Journal of Electronic Packaging: Recent submissions
Now showing items 901-920 of 2123
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Design of Heat Conduction Panel: The Case of Multiple Heating Elements Cooled by a Displaced Heat Sink
(The American Society of Mechanical Engineers (ASME), 2008)This paper reports the design study performed on a heat conduction panel having several heat sources at separate locations and a heat sink on one of the panel corners. The panel is given a ... -
Hierarchal Modeling of Creep Behavior of SnAg Solder Alloys
(The American Society of Mechanical Engineers (ASME), 2008)In this paper, a microstructure-dependent creep model is developed that accounts for the hierarchal microstructure at multiple length scales. The model considers three distinguishable phases in ... -
Underfill Filler Settling Effect on the Die Backside Interfacial Stresses of Flip Chip Packages
(The American Society of Mechanical Engineers (ASME), 2008)Underfill is usually modeled as an isotropic medium containing uniformly distributed filler particles. However, filler particles tend to settle (or segregate) and thus alter the mechanical response ... -
A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element Method
(The American Society of Mechanical Engineers (ASME), 2008)Over upcoming electronics technology nodes, shrinking feature sizes of on-chip interconnects and correspondingly higher current densities are expected to result in higher temperatures due to ... -
A High Precision Experimental Method to Determine Poisson’s Ratios of Encapsulant Gels
(The American Society of Mechanical Engineers (ASME), 2008)A high precision technique for measuring Poisson’s ratios of elastomers was experimentally implemented. Test fixtures consisted of hollow metal cylinders fitted with matching pairs of pressure ... -
Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials
(The American Society of Mechanical Engineers (ASME), 2008)The occurrence of passivation-underfill interfacial delamination is detrimental to the reliability of the flip chip assembly as it can result in the premature cracking of the solder bumps. In ... -
The Thermal Design of a Next Generation Data Center: A Conceptual Exposition
(The American Society of Mechanical Engineers (ASME), 2008)In the near future, electronic cabinets of data centers will house high performance chips with heat fluxes approaching 100 W/cm2 and associated high volumetric heat generation rates. With the ... -
Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation
(The American Society of Mechanical Engineers (ASME), 2008)In this work, a new experimental methodology for analyzing the drop impact response is assessed using a pair of high-speed digital cameras and 3D digital image correlation software. Two different ... -
Steady-State Behavior of a Three-Dimensional Pool-Boiling System
(The American Society of Mechanical Engineers (ASME), 2008)Pool-boiling serves as the physical model problem for electronics cooling by means of phase-change heat-transfer. The key for optimal and reliable cooling capacity is better understanding of the ... -
An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration
(The American Society of Mechanical Engineers (ASME), 2008)Classical refrigeration using vapor compression has been widely applied over the past decades to large-scale industrial systems, with few known applications to the microelectronic cooling field, ... -
Managing Thermal Emergencies in Disk-Based Storage Systems
(The American Society of Mechanical Engineers (ASME), 2008)Thermal-aware design of disk-drives is important because high temperatures can cause reliability problems. Dynamic thermal management (DTM) techniques have been proposed to operate the disk at the ... -
Flip-Chip Interconnect for Coplanar Strip Lines
(The American Society of Mechanical Engineers (ASME), 2008)A flip-chip interconnect configuration with coplanar strip (CPS) lines on printed circuit boards (PCBs) is reported for millimeter-wave applications. For CPS lines, the signal and ground electrodes ... -
Microscale and Nanoscale Thermal Characterization Techniques
(The American Society of Mechanical Engineers (ASME), 2008)Miniaturization of electronic and optoelectronic devices and circuits and increased switching speeds have exasperated localized heating problems. Steady-state and transient characterization of temperature ... -
Optimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin Spaces
(The American Society of Mechanical Engineers (ASME), 2008)A finite element analysis approach is developed and used to efficiently evaluate and optimize the boiling performance of longitudinal rectangular plate fin heat sinks, including the explicit ... -
Electromigration Reliability With Respect to Cu Weight Contents of Sn–Ag–Cu Flip-Chip Solder Joints Under Comparatively Low Current Stressing
(The American Society of Mechanical Engineers (ASME), 2008)This work presents electromigration reliability and patterns of Sn–3Ag–0.5Cu and Sn–3Ag–1.5Cu∕Sn–3Ag–0.5Cu composite flip-chip solder joints with Ti∕Ni(V)∕Cu under bump metallurgy (UBM), bonded on ... -
Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling
(The American Society of Mechanical Engineers (ASME), 2008)Experimental and numerical techniques are employed to assess the thermomechanical behavior of ceramic and organic flip chip packages under power cycling (PC) and accelerated thermal cycling (ATC). ... -
Direct Silver to Copper Bonding Process
(The American Society of Mechanical Engineers (ASME), 2008)A novel process of bonding silver (Ag) foils to copper (Cu) substrates has been developed. This direct bonding method does not use any intermediate layer in between. An important application ... -
Design for Reliability Applied to Packaging of a MOEMS Switch
(The American Society of Mechanical Engineers (ASME), 2008)Microelectromechanical systems (MEMSs) consist of moving mechanical microparts often integrated with electronics and optics that may be used for sensing or actuating purposes. MEMS and micro-opto ... -
A Study of Deformation Mechanism During Nanoindentation Creep in Tin-Based Solder Balls
(The American Society of Mechanical Engineers (ASME), 2007)As the shrinkage and integration of devices, the creep behavior of tin-based alloys becomes important with microscales. In this paper, the behavior of creep deformation in solder alloys during ... -
The Influence of Material Properties and Spreading Resistance in the Thermal Design of Plate Fin Heat Sinks
(The American Society of Mechanical Engineers (ASME), 2007)The thermal design of plate fin heat sinks can benefit from optimization procedures where all design variables are simultaneously prescribed, ensuring the best thermodynamic and air flow ...