Journal of Electronic Packaging: Recent submissions
Now showing items 841-860 of 2123
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In Situ Chip Stress Extractions for LFBGA Packages Through Piezoresistive Sensors
(The American Society of Mechanical Engineers (ASME), 2009)Piezoresistive sensors have been demonstrated to be an accurate and efficient tool for stress measurements on chip surfaces inside microelectronic packaging. In this work, test chips with ... -
Thermal Analysis of Miniature Low Profile Heat Sinks With and Without Fins
(The American Society of Mechanical Engineers (ASME), 2009)Reliable and efficient cooling solutions for portable electronic devices are now at the forefront of research due to consumer demand for manufacturers to downscale existing technologies. To achieve ... -
Effect of Leadframe Oxidation on the Reliability of a Quad Flat No-Lead Package
(The American Society of Mechanical Engineers (ASME), 2009)This study analyzed the reliability of two condition types of copper leadframe, namely, good and oxidized. Both types of leadframe were used in the fabricating process of a quad flat no-lead ... -
Laser-Based Target Preparation in 3D Integrated Electronic Packages
(The American Society of Mechanical Engineers (ASME), 2009)The trend toward 3D integration in electronic packaging requires that failure analysis procedures and target preparation methods are adapted from conventional discrete packages to these emerging ... -
Squeezing Flow of a Power Law Fluid Between Grooved Plates
(The American Society of Mechanical Engineers (ASME), 2009)Surface microchannels can accelerate squeezing flow of a fluid in a thin gap between parallel plates. Using a computational model and restricting attention to power law fluid, a parametric study ... -
Experimental Investigation and Theoretical Model for Subcooled Flow Boiling Pressure Drop in Microchannel Heat Sinks
(The American Society of Mechanical Engineers (ASME), 2009)This study examines the pressure drop characteristics of subcooled two-phase microchannel heat sinks. A new model is proposed, which depicts the subcooled flow as consisting of a homogeneous ... -
Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation
(The American Society of Mechanical Engineers (ASME), 2009)Moisture concentration is discontinuous at interfaces when two materials, which have different saturated moisture concentrations, are joined together. In order to perform moisture diffusion modeling ... -
Multiple Fan-Heat Sink Cooling System With Enhanced Evaporator Base: Design, Modeling, and Experiment
(The American Society of Mechanical Engineers (ASME), 2009)A cooling device using stacked centrifugal fans and circular heat sinks was designed for cooling a semiconductor chip with a heat flux near 125 W/cm2. In this device, heat is conducted from ... -
Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part II: Application to 3D Ultrathin Stacked-Die Chip Scale Packages
(The American Society of Mechanical Engineers (ASME), 2009)In the present study, the direct concentration approach (DCA) and the whole-field vapor pressure model developed in Part I of this work (, 2009 “ Direct Concentration Approach of Moisture ... -
Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates
(The American Society of Mechanical Engineers (ASME), 2009)Behavior of solder joints in microelectronic packages is crucial to the drop impact reliability design of mobile electronic products. In this paper, tensile behaviors of Sn37Pb, Sn3.5Ag, and ... -
The Effect of Intermetallic Growth on Bump Pull Test Responses of SAC105 Solder Bumps
(The American Society of Mechanical Engineers (ASME), 2009)Cold bump pull tests performed on wafer level chip scale packages using SAC105 solder bumps show an increase in the occurrence of brittle failure modes with aging temperature and time. Fast ... -
Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock
(The American Society of Mechanical Engineers (ASME), 2009)The power dissipation for chip-scale atomic clocks (CSAC) is one of the major design considerations. 12 mW of the 30 mW power budget is for temperature control of the vertical-cavity-surface-emitting ... -
Numerical Simulation of Thermal Conductivity of Particle Filled Epoxy Composites
(The American Society of Mechanical Engineers (ASME), 2009)A finite element method was developed to predict the effective thermal conductivity of particle filled epoxy composites. Three-dimensional models, which considered the effect of filler geometry, ... -
Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls
(The American Society of Mechanical Engineers (ASME), 2009)Bumping of microcircuits and substrates establishes interconnect points required for subsequent bonding of microelectronic components, allowing for power and data distribution. Simultaneous ultrasonic ... -
Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film
(The American Society of Mechanical Engineers (ASME), 2009)Nonconductive film (NCF) interconnection technology is now being used for the ultrafine pitch interconnections in chip-on-glass (COG) packaging. In comparison to traditional anisotropic conductive ... -
Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique
(The American Society of Mechanical Engineers (ASME), 2009)This study develops a novel glass cover chip (GCC) technique for the packaging of CMOS image sensors (CIS), in which the glass cover plate is attached directly to the chip using a nonconductive ... -
Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits
(The American Society of Mechanical Engineers (ASME), 2009)Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys, the importance of the load history, and the wide variation in ... -
A Novel Ceramic Packaging Technique Using Selective Induction Heating
(The American Society of Mechanical Engineers (ASME), 2009)A novel ceramic packaging technology by using selective induction heating is presented. Some aspects of this packaging process, including local temperature distribution, hermeticity, tensile strength, ... -
Novel Design of Thermal-Via Configurations for Collector-Up HBTs
(The American Society of Mechanical Engineers (ASME), 2009)We devise a finite-element model to analyze the thermal performance of collector-up (C-up) heterojunction bipolar transistors (HBTs) with a thermal-via configuration. A demonstration on the GaInP/GaAs ... -
Measurement of Leak Rate for MEMS Vacuum Packaging
(The American Society of Mechanical Engineers (ASME), 2009)Many Micro-Electro-Mechanical Systems (MEMS) devices such as accelerators, gyroscopes, uncooled infrared sensors, etc., require vacuum packaging. The vacuum maintaining lifetime directly determines ...