Journal of Electronic Packaging: Recent submissions
Now showing items 801-820 of 2123
-
Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators
(The American Society of Mechanical Engineers (ASME), 2009)In ongoing research at the University of Idaho, potential failure mechanisms of airbag initiators are being investigated. Cracking of the cylindrical glass-to-metal seal (GTMS) present in these ... -
Characterization of Chemical Cure Shrinkage of Epoxy Molding Compound With Application to Warpage Analysis
(The American Society of Mechanical Engineers (ASME), 2009)After encapsulation, thermomechanical deformation builds up within the electronic packages due to the temperature coefficient of expansion mismatch between the respective materials within the package ... -
Thermal Management of Electronic Chips in a Channel Using Input Power to Control Flow Velocity
(The American Society of Mechanical Engineers (ASME), 2009)In this research, thermal management of an electronic device using the input power is investigated numerically using the finite element method. The considered geometry consists of a horizontal ... -
Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading
(The American Society of Mechanical Engineers (ASME), 2009)The use of multilayer ceramic chip capacitors as integrated passive in, e.g., system in package applications needs methods to examine and predict their reliability. Therefore, a nondestructive ... -
Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals
(The American Society of Mechanical Engineers (ASME), 2009)Microelectronics packaging technology has evolved from through-hole and bulk configurations to surface-mount and small-profile configurations. Surface mount devices, such as flip chip packages, chip ... -
Sub-100 μm SnAg Solder Bumping Technology and the Bump Reliability
(The American Society of Mechanical Engineers (ASME), 2009)Lead-free solder bumping and its related interconnection and reliability are becoming one of the important issues in today’s electronic packaging industry. In this paper, alloy electroplating was ... -
Thermal Solution Maps: A Strategy for Thermal Design of Three-Dimensional Packages
(The American Society of Mechanical Engineers (ASME), 2009)Three-dimensional (3D) packages are of considerable interest at the present time as a means for heterogeneous high-performance integration of disparate digital, analog, optical, and MEMS technologies. ... -
Vibration Durability Assessment of Sn3.0Ag0.5Cu and Sn37Pb Solders Under Harmonic Excitation
(The American Society of Mechanical Engineers (ASME), 2009)In this paper, the vibration durability of both SAC305 and Sn37Pb interconnects are investigated with narrow-band harmonic vibration tests conducted at the first natural frequency of the test, ... -
Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer
(The American Society of Mechanical Engineers (ASME), 2009)The generation of thermal stresses is a major cause for mechanical failure in encapsulated electronic components. In this study numerical modeling is employed to analyze thermal stresses in a ... -
Integration of Ta–N Thin Film Resistors on Anodic Alumina MCM-D Substrate
(The American Society of Mechanical Engineers (ASME), 2009)The aim of this work is to evaluate the changes in microstructures and electrical properties of a tantalum nitride (Ta–N) thin film integrated on an aluminum anodization multichip module deposited ... -
Determination of Optimized Rectangular Spreader Thickness for Lower Thermal Spreading Resistance
(The American Society of Mechanical Engineers (ASME), 2009)This study presents an approximation for determining an optimized thickness of a concentric heated rectangular plate and derives an analytical solution for spreading resistance of a spreader ... -
Development of Analytical Model to a Temperature Distribution of a First Level Package With a Nonuniformly Powered Die
(The American Society of Mechanical Engineers (ASME), 2009)Microprocessors continue to grow in capabilities, complexity, and performance. Microprocessors typically integrate functional components such as logic and level two cache memory in their architecture. ... -
Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties
(The American Society of Mechanical Engineers (ASME), 2009)Thermomigration experiments were conducted to study the change in mechanical properties of 95.5Sn–4Ag–0.5Cu (SAC405) lead-free solder joint under high temperature gradients. This paper presents some ... -
Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements
(The American Society of Mechanical Engineers (ASME), 2009)The increased use of mobile appliances such as mobile phones and navigation systems in today’s society has resulted in an increase in reliability issues related to drop performance. Mobile ... -
A General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy Interconnects
(The American Society of Mechanical Engineers (ASME), 2009)The ubiquitous eutectic tin-lead (Sn–Pb) solder alloys are soon to be replaced with lead-free alternatives. In light of this transition, new computational tools for predicting the fatigue life ... -
Measurement and Characterization of the Moisture-Induced Properties of ACF Package
(The American Society of Mechanical Engineers (ASME), 2009)This study is to observe the exact behavior of anisotropic conductive adhesion (ACF) package under humid environments by obtaining the moisture-induced properties such as diffusion coefficient ... -
Fabrication and Bioconjugation of Micro- and Nanoscale Structures Intended for Cancer-Specific Antigen Detection
(The American Society of Mechanical Engineers (ASME), 2009)Cleanroom processes can be used for fabricating microscale and nanoscale structures, and such structures, when bioconjugated, can be used for detecting low levels of cancer-specific circulating ... -
Single-Phase and Two-Phase Hybrid Cooling Schemes for High-Heat-Flux Thermal Management of Defense Electronics
(The American Society of Mechanical Engineers (ASME), 2009)This study examines the cooling performance of two hybrid cooling schemes that capitalize on the merits of both microchannel flow and jet impingement to achieve the high cooling fluxes and ... -
Effect of Variable Heating Load on the Refrigerant Distribution of a Dual Cold-Plate System
(The American Society of Mechanical Engineers (ASME), 2009)This study examines the refrigerant distribution of a dual cold-plate system subject to the influence of heating load, using a R-134a based vapor compression system with a nominal capacity ... -
Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage
(The American Society of Mechanical Engineers (ASME), 2009)The aim of the present work is to study the thermal performance of a hybrid heat sink used for cooling management of protruding substrate-mounted electronic chips. The power generated in ...