted on a Cooling Fin
(The American Society of Mechanical Engineers (ASME), 2009)The thermal impedance Zth(jω) has been measured for the junction of a transistor mounted on a cooling fin. The setup was put inside a chimney in order to enhance the natural convection ...