Journal of Electronic Packaging: Recent submissions
Now showing items 881-900 of 2123
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Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging
(The American Society of Mechanical Engineers (ASME), 2008)Multiple parameters are involved in the design of anisotropic conductive adhesive assemblies, and the overlapping influences that they have on the final electrical contact resistance represent a ... -
On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials
(The American Society of Mechanical Engineers (ASME), 2008)The physics explored in this investigation enables short-time scale dynamic phenomenon to be correlated with package failure modes such as solder ball cracking and interlayer debond. It is found ... -
On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion
(The American Society of Mechanical Engineers (ASME), 2008)The demand for higher clock speed and larger current magnitude in high-performance flip chip packaging configurations of small footprint has raised the concern over rapid thermal transients and ... -
A Nonlinear Fracture Mechanics Approach to Modeling Fatigue Crack Growth in Solder Joints
(The American Society of Mechanical Engineers (ASME), 2008)Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys and the importance of the load history. Long experience with Sn–Pb ... -
Studies on Size and Lubricant Effects for Fluidic Self-Assembly of Microparts on Patterned Substrate Using Capillary Effect
(The American Society of Mechanical Engineers (ASME), 2008)Conventional pick-and-place technology platform in handling microscale component assembly processes has technical limitations in terms of capacity, efficiency, and accuracy. The fluidic self-assembly ... -
Integrating Compact Thermal Models in CFD Simulations of Electronic Packages
(The American Society of Mechanical Engineers (ASME), 2008)Compact thermal models (CTMs) are simplified multi-nodal thermal resistor network representations of the detailed material and geometric structure of the electronic package. CTMs predict the thermal ... -
Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review
(The American Society of Mechanical Engineers (ASME), 2008)Electronics packaging design is a process that requires optimized solutions based on multidisciplinary design trade-offs, which usually have complex relationships among multiple design variables. ... -
Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications
(The American Society of Mechanical Engineers (ASME), 2008)In the present work, the potential of using foam structures impregnated with phase change materials (PCMs) as heat sinks for cooling of electronic devices has been numerically studied. Different ... -
Modeling of Resin Flow in Reinforced Dielectric Prepregs
(The American Society of Mechanical Engineers (ASME), 2008)Manufacturing of printed circuit boards or chip-packaging substrates involves the use of resin-filled reinforcement materials, known as prepregs, to bond together laminates with patterned copper ... -
Current Crowding and its Effects on Electromigration and Interfacial Reaction in Lead-Free Solder Joints
(The American Society of Mechanical Engineers (ASME), 2008)The current density distribution in a line-to-bump structure as a function of cross-sectional area ratio of the electrical conductor was investigated, as well as the effects of current crowding ... -
Optimization of Pin-Fin Heat Sinks in Bypass Flow Using Entropy Generation Minimization Method
(The American Society of Mechanical Engineers (ASME), 2008)An entropy generation minimization method is applied to study the thermodynamic losses caused by heat transfer and pressure drop for the fluid in a cylindrical pin-fin heat sink and bypass ... -
Turbulence Modeling of Forced Convection Heat Transfer in Two-Dimensional Ribbed Channels
(The American Society of Mechanical Engineers (ASME), 2008)Although the problem of 2D ribbed channels has been studied heavily in the literature as a benchmark or basic case for cooling of electronic packing, there is still a contradiction in the ... -
Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal Analyses
(The American Society of Mechanical Engineers (ASME), 2008)Solder bump inspection of surface mount packages has been a crucial process in the electronics manufacturing industry. A solder bump inspection system has been developed using laser ultrasound ... -
Analysis of Solderless Press-Fit Interconnections During the Assembly Process
(The American Society of Mechanical Engineers (ASME), 2008)This paper deals with typical mechanical problems that are encountered in a solderless press-fit assembly process. First, the elastic-plastic properties of two types of press-fit pins and the ... -
A Numerical Study of a Heat Sink Fin Under a Laminar Impinging Jet
(The American Society of Mechanical Engineers (ASME), 2008)Impinging jet heat transfer is a promising method to cool electronic components. In this paper, a numerical study has been carried out to examine the conjugate heat transfer under a confined ... -
A Convection/Radiation Temperature Control System for High Power Density Electronic Device Testing
(The American Society of Mechanical Engineers (ASME), 2008)Active control of die-level temperature is required during production testing of high power microprocessors in order to ensure accurate performance classification, but control is becoming more ... -
Thermal Design Methodology for an Embedded Power Electronic Module Using Double-Sided Microchannel Cooling
(The American Society of Mechanical Engineers (ASME), 2008)This paper presents a thermal design methodology for an integrated power electronic module (IPEM) using embedded, single-phase, and laminar-flow rectangular microchannels. Three-dimensional packaging ... -
An Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads
(The American Society of Mechanical Engineers (ASME), 2008)We present an investigation into the effect of the motion of a printed circuit board (PCB) on the response of a microelectromechanical system (MEMS) device to shock loads. A two-degrees-of-freedom ... -
Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach
(The American Society of Mechanical Engineers (ASME), 2008)An analytical model is developed to estimate the heat transfer performance of printed circuit board (PCBs). The PCB under study is the substrate for a ball-grid-array (BGA) package. Under the ... -
Compact Thermal Models: A Global Approach
(The American Society of Mechanical Engineers (ASME), 2008)The construction and usage of compact thermal models (CTMs), for the thermal analysis as well as the design of cooling devices for electronic systems, are reviewed. These models have many ...