Journal of Electronic Packaging: Recent submissions
Now showing items 861-880 of 2123
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A Modified Flip-Chip LED Packaging Design With Enhanced Light Coupling Efficiency for Plastic Optical Fiber Networks
(The American Society of Mechanical Engineers (ASME), 2009)The explosive growth in the use of the Internet and multimedia applications in both the home and the office has fueled the requirement for high-bandwidth communication systems capable of ... -
The Shear Test as Interface Characterization Tool Applied to the Si-BCB Interface
(The American Society of Mechanical Engineers (ASME), 2009)Electronic packages are multimaterial structures. Their reliability is a major concern for the electronic industry and therefore widely studied. Apart from the electrical performance, the mechanical ... -
Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array Package
(The American Society of Mechanical Engineers (ASME), 2008)Solder joint fatigue failure under vibration loading continues to be a concern in microelectronic industry. Existing literature has not adequately addressed high-cycle fatigue failure of high-lead ... -
Editorial
(The American Society of Mechanical Engineers (ASME), 2008)This issue of the Journal of Electronic Packaging has eight papers selected from the first international conference on thermal issues in emerging technologies theory and applications (ThETA I) ... -
Wiresweep Reduction via Direct Cavity Injection During Encapsulation of Stacked Chip-Scale Packages
(The American Society of Mechanical Engineers (ASME), 2008)As packaging continues to offer challenges with variable stacked die configurations of increasing complexity, traditional transfer mold encapsulation faces challenges in defining a robust process ... -
Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering
(The American Society of Mechanical Engineers (ASME), 2008)Fiber attachment soldering is low cost and high-precision technology in direct-coupling optoelectronic packaging. For accurate alignment, it is crucial to understand the self-alignment behavior of ... -
Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection
(The American Society of Mechanical Engineers (ASME), 2008)In this study, a computational fluid dynamics model has been developed to explain and validate the experimental results originating from the concept of a substrate with an opening. It is found ... -
Damage Initiation and Propagation in Voided Joints: Modeling and Experiment
(The American Society of Mechanical Engineers (ASME), 2008)This study examines damage initiation and propagation in solder joints with voids, under thermomechanical cyclic loading. An accelerated thermal cycling test is conducted on printed wiring assemblies ... -
Boiling of Water at Subatmospheric Conditions With Enhanced Structures: Effect of Liquid Fill Volume
(The American Society of Mechanical Engineers (ASME), 2008)Liquid cooling with phase change has been demonstrated to be a very efficient technique for thermal management of electronics because it has the potential to achieve high heat transfer coefficients ... -
Investigation of Microporous Coatings and Mesoscale Evaporator Enhancements for Two-Phase Cooling of Electronic Components
(The American Society of Mechanical Engineers (ASME), 2008)An empirical study of pool nucleate boiling enhanced with a microporous coating was conducted within the context of microprocessor cooling. A thermal test vehicle (TTV) emulated the heat load ... -
Reliability of Fine Pitch Sn–3.8Ag–0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCB
(The American Society of Mechanical Engineers (ASME), 2008)The reliability of fine pitch Sn–3.8Ag–0.7Cu flip chip solder joints with three different pads, i.e., bare pads, pads with solder masks, and pads with microvia, on printed circuit boards (PCBs) ... -
Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder
(The American Society of Mechanical Engineers (ASME), 2008)A unified creep plasticity damage (UCPD) constitutive model was developed to predict the fatigue of 95.5Sn–3.9Ag–0.6Cu solder joints. Compression, stress-strain and creep properties were generated ... -
Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem
(The American Society of Mechanical Engineers (ASME), 2008)We propose an advanced thermal-moisture analogy scheme to cope with the inherent limitations of the existing analogy schemes. The new scheme is based on the experimentally observed unique ... -
The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method
(The American Society of Mechanical Engineers (ASME), 2008)In this study, the effects of the temperature cyclic loading on three lead-free solder joints of 96.5Sn–3.5Ag, 95.5Sn–3.8Ag-0.7Cu, and 95.5Sn–3.9Ag-0.6Cu bumped wafer level chip scale package ... -
Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects
(The American Society of Mechanical Engineers (ASME), 2008)A general fatigue life prediction methodology, based on a unified creep plasticity damage (UCPD) model, was developed for predicting fatigue cracks in 95.5Sn–3.9Ag–0.6Cu (wt %) solder interconnects. ... -
Board Level Drop Test Analysis Based on Modal Test and Simulation
(The American Society of Mechanical Engineers (ASME), 2008)Solder joint reliability in drop test is crucial for handheld systems, such as mobile phone, digital camera, and MP3 player. In recent years, a lot of experiments and simulations have been ... -
Thermal Conduction Switch for Thermal Management of Chip Scale Atomic Clocks (IMECE2006-14540)
(The American Society of Mechanical Engineers (ASME), 2008)We report the first use of a bimetallic buckling disk as a thermal conduction switch. The disk is used to passively alter the thermal resistance of the package of a chip scale atomic clock. ... -
Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading
(The American Society of Mechanical Engineers (ASME), 2008)A nonlinear finite element modeling (FEM) scheme to analyze the combined effect of thermal and hygroscopic deformation is presented. The scheme employs the conventional moisture diffusion, heat ... -
Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal Load
(The American Society of Mechanical Engineers (ASME), 2008)A plastic ball grid array component interconnect has been experimentally investigated and modeled on the basis of micropolar theory. The experimental results were analyzed, and the data also ... -
Improved Method of CO2 Laser Cutting of Aluminum Nitride
(The American Society of Mechanical Engineers (ASME), 2008)The traditional “evaporation∕melt and blow” mechanism of CO2 laser cutting of aluminum nitride (AlN) chip carriers and heat sinks suffers from energy losses due to its high thermal conductivity, ...