Journal of Electronic Packaging: Recent submissions
Now showing items 821-840 of 2123
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Heat Transfer Limitation of a Micro Heat Pipe
(The American Society of Mechanical Engineers (ASME), 2009)An analytical expression for the heat transport capability of micro heat pipe is derived. The vapor continuum limitation has been considered in deriving the heat transport capability of a micro ... -
Influence of Power Cycling Durations on Thermal and Fatigue Reliability Characteristics of Board-Level Chip-Scale Packages
(The American Society of Mechanical Engineers (ASME), 2009)The sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermomechanical deformations, was performed in this work to investigate ... -
Thermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section
(The American Society of Mechanical Engineers (ASME), 2009)A microchannel heat sink shape optimization has been performed using response surface approximation. Three design variables related to microchannel width, depth, and fin width are selected for ... -
Experimental Study of Water Liquid-Vapor Two-Phase Pressure Drop Across an Array of Staggered Micropin-Fins
(The American Society of Mechanical Engineers (ASME), 2009)This study concerns pressure drop of adiabatic water liquid-vapor two-phase flow across an array of 1950 staggered square micropin-fins having a 200×200 μm cross section by 670 μm height. ... -
Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test
(The American Society of Mechanical Engineers (ASME), 2009)This paper proposes a method to estimate basic material constants in an elasto-plastic-creep constitutive model for lead-free solders by conducting only a tensile test. The test employs a stepped ... -
High-Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures by Considering Line Patterns of Three-Dimensional Modules
(The American Society of Mechanical Engineers (ASME), 2009)A novel computational fluid dynamics analysis method of predicting semiconductor junction temperatures precisely without modeling printed circuit board (PCB) line patterns was developed. First, PCBs ... -
Analytical Modeling for Thermodynamic Characterization of Data Center Cooling Systems
(The American Society of Mechanical Engineers (ASME), 2009)The increasingly ubiquitous nature of computer and internet usage in our society has driven advances in semiconductor technology, server packaging, and cluster level optimizations in the IT ... -
Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders
(The American Society of Mechanical Engineers (ASME), 2009)In this paper, soldering experiments of fine pitch quad flat package (QFP) devices were carried out when soldered with Sn–Ag–Cu and Sn–Cu–Ni lead-free solders by means of diode laser soldering ... -
A Novel Projection Moiré System for Measuring PWBA Warpage Using Simulated Optimized Convective Reflow Process
(The American Society of Mechanical Engineers (ASME), 2009)The shadow moiré technique is a widely used method of measuring printed wiring board (PWB) warpage. It has a high resolution, high accuracy, and is suitable for use in an online environment. ... -
Analysis of Heat Transfer Enhancement in Minichannel Heat Sinks With Turbulent Flow Using H2O–Al2O3 Nanofluids
(The American Society of Mechanical Engineers (ASME), 2009)Heat transfer enhancement associated with use of a nanofluid coolant is analyzed for small electronic heat sinks. The analysis is based on the ε-NTU heat exchanger methodology, and is used to ... -
An Overmolded Pressure Sensor Package Using an Ultrathick Photoresist Sacrificial Layer
(The American Society of Mechanical Engineers (ASME), 2009)This study presents a novel technique for an overmolded package of piezoresistive pressure sensors using an ultrathick photoresist sacrificial layer. A 150 μm photoresist block is placed just ... -
Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill
(The American Society of Mechanical Engineers (ASME), 2009)This paper investigates the void formation mechanism induced by chemical interaction between eutectic solder (Sn63/Pb37) wetting and no-flow underfill material curing during flip chip in package ... -
An Engineering Estimate for Plug-Flow Convection in Porous Media Discarding Fluid Conduction
(The American Society of Mechanical Engineers (ASME), 2009)Metal and graphite foam are relatively new types of porous materials characterized by having high-solid phase conductivities. In many cooling applications of these materials, including high-power ... -
Tungsten Carbide as a Diffusion Barrier on Silicon Nitride Active- Metal-Brazed Substrates for Silicon Carbide Power Devices
(The American Society of Mechanical Engineers (ASME), 2009)Recently, silicon nitride (Si3N4) has been receiving renewed attention because of its potential use as a substrate material for packaging of silicon carbide (SiC) power devices for high temperature ... -
Direct De-Ionized Water-Cooled Semiconductor Laser Package for Photodynamic Therapy of Esophageal Carcinoma: Design and Analysis
(The American Society of Mechanical Engineers (ASME), 2009)Effective delivery of the activation light for photodynamic therapy (PDT) of internal organs is a challenge. In this paper, we present a direct de-ionized water-cooling semiconductor laser package ... -
Fluid-to-Fluid Spot-to-Spreader (F2/S2) Hybrid Heat Sink for Integrated Chip-Level and Hot Spot-Level Thermal Management
(The American Society of Mechanical Engineers (ASME), 2009)An innovative heat sink design aimed at meeting both the hot spot and large background heat flux requirements of next generation integrated circuits is presented. The heat sink design utilizes ... -
Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules
(The American Society of Mechanical Engineers (ASME), 2009)Thermal conductance and loss of pressure are among the most relevant parameters based on which a heat exchanger has to be chosen. Starting from this observation this study treated and compared ... -
Modeling Forced Convection in Finned Metal Foam Heat Sinks
(The American Society of Mechanical Engineers (ASME), 2009)A numerical study has been undertaken to explore the details of forced convection heat transfer in finned aluminum foam heat sinks. Calculations are made using a finite-volume computational fluid ... -
Electromigration Reliability of 96.5Sn–3Ag–0.5Cu Flip-Chip Solder Joints With Au/Ni/Cu or Cu Substrate Pad Metallization
(The American Society of Mechanical Engineers (ASME), 2009)Designed experiments were conducted in this paper to study the effect of Au/Ni/Cu or Cu substrate pad metallization on the electromigration reliability of 96.5Sn–3Ag–0.5Cu flip-chip solder joints ... -
Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability
(The American Society of Mechanical Engineers (ASME), 2009)In flip chip packages, it is common practice for interconnects to be encapsulated with a liquid underfill material. This paper describes the effects of different underfill processes, i.e., the ...